Stress analysis at the interface between Ni-P coating and SiCp/Al substrate of space mirror

This paper investigates the mechanical properties at the interface of the coating-substrate system, which comprises the electroless nickel-phosphorus (Ni-P) coating and the aluminum matrix composite substrate reinforced by the silicon carbide particles (SiC_p/Al), and is used for the space mirror. To estimate the adhesion of Ni-P coating on SiC_p/Al substrate, the scratch adhesion testing has been performed by drawing a spherically tipped diamond indenter with a radius of 200 μm over the coated surface. The influence of the coating thickness on the interfacial stress induced by the inertial accelerations, temperature gradients and thermal soaks has been evaluated by simulation analysis based on the finite element method. The results of the scratch testing indicate that the adhesion strength of Ni-P coating to SiC_p/Al composite is more than 3.0 GPa. Compared the maximum value of the interfacial stress obtained by simulation analysis with results of the scratch testing, it is can be seen that the mirror has enough safety margin. Furthermore, the most significant conclusion that can be drawn from this work is that the coating thickness should not exceed 45 μm in order to ensure the performance and reliability of Ni-P coating and SiC_p/Al substrate system for space applications.     

Electroless plating of copper on surface-modified glass substrate

This work focuses on developing a novel convenient method for electroless copper deposition on glass material. This method is relied on the formation of amino (NH₂)-terminated film on the surface of glass substrate, by coating polyethylenimine (PEI) on glass matrix and using epichlorohydrin (ECH) as cross-linking agent. The introduced amino groups can effectively adsorb the palladium, the catalysts which could initiate the subsequent Cu electroless plating, onto the glass substrate surface. Finally, a copper film is formed on the palladium-activated glass substrate through copper electroless plating and the surface-coppered glass material is therefore acquired. X-ray diffraction (XRD), atomic force microscope (AFM), scanning electron microscopy (SEM) images combined with energy diffraction X-ray (EDX) analysis demonstrate the successful copper deposition on the surface of glass substrate.     

Qualitative electroless Ni/Au plating considerations for the solder mask on top of sequential build-up layers

Advanced printed circuit boards (PCBs) with sequential build-up (SBU) layers require alternating dielectric and copper layers on top of a core substrate. This can be achieved by lamination of resin coated copper (RCC) or by coating of dielectric polymers followed by copper deposition. The plating of electroless Ni/Au used as a solderability preservative on top of sequential build-up layers is investigated. For this application a solder mask polymer has to be applied in order to separate solder pads. Experiments showed that on parts of the underlying build-up layer exposed to the electroless Ni plating solution electroless Ni can grow. This overplating is caused by the remains of colloidal Pd/Sn catalyst on top of the build-up layer from preceding electroless Cu deposition. At very small features skipping of the plating can also take place. The overplating and skipping phenomena are influenced by a number of parameters, such as the temperature, the concentration of the stabilizer and pH. The dimensions of features on the board and the thickness of the solder-mask polymer also influence skipping. Based on qualitative analyses of the skipping and overplating phenomena rules of thumb for the solder mask design based on the plating conditions are proposed.     

Diffusion research between Ni3Al coating and titanium alloy produced by plasma spraying process

A Ni₃Al coating was prepared by plasma spraying technique on the surface of titanium alloy. Ni-Al mixed powders, coatings and reaction products were investigated by scanning electron microscope, EDS, DSC and XRD. A tight bonding between the coating and the substrate was formed. The X-ray diffraction analysis of the patterns showed that the coating not only had Ni₃Al phase, but also had NiO and Al₂O₃ phase microcontent. Comparing Ni coated Al to Ni₃Al at 900 °C, the diffusion was stronger and the diffusion layer was thicker. A minute pore structure was formed at 1200 °C in the front edge of solid-state reaction layer. So Ni₃Al restrained the solid-state reaction of the coating with the substrate, and as a whole weakened the entry of oxygen atoms into the substrate and quenched the out-diffusion of titanium.     

ZrO2-reinforced Ni-P plate: An effective catalytic surface for hydrogen evolution

Nickel and its alloys have recently been emerged as potential catalytic electrode materials for hydrogen evolution reaction in alkaline media. The present work contemplates reinforcement of electroless Ni-P plate with ZrO₂. The plate showed very high stability and excellent electrocatalytic activity. In situ incorporation of ZrO₂ resulted in increase in the rate of deposition of Ni on steel substrate. There was high activation during the initial stage of the plating also. The electrocatalytic activity of the ZrO₂-reinforced Ni electroless plate was found to be highly reproducible and long lasting when used for hydrogen evolution reaction.     

Highly adhesive metal plating on Zylon fiber via iodine pretreatment

Highly adhesive metal plating was performed on poly(p-phenylene-2,6-benzobisoxazole) fiber named Zylon^® via iodine pretreatment followed by electroless plating. First, iodine components were selectively doped into the inner part of the fiber near the surface through iodine vapor exposure. The doped iodine was converted to palladium iodide particles by treating with palladium chloride solution. After the reduction of the iodide to metal palladium particles, electroless copper plating was conducted on the fiber. A uniform copper layer was deposited on the fiber surface and exhibited high durability in durability tests such as ultrasonic exposure, tape peeling-off, and corrosion in NaCl solution. This durability was attributed to the palladium particles formed at the fiber surface that served as an anchor for the plated layer as well as an electroless plating catalyst. The plated fibers also possessed electrical conductivity. Although the tensile strength of the Zylon^® fiber decreased from 5.8 to 4.9 GPa after undergoing the pretreatment and plating processes, the light shielding effect improved the light resistance of the plated fibers in terms of tensile properties. After 18 days of xenon lamp exposure, the plated fibers retained 74% of its initial strength, whereas that of untreated fibers decreased to 43%.     

Silver nanocombs and branched nanowires formation in aqueous binary surfactants solution

The field emission characteristics of patterned carbon nanotubes (CNTs) the average diameter of which is 16?nm cathodes on substrates with different surface treatments were investigated. The surface treatments of the substrate were performed by nickel electroless plating and palladium coating, which is an activation procedure of electroless plating. CNTs were patterned on the surface-treated substrate with radius of 200???m through conventional photolithography process. Two deposition methods, electrophoresis deposition and spray deposition, were used to investigate the effects of deposition methods on field emission characteristics of the cathodes. It was revealed that the two deposition methods showed similar turn-on field trends, which means that the different surface morphologies of the substrates have more influence on the field emission characteristics than the different deposition methods performed in this study. Through the surface treatments, the roughness of the surface increased and cathodes with a high roughness factor showed better field emission characteristics compared to non-treated ones.     

Ni/Pb(Zr,Ti)O3/TbFe2层状复合材料的谐振磁电特性研究

采用化学镀和黏接法制备层状磁电复合材料Ni/PZT/TbFe₂,研究其磁电性能及谐振频率随Ni层厚度的变化情况. 结果表明:Ni/PZT/TbFe₂层状磁电复合材料与其他结构的磁电性能不同,其一阶弯曲谐振峰值和纵向谐振峰值都很大. 随着Ni层厚度的增加,Ni/PZT/TbFe₂层状磁电复合材料的一阶纵向谐振峰值逐渐增大. 结合实验数据和理论计算值得出了材料的一阶弯曲谐振频率fr1和一阶纵向谐振频率f 关键词： 磁电效应 正磁致伸缩 负磁致伸缩 谐振频率     

Fabrication and characterization of a Cu seed layer on a 60-nm trench-patterned SiO2 substrate by a self-assembled-monolayer (SAM) process

Continuous electroless deposition of a 10-nm thick layer of Cu was successfully performed on a SiO₂/Si substrate coated with a 3-nm Au catalytic layer. The Au catalytic layer was formed by a self-assembled monolayer (SAM) process terminated with NH₂ headgroups, upon which negatively charged Au particles were deposited via electrostatic interaction with the positively charged NH₂-SAM. The Au and NH₂-SAM layers were analyzed by X-ray photoelectron spectroscopy (XPS) and contact angle analysis. Atomic force microscopy, field emission scanning electron microscopy, and XPS revealed that the Cu layer formed by this electroless processes had good step-coverage, small grain size, and excellent adhesion to the substrate. The proposed process is a very promising method for fabrication of a conductive Cu seed layer in a 60-nm trench-pattern.     

Microstructure and electromagnetic characteristics of BaTiO3/Ni hybrid particles prepared by electroless plating

To improve the microwave absorption ability, hybrid particles containing both dielectric loss of BaTiO₃ and magnetic loss of Ni were fabricated via electroless Ni plating on BaTiO₃ particles. A continuous Ni coating was successfully covered on the surface of the BaTiO₃. The effect of the Ni content on complex permittivity, complex permeability, and microwave absorption properties of BaTiO₃/Ni hybrid particles was investigated. The real (?′) and imaginary (?″) parts of complex permittivity as well as imaginary part of complex permeability (μ″) were found to increase with an increase in Ni content, while the variation of the real part of complex permeability (μ′) with Ni content was non-linear. The microwave absorption performances could readily be tuned base on the changing Ni content of the hybrid particles. The optimal absorption performances were attained when the content of Ni reached 38.9 wt% in hybrid particles.     

Surface functionalization of porous ZrO2-TiO2 membranes using γ-aminopropyltriethoxysilane in palladium electroless deposition

A pre-treatment technique was developed to facilitate the electroless deposition of Pd layers onto ZrO₂-TiO₂ ceramic membrane surfaces in the preparation of novel multi-functional porous membranes. Surface functionalization using an aqueous solution of γ-aminopropyltriethoxysilane (γ-APTES) aided the surface immobilization of the Pd activation particles and the subsequent electroless deposition of metal layers onto the hydroxyl-rich membrane surface. The attractiveness of γ-APTES functionalization, in the electroless deposition of metal layers, was thus demonstrated. Characterization techniques employed in the structural study of the surface-modified membranes included SEM, EDS, dynamic analysis in micro-PIXE, and XRD. Special membrane techniques such as electrokinetic analysis and single-gas permeation measurements were also used in the study of surface modification. These membranes were developed for application in tasks associated with the hydrogen economy.     

Theoretical study of CO and Pb adsorption on the Ni(1 1 1) and Ni3Al(1 1 1) surfaces

Adsorption of CO molecules and Pb atoms on the Ni(1 1 1) and Ni₃Al(1 1 1) substrates is studied theoretically within an ab initio density-functional-theory approach. Stable adsorption sites and the corresponding adsorption energies are first determined for stoichiometric surfaces. The three-fold hollow sites (fcc for Pb and hcp for CO) are found most favourable on both substrates. Next, the effect of surface alloying by a substitution of selected topmost substrate atoms by Pb or Ni atoms on the adsorption characteristics is investigated. When the surface Al atoms of the Ni₃Al(1 1 1) substrate are replaced by Ni atoms, the Pb and CO adsorption energies approach those for a pure Ni(1 1 1) substrate. The Pb alloying has a more substantial effect. On the Ni₃Al(1 1 1) substrate, it reduces considerably adsorption energy of CO. On the Ni(1 1 1) substrate, CO binding strengthens slightly upon the formation of the Ni(1 1 1)p(2×2)-Pb surface alloy, whereas it weakens drastically when the Ni(1 1 1)-Pb surface alloy is formed.     

石英光纤的金属镍锡涂敷工艺研究

为了实现石英光纤传感器的无胶金属化封装,需要在光纤表面涂敷金属层。先利用化学镀方法在石英光纤表面镀镍层,再利用电镀工艺电镀锡层,从而获得表面光亮、均匀、附着牢固、可焊性好的金属涂敷层。实验中研究了敏化、活化工艺对镀层的影响并提出一种效果较好的敏化活化方法。给出了石英光纤表面化学镀镍的最佳工艺条件。     

Effect of nickel on the initial growth behavior of electroless Ni-Co-P alloy on silicon substrate

In this work the small amounts of NiSO₄ was added to a basic electroless plating bath of CoSO₄ with Na₂H₂PO₂ as reducing agent for the deposition of Co-Ni-P film on a silicon substrate. The initial growth behavior, containing plating rate, chemical composition, crystal structure, surface morphology and micro-structure, of the electroless plating film was characterized by scanning electron microscope (SEM) and transmission electron microscope (TEM). The results showed that the growth morphology variation of the Co-Ni-P films deposited in the basic CoSO₄ + small amounts of NiSO₄ bath is the same as that of Co-P film deposited in the basic CoSO₄ bath, the plating rate of the Co-Ni-P film is much more rapid than that of the Co-P film, the Ni/Co wt.% in the Co-Ni-P film is greatly larger than that in the plating bath, and the structure of as-deposited film is crystalline at first stage and later stage.     

Interfacial reactions and oxidation behavior of Al2O3 and Al2O3/Al coatings on an orthorhombic Ti2AlNb alloy

The uniform and dense Al₂O₃ and Al₂O₃/Al coatings were deposited on an orthorhombic Ti₂AlNb alloy by filtered arc ion plating. The interfacial reactions of the Al₂O₃/Ti₂AlNb and Al₂O₃/Al/Ti₂AlNb specimens after vacuum annealing at 750 °C were studied. In the Al₂O₃/Ti₂AlNb specimens, the Al₂O₃ coating decomposed significantly due to reaction between the Al₂O₃ coating and the O-Ti₂AlNb substrate. In the Al₂O₃/Al/Ti₂AlNb specimens, a γ-TiAl layer and an Nb-rich zone came into being by interdiffusion between the Al layer and the O-Ti₂AlNb substrate. The γ-TiAl layer is chemically compatible with Al₂O₃, with no decomposition of Al₂O₃ being detected. No internal oxidation or oxygen and nitrogen dissolution zone was observed in the O-Ti₂AlNb alloy. The Al₂O₃/Al/Ti₂AlNb specimens exhibited excellent oxidation resistance at 750 °C.     

Preparation and magnetic properties of polymer magnetic composites based on acrylate resin filled with nickel plating graphite nanosheets

Nickel plating graphite nanosheets (Ni/GNs) were prepared by electroless plating method using graphite nanosheets (GNs). Then a novel polymer magnetic composites based on acrylate pressure-sensitive adhesive (acrylate PSA) filled with Ni/GNs were fabricated by solution blend method. The Ni/GNs and acrylate PSA/Ni/GNs composites were characterized by scanning electron microscope (SEM)/energy dispersive spectroscopy (EDS), X-ray diffraction (XRD), vibrating sample magnetometer (VSM) and transmission electron microscope (TEM). All results showed that relatively uniform and compact Ni layer is successfully coated onto GNs under the given conditions, furthermore, Ni/GNs are homogeneously dispersed in acrylate PSA. The VSM results showed that the saturation magnetization of acrylate PSA/Ni/GNs composites increases with an increasing content of Ni/GNs while the coercivity decreases with an increasing content of Ni/GNs. When the content of GNs is 20 wt%, acrylate PSA/Ni/GNs composites exhibites good mechanical properties.     

Electrodeposition of Sb2Se3 on indium-doped tin oxides substrate: Nucleation and growth

The mechanisms related to the initial stages of the nucleation and growth of antimony selenide (Sb₂Se₃) semiconductor compounds onto the indium-doped tin oxides (ITO) coated glass surface have been investigated using chronoamperometry (CA) technique. The fabrication was conducted from nitric acid bath containing both Sb³⁺ and SeO₂ species at ambient conditions. No underpotential deposition (UPD) of antimony and selenium onto ITO substrate was observed in the investigated systems indicating a weak precursor-substrate interaction. Deposition of antimony and selenium onto ITO substrate occurred with large overvoltage through 3D nucleation and growth mechanism followed by diffusion limited growth. FE-SEM and XRD results show that orthorhombic phase Sb₂Se₃ particles with their size between 90 and 125 nm were obtained and the atomic ratio for antimony and selenium was 2:2.63 according to the EDX results.     

Free Surface and Interface Thermodynamics of Liquid Nickel in Contact with Alumina

Sessile drop experiments of Ni and Ni(2at.%Al) were conducted under controlled working conditions, at 1500°C, P(O₂) 10^–9 Torr. It is shown that Al and oxygen atoms engaged in the capillary driven mass transport at the interface have a significant impact on the surface/interface thermodynamics. The surface energy of liquid Ni determined from experiments in which Ni comes into contact with Al₂O₃ is significantly lower than that of high purity Ni, due to the segregation of Al. The free energy of segregation of Al to the free surface of Ni ( G _S) was found to range from –164 to –152 kJ/mol, indicating a relatively strong tendency for segregation of Al to the free surface of Ni(Al). It is proposed that an Al(O)-rich liquid layer forms adjacent to the Ni-Al₂O₃ interface, which improves interfacial adhesion. In the Ni(Al)-Al₂O₃ system, an increase in the Al content of the alloy leads to the improvement of both wetting and adhesion of the alloy on the ceramic, correlating with the improvement in the interface strength after solidification.     

涂层导体用金属基带表面对过渡层成核的机理研究

涂层导体用金属基带的表面状况对在其上制备的过渡层的形貌和取向有很大影响.在Ni单晶、轧制辅助双轴织构基带(RABiTS)Ni和经过硫化处理的Ni基带三种不同衬底上采用磁控溅射法制备了CeO₂过渡层.结果表明,在Ni单晶和硫化处理的Ni基带上制备的CeO₂薄膜取向较差,而在RABiTS Ni上制备的CeO₂薄膜完全呈c轴取向,表面平整致密.反射高能电子衍射图显示,RABiTS Ni具有的c(2×2)的S超结构对CeO₂薄膜的取向生长起到了很重要的作用. 关键词： 涂层导体 金属基带 超结构 过渡层     

Structural, elastic, electronic and optical properties of a new layered-ternary Ta4SiC3 compound

We propose a new layered-ternary Ta₄SiC₃ with two different stacking sequences (α- and β-phases) of the metal atoms along c axis and study their structural stability. The mechanical, electronic and optical properties are then calculated and compared with those of other compounds M₄AX₃ (M=V, Nb, Ta; A=Al, Si and X=C). The predicted compound in the α-phase is found to possess higher bulk modulus than these compounds. The independent elastic constants of the two phases are also evaluated and the results discussed. The electronic band structures for α- and β-Ta₄SiC₃ show metallic conductivity. Ta 5d electrons are mainly contributing to the total density of states (DOS). We see that the hybridization peak of Ta 5d and C 2p lies lower in energy and the Ta 5d-C 2p bond is stronger than Ta 5d-Si 3p bond. Further an analysis of the different optical properties shows the compound to possess improved behavior compared to similar types of compounds.