Anisotropic angular distribution of sputtered atoms

The sputtering yield angular distributions have been calculated on the basis of the ion energy dependence of total sputtering yields for Ni and Mo targets bombarded by low-energy Hg⁺ ions. The calculated curves show excellent agreement with the corresponding Wehner's experimental results of sputtering yield angular distributions. This fact clearly demonstrates the intrinsic relation between the ion energy dependence of total sputtering yields and the sputtering yield angular distribution. This intrinsic relation had been ignored in Yamamura's papers [Yamamura, Y. (1982). Theory of sputtering and comparison to experimental data, Nucl. Instr. and Meth., 194, 515–522; Yamamura, Y. (1981). Contribution of anisotropic velocity distribution of recoil atoms to sputtering yields and angular distributions of sputtered atoms, Rad. Eff., 55, 49–55.] due to some obvious mistakes.     

Optical characterization and laser damage of fused silica optics after ion beam sputtering

The sputtering process of fused silica bombarded by Ar ion beam is simulated with the SRIM software. The effects of ion beam energy and incident angle on sputtering yield and surface damage are computed. Since ion beam sputtering will result in defects in fused silica, such as E′ color centers and other lattice defects and probably Argon bubbles, the optimized sputtering energy is selected below 1 keV so that the projected range of Ar ions is less than 10 Å. The experimental results show that the scratches in subsurface of fused silica can be smoothed obviously and better surface can be obtained as the optimized parameters are used for ion beam sputtering. The laser induced damage threshold of fused silica increases by about 18% after ion beam sputtering.     

Pt(111)表面低能溅射现象的分子动力学模拟

利用嵌入原子方法的原子间相互作用势，通过分子动力学模拟，详细研究了贵金属原子在Pt (111)表面的低能溅射现象.模拟结果显示：对于垂直入射情况，入射原子的质量对Pt (11 1)表面的溅射阈值影响不大.当入射原子的能量小于溅射阈值时，入射原子基本以沉积为主 ；当入射原子的能量大于溅射阈值时，溅射产额随入射原子能量的增加而线性增大；当入射 原子能量达到200 eV时，各种入射原子的溅射产额都达到或接近1，此时入射原子主要起溅 射作用.溅射原子发射的角分布概率和溅射花样与高能溅射相类似.研究表明：与基于二体碰 撞近似的线性级联溅射理论不同，当入射原子能量大于溅射阈值时，低能入射原子的溅射产 额正比于入射原子的约化能量和入射原子与基体原子的质量比.通过对低能入射原子的钉扎 能力分析，提出了支配低能溅射的入射原子反射物理机理. 关键词： 分子动力学模拟、低能溅射     

Molecular dynamics simulation for the sputtering of an Al2O3 sample bombarded with MeV Si ions

Sputtering yield and kinetic energy distribution (KED) of Al particles from an Al₂O₃ sample bombarded with 1－5 MeV Si ions have been simulated using the molecular dynamics method. These have also been measured experimentally with a conventional time-of-flight facility. In the simulation, a new interatomic potential specific to the Al₂O₃ target was developed, and both the nuclear energy loss S_n and electronic energy loss S_e were taken into consideration. By carefully adjusting the simulation parameters, the simulated sputtering yields fit well with the experimental results, and the simulated KED of Al particles also fits roughly with the experimental KED after being modified theoretically.     

Molecular dynamic simulation of secondary ion emission from an Al sample bombarded with MeV heavy ions

Spluttering yields and kinetic energy distributions (KED) of Al atomic ions ejected from a pure aluminium sample under MeV silicon ion bombardment were simulated with the molecular dynamic method.Since the electronic energy loss Se is much higher than the nuclear energy loss Sn when the incident ion energy is as high as several MeV,the Se effect was also taken into consideration in the simulation.It was found that the simulated sputtering yield fits well with the experimental data and the electronic energy loss has a slight effect at incident ion energies higher than 4MeV.The simulated secondary ion KED spectrum is a little lower in the peak energy and narrower in the peak width than that in the experiment.     

Early stage in low energy ion-induced damage on InP(110) surface

The change in the short-range order created by ion milling in the near surface region of InP single crystals was investigated by primary beam diffraction modulated electron emission (PDMEE). The very early stage of the damage creation by low energy (0.6–1 keV) Ar ions in normal and oblique incidence was studied. A simple model based on the weighted combination of perfectly crystalline and completely amorphous regions was used to model the experimental results. Evidence of a subsurface nucleation of the amorphization process was found. We also found that the total sputtering yield is markedly dependent on the ion dose, being on the undamaged surface much larger than its steady state value. Low energy electron diffraction (LEED) measurements were also performed to correlate long-range and short-range order removal by ion bombardment. Finally, the ion damage on the GaAs and InP surfaces was comparatively discussed.     

高电荷态离子与Si(110)晶面碰撞的沟道效应研究

不同电荷态低速离子(Ar^q+,Pb^q+)轰击Si(110)晶面,测量不同入射角情况下的次级粒子的产额. 通过比较溅射产额与入射角的关系,证实沟道效应的存在. 高电荷态离子与Si相互作用产生的沟道效应说明溅射产额主要是由动能碰撞引起的. 在小角入射条件下,高电荷态离子能够增大溅射产额. 当高电荷态离子以40°—50°入射时,存在势能越高溅射产额越大的势能效应. 关键词： 高电荷态离子 溅射 沟道效应     

低能Pt原子与Pt(111)表面相互作用的分子动力学模拟

利用分子动力学模拟方法详细研究了低能Pt原子与Pt(111)表面的相互作用所导致的表面吸附原子、溅射原子、表面空位的产生及分布规律,给出了表面吸附原子产额、溅射原子产额和表面空位产额随入射Pt原子能量的变化关系.模拟结果显示:溅射产额、表面吸附原子产额和表面空位产额随入射原子的能量的增加而增加,溅射原子、表面吸附原子的分布花样呈3度旋转对称性质;当入射粒子能量高于溅射阈值时,表面吸附原子主要是基体最表面原子的贡献,入射粒子直接成为表面吸附原子的概率很小.其主要原因是:当入射粒子能量高于溅射能量阈值时,入射 关键词： 分子动力学 低能粒子 表面原子产额 空位缺陷 溅射     

Some of the current trends in the studies of sputtering

Abstract

The main directions in experimental, theoretical and computer studies of sputtering of solids under ion bombardment are analyzed. It is emphasized that there is a close relation between these studies and practical applications of sputtering.     

ADATOM, VACANCY AND SPUTTERING YIELDS OF ENERGETIC Pt ATOMS IMPACTING ON Pt(100) BY MOLECULAR DYNAMICS SIMULATION

We have studied the influence of incident atoms with low energy on the Pt(100) surface by molecular dynamics simulation. The interaction potential obtained by the embedded atom method (EAM) was used in the simulation. The incident energy changes from 0.1eV to 200eV, and the target temperature ranges from 100 to 500 K. The target scales are 6×6×4 and 8×8×4 fcc cells for lower and higher incident energies, respectively. The adatom, sputtering, vacancy and backscattering yields are calculated. It was found that there is a sputtering threshold for the incident energy. When the incident energy is higher than the sputtering threshold, the sputtering yield increases with the increase of incident energy, and the sputtering shows a symmetrical pattern. We found that the adatom and vacancy yields increase as the incident energy increases. The vacancy yields are much higher than those obtained by Monte Carlo simulation. The dependence of the adatom and sputtering yields on the incident energy and the relative atomistic mechanisms are discussed.