M-integral analysis for a two-dimensional metal/ceramic bimaterial solid with extending subinterface microcracks

Summary  The problem of the extension of subinterface microcracks in an infinite metal/ceramic bimaterial solid is studied. For the microcrack growth, the values of the M-integral are calculated under the assumption of a self-similar growth. First, the role that the M-integral plays in a metal/ceramic bimaterial solid with growing subinterface cracks is analyzed. It is concluded that an inherent relation exists between the value of the M-integral and the decrease of the effective elastic moduli for a bimaterial solid with growing subinterface microcracks. Second, it is concluded that mutual amplification and shielding effects exist during the microcrack extension, while they are substantially dependent on the increment of the microcrack length as well as the geometry of the microcrack arrangement under given loads. This strong mutual shielding effect of interacting microcracks makes the microcrack extension become increasingly difficult, and may stop the growth of the microcracks even under constant loads. Also, it is concluded that for a certain microcrack growth, the value of the M-integral in metal/ceramic bimaterial solid is always larger than that in homogeneous brittle solid for the same crack configuration. This means that the same microcrack growth in the former case shows lower stability than that in the latter one, due to the existence of a ductile phase. Received 3 May 2001; accepted for publication 27 June 2002 This work was supported by the Chinese National Nature Science Foundation (Grant 19472053) and supported by the Doctorate Foundation of Xi'an Jiaotong University (Grant DFXJU2000-15).     

Interaction between an interface crack and subinterface microcracks in metal/piezoelectric bimaterials

The J-integral analysis is presented for the interaction problem between a semi-infinite interface crack and subinterface matrix microcracks in dissimilar anisotropic materials. After deriving the fundamental solutions for an interface crack subjected to different loads and the fundamental solutions for an edge dislocation beneath the interface, the interaction problem is deduced to a system of singular integral equations with the aid of a superimposing technique. The integral equations are then solved numerically and a conservation law among three values of the J-integral is presented, which are induced from the interface crack tip, the microcracks and the remote field, respectively. The conservation law not only provides a necessary condition to confirm the numerical results derived, but also reveals that the microcrack shielding effect in such materials could be considered as a redistribution of the remote J-integral. It is this redistribution that does lead to the phenomenological shielding effect.     

Intensity factors for subinterface cracks in dissimilar anisotropic piezoelectric media

Summary A subinterface crack paralleling an interface between two dissimilar piezoelectric solids is considered. When the distance between the interface and the crack is small compared to all other in-plane lengths, the problem can be analyzed as an asymptotic problem for a semi-infinite crack lying at some distance away from the interface. An integral equation for the asymptotic subinterface crack is derived, and a solution of the integral equation for small-generalized Dundurs parameters is obtained. Relations between the intensity factors for the subinterface crack and interface intensity factors of the corresponding interface crack are obtained for a conducting crack as well as for an insulating one.This work was supported by the Brain Korea 21 Project in 2000.     

Further investigation of subinterface cracks

Summary Further investigation of subinterface cracks in bimaterial solids is presented. The traction method is proposed permitting easy calculation of the stress intensity factors of the cracks. The elastic T-terms of the cracks are determined. The J ₁ and J ₂ integrals are analyzed for a contour enclosing all the cracks in the global coordinate system x,y, where the x-axis is parallel to the interface. Numerical examples are given, and the results are presented for two kinds of material combinations, Cu/Al₂O₃ and Ni/MgO. Accepted for publication 24 November 1996     

Dependence of stress intensity factors on elastic constants for cracks in an orthotropic bimaterial with a thin film

An interface crack and a subinterface crack in an orthotropic bimaterial structure consisting of a thin film and a half plane substrate are analyzed. The orthotropic bimaterial structure is subjected to compressive load and bending moment per unit thickness. Complete expressions of stress intensity factors for the two cracks are obtained based on the path independence of the J integral, apart from one dimensionless parameter undetermined each. The dependence of the dimensionless parameters on material constants is examined. A reduction of the number of necessary material parameters for the parameters is made based upon the modified Stroh formalism. The explicit dependence of the dimensionless parameters on one orthotropic parameter for the film is determined by using the orthotropy rescaling technique. Variations of the dimensionless parameters with the other material parameters are also obtained through numerical computations.     

界面裂纹问题中的弹性T项和应力强度因子

研究两相材料有限板含单边界面裂纹的断裂力学特性，对不同的材料组合用广义变分法分析了不同尺寸试件和裂纹长度下的应力强度因子和弹性T项，讨论了材料特性对应力强度因子和弹性T项的作用．分析了试件尺寸和裂纹长度对应力强度因子和弹性T项的影响．     

双材料界面裂纹的改进广义有限差分法

采用数值方法进行断裂力学分析时,裂纹尖端奇异区域处理的好坏直接关系到最终断裂力学参数的求解精度。与传统均匀介质不同,复合材料界面裂纹渐近位移和应力场表现出剧烈的振荡特性,许多用于表征经典的平方根和负平方根物理场渐近性的传统方法也因此失效。论文提出了一种改进的广义有限差分法,该方法基于多元函数泰勒级数展开和移动最小二乘法的思想,将节点变量的各阶导数由相邻点集函数的加权线性累加来近似,具有无网格、无数值积分、数据准备简单、稀疏矩阵快速求解等优点。为提高该方法求解断裂力学问题的计算精度和数值稳定性,论文引入了裂尖奇异区域局部点簇的自动创建技术和一种基于局部点簇几何尺寸的矩阵正则化算法。数值算例表明,所提算法稳定,效率高,在不增加计算量的前提下,显著提高了裂尖近场力学参量和断裂力学参数的求解精度和数值稳定性。     

Further investigation of interaction between interface macrocrack and parallel microcracks in bimaterial anisotropic solids

In this paper, with the aid of superimposing technique and the Pseudo Traction Method (PTM), the interaction problem between an interface macrocrack and parallel microcracks in the process zone in bimaterial anisotropic solids is reduced to a system of integral equations. After the integral equations are solved numerically, a conservation law among three kinds ofJ-integrals is obtained which are induced from the interface macrocrack tip, the microcrack and the remote field, respectively. This conservation law reveals that the microcrack shielding effect in such materials could be considered as the redistribution of the remoteJ-integral. The project supported by the National Natural Science Foundation of China, and the Doctorate Foundation of Xi'an Jiaotong University     

界面下主微裂纹间干涉的研究

涉及两相正交各向异性体界面干涉问题的研究,多裂纹问题被分解为只含单裂纹的子问题,利用位错理论和裂面应力自由条件,列出一组可数值求解位错密度函数的奇异积分方程,从耐 注得应力强度因子。     

有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

Subinterface crack in an anisotropic piezoelectric bimaterial

In this paper, the problem of a subinterface crack in an anisotropic piezoelectric bimaterial is analyzed. A system of singular integral equations is formulated for general anisotropic piezoelectric bimaterial with kernel functions expressed in complex form. For commonly used transversely isotropic piezoelectric materials, the kernel functions are given in real forms. By considering special properties of one of the bimaterial, various real kernel functions for half-plane problems with mechanical traction-free or displacement-fixed boundary conditions combined with different electric boundary conditions are obtained. Investigations of half-plane piezoelectric solids show that, particularly for the mechanical traction-free problem, the evaluations of the mechanical stress intensity factors (electric displacement intensity factor) under mechanical loadings (electric displacement loading) for coupled mechanical and electric problems may be evaluated directly by considering the corresponding decoupled elastic (electric) problem irrespective of what electric boundary condition is applied on the boundary. However, for the piezoelectric bimaterial problem, purely elastic bimaterial analysis or purely electric bimaterial analysis is inadequate for the determination of the generalized stress intensity factors. Instead, both elastic and electric properties of the bimaterial’s constants should be simultaneously taken into account for better accuracy of the generalized stress intensity factors.     

反平面剪切作用下双材料滑动界面的细观力学模型

非理想粘结界面对多相材料力学性能具有重要影响。对于双材料间含众多随机分布微裂纹的界面，宏观上可以等效为连续损伤的弱界面，其两侧的面力连续而位移有间断。只有切线方向的位移间断，而法线方向位移连续的弱界面称之为滑动界面。在反平面剪切的作用下，我们证明了对于含有随机分布微裂纹的弹性双材料界面在宏观上等效为线弹簧型滑动界面，并获得了滑动界面柔度的一般表达式。利用Mori—Tanaka方法和广义自洽方法，我们研究了滑动界面柔度系数和微裂纹密度的关系。对这两种方法所得的结果进行比较发现，Mori—Tanaka方法得到的界面柔度比广义自洽方法得到的界面柔度大。当裂纹密度比较小时，这两种方法求得的界面柔度很接近。两种方法的结果都表明，界面柔度随裂纹密度的增加而增加。Mori—Tanaka方法比广义自治方法求解更为简便。     

Boundary Integral Analysis of the Symmetric Dynamic Problem for an Infinite Bimaterial Solid with an Embedded Crack

The symmetric frequency domain problem for two ideally bonded elastic half-spaces with a perpendicular plane crack is considered. It is reduced to the boundary integral equation (BIE) with integration over the limited crack region. The contact conditions on the bimaterial interface are satisfied identically in the initial stage of obtaining the equation. After boundary element solution of the equation, the stress concentration in the vicinity of a penny-shaped crack under time-harmonic loading of constant amplitude is studied. The mode I stress intensity factors as functions of angular coordinate of a crack front point and wave number for various relations between the material parameters are computed. The crack depth relative to the bimaterial interface is determined, when the effect of the material dissimilarity on the crack can be neglected.     

A domain independent integral expression for the crack extension force of a curved crack in three dimensions

An integral expression that is domain independent in curvilinear coordinates and compatible with zero divergence of Eshelby's (Phil. Trans. Roy. Soc. (London) 244 (1951) 87.) energy momentum tensor was obtained from the principle of virtual work. By applying Eshelby's definition of the force on a material defect a general expression of the crack extension force for a curved crack in three dimensions, here called the F-integral, was derived from the domain independent integral expression. The F-integral is given explicitly for a number of curved cracks and found to be in agreement with previously known solutions, when available. The influence of crack surface and crack front curvature upon the various forms of the F-integral is discussed. The F-integral presented in this work is a generalisation of the J-integral (Rice, J. Appl. Mech. 35 (1968) 379.) to curved cracks in orthogonal curvilinear coordinates.     

A semi-infinite interface crack interacting with subinterface matrix cracks in dissimilar anisotropic materials. II. Numerical results and discussion

Based on the investigation performed in Part I of this series, numerical results for the interaction between a semi-infinite interface crack and multiple subinterface matrix microcracks in three kinds of material combinations are given in Part II. The major interaction behaviors are discussed in detail. Special attention is focused on the influences of the different material combinations, the T-stress, the orientation angles, and the location angles of the microcracks on the local stress intensity factor at the interface crack tip. In addition, the variable tendencies of the interaction effect induced from change of the distance between the interface crack tip and the centers of the microcracks are studied. It is concluded that the different material combinations introduced in this paper have little influence on the variable tendencies of the effect, but have significant influence on the effect in magnitude. Detailed comparisons of the results with those in a homogeneous orthotropic material show that the dissimilar materials shift the maximum amplification angle, the maximum shielding angle, the neutral shielding angle, and the neutral T-stress angle, respectively.     

双材料界面裂纹复应力强度因子的正则化边界元法

双材料界面裂纹渐近位移和应力场表现出剧烈的振荡特性, 许多用于表征经典平方根($r^{1/2})$和负平方根($r^{-1/2})$渐近物理场的传统数值方法失效, 给界面裂纹复应力强度因子($K_{1} +{i}K_{2} )$的精确求解增加了难度. 引入一种含有复振荡因子的新型"特殊裂尖单元", 可精确表征裂纹尖端渐近位移和应力场的振荡特性, 在避免裂尖区域高密度网格剖分的情况下, 可实现双材料界面裂纹复应力强度因子的精确求解. 此外, 结合边界元法中计算近奇异积分的正则化算法, 成功求解了大尺寸比(超薄)双材料界面裂纹的断裂力学参数. 数值算例表明, 所提算法稳定, 效率高, 在不增加计算量的前提下, 显著提高了裂尖近场力学参量和断裂力学参数的求解精度和数值稳定性.      

界面微裂纹屏蔽J_k矢量投影守恒

用理论推导和电算实践证明，尽管两相材料界面裂纹Ｊ积分的显函数表达式与均质材料中不同，尽管界面裂纹尖端固有的 １／２＋ｉε振荡奇异性和张开滑移型固有的耦合造成近尖区应力场分布的复杂性，但作者在均质材料微裂纹屏蔽问题中发现的Ｊ积分再分配关系 Ｊｋ矢量投影守恒定理在两相材料界面微裂纹屏蔽问题中仍然成立．这再次说明，远场Ｊ积分向界面裂纹尖端传递过程中跨越微裂纹群是有损失的．这个损失可用Ｊｋ矢量在界面裂纹延线坐标轴上的投影来定量地评估     

Thermal fracture of a functionally graded/homogeneous bimaterial with system of cracks

The thermal fracture of a bimaterial consisting of a homogeneous material and a functionally graded material (FGM) with a system of internal cracks and an interface crack is investigated. The bimaterial is subjected to a heat flux. The thermal properties of FGM are assumed to be continues functions of the thickness coordinate, while the elastic properties are constants. The method of the solution is based on the singular integral equations. For a special case where the interface crack is much larger than the internal cracks in the FGM the asymptotic analytical solution of the problem is obtained as series in a small parameter (the ratio between sizes of the internal and interface crack) and the thermal stress intensity factors (TSIFs) are derived as functions of geometry of the problem and material characteristics. A parametric analysis of the effects of the location and orientation of the cracks and of the inhomogeneity parameter of FGM’s thermal conductivity on the TSIFs is performed. The results are applicable to such kinds FGMs as ceramic/ceramic FGMs, e.g., TiC/SiC, MoSi₂/Al₂O₃ and MoSi₂/SiC, and also some ceramic/metal FGMs.     

Global and local approaches to fracture normal to interfaces

The problem of a crack perpendicularly approaching a bimaterial interface is examined using both global and localapproaches to fracture. The global approach is based on the J-integral with a second parameter, Q, which scales the stress triaxiality ahead of the crack. The local approach is based on either brittle fracture(Beremin model ) or ductile fracture (Rice and Tracey model ). In the first case, the Weibull stress over the plasticzone is calculated. In the second case, the void growth rate is calculated at the tip of the crack over a representativevolume (generally associated with a characteristic length of the material ). After a brief summary of each approach,the results for a crack near an elastically homogeneous, plastically mismatched interface are presented. Thebehaviour of the bimaterial is expressed in relation to the behavior of the homogeneous material. It is shown thatthere is an effect on the crack behavior which depends on the direction of crack propagation, i.e. from the hardermaterial to the softer material or vice versa. This effect is examined as a function of change in yield strength ratioand hardening exponent, n. For the case of brittle fracture, the effect of changing the Weibull modulus, m, is also examined. The models based on the local approach show that both stress- and strain-controlledfracture mechanisms must be accounted for. This implies the necessity of using the two parameters J and Q in the global approach. This is due to the fact that the stress–strain fields ahead of the crack tip areaffected by the nature of the second material.     

Quasi-static and dynamic crack growth along bimaterial interfaces: A note on crack-tip field measurements using coherent gradient sensing

The paper presents a preliminary experimental investigation of crack-tip deformation fields near quasistatically and dynamically growing cracks in bimaterial interfaces. A three-point-bend bimaterial specimen with a relatively large stiffness mismatch between the two materials is studied. A recently developed optical method of coherent gradient sensing (CGS) is used to map crack-tip deformation fields.The quasi-static measurements are interpreted using plane-stress, singular-field solution for the interface crack tip. Results are compared with two-dimensional finite-element computations performed on identical specimen geometries and material mismatch.³² Impact studies conducted with bimaterial specimens provide the first experimental results of deformation fields near dynamically growing cracks along interfaces. Very high crack velocities, up to 80 percent of the Rayleigh wave speed for the less stiffer material of the two, are observed.