Cr3+∶LiSrAlF6晶体的太赫兹-红外光谱研究

实验测量了室温下掺铬氟铝酸锶锂(Cr3+∶LiSrAlF6,LSAF)晶体0.1～3 THz的时域光谱,以及50～4000 cm-1范围内的红外光谱.结果分析表明:在0.2～1.5 THz波段LSAF晶体的吸收系数小于30 cm-1,折射率在0.5～1.5之间变化.红外波段内从30～1238 cm-1为声子吸收带,透射率几乎为零.最高的纵光学模声子的频率大约是1238cm-1,由此求出这支声子的Al-F键的力常数为5.0288 N·cm-1.     

二维类三角晶格声子晶体的声学带隙特性分析

首先划分7种类三角晶格声子晶体按三角点阵排列,并推导它们的结构因子,然后利用平面波展开法数值计算了类三角晶格水/水银声子晶体的能带结构,分析了带隙的各向同性以及归一化半径对带隙的影响.结果表明:(3.4.6.4)品格、(34.6)晶格、(3.6.3.6)晶格、(63)晶格水/水银声子晶体可以产生较宽频率范围的带隙;(3.12.12)晶格和(4.6.12)品格水/水银声子晶体存在很窄低频带隙;单胞含6个和3个“原子”水/水银声子晶体容易形成各向同性带隙;选取归一化半径分别为0.38和0.28,使类三角晶格水/水银声子晶体的第1和第2带隙都获得最大值.     

二维固-液声子晶体带隙特性的实验仿真

声子晶体的带隙特性受不同材料构成和填充率等条件的影响.本文基于时域有限差分法,实验仿真对比固-液、固-气和固-固二维声子晶体带隙特性,得出不同固体材料与水构成二维正方晶格圆柱声子晶体带隙特性,分析了填充率对钨-水结构声子晶体带隙特性的影响.研究结论对固-液声子晶体器件的制作提供参考.     

单面柱局域共振声子晶体低频带隙特性分析及结构改进研究

基于有限元法对单面柱局域共振声子晶体进行带隙特性分析,研究了结构参数对该类型声子晶体的影响。结果表明:随着散射体高度的增加,单面柱声子晶体的第一完全带隙的起始频率逐渐降低,带宽逐渐增大;随着基板厚度的增大,单面柱声子晶体的起始频率逐渐升高,截止频率先增大后减小。并且在经典单面柱声子晶体的基础上,组合了两种新型的三组元单面柱声子晶体结构:嵌入式单面柱声子晶体(以下简称结构Ⅰ)和粘接式单面柱声子晶体(以下简称结构Ⅱ)。通过对其带隙特性的分析得出:这两种新结构与经典的单面柱声子晶体相比,都具有更低频的带隙,这对于低频减振降噪是非常有利的。本文的结果将对实际的工程应用提供一定的理论指导。     

基于第一性原理的单层WS2热输运特性研究

二维WS₂是一种层状过渡金属硫化物,因其具有特殊的层状结构、可调带隙及稳定的物理化学性质而备受关注。结合玻尔兹曼输运方程(BTE)和密度泛函理论(DFT),利用第一性原理研究了单层WS₂声子的输运特性,分析了声子的谐性效应和非谐性效应对WS₂晶格热导率的影响机理,计算了其声子的临界平均自由程,提出通过调整阻断频率的方法来调控WS₂的晶格热导率。研究结果表明：单层WS₂在300 K时的本征晶格热导率为149.12 W/(m·K),且随温度的升高而降低;从各声子支对总热导率的贡献来看,声学声子支起主要作用,特别是纵向声学(longitudinal acoustic, LA)声子支对单层WS₂热导率的贡献百分比最大(44.28%);单层WS₂声学声子支和光学声子支之间的较大带隙(声光学声子支之间无散射)导致其具有较高的晶格热导率。本文研究可为基于单层WS₂纳米电子器件的设计和改进提供借鉴和理论指导。     

不同形貌氮化硅纳米结构的制备与表征

分别通过VLS和VS生长机制得到了Si3N4纳米线和纳米带.产物经X射线衍射(XRD)、扫描电镜(SEM)、透射电镜(TEM)等表征手段进行了分析.FTIR图谱表明它们在800～1100cm-1的波数范围内有一个宽的吸收带,这是Si-N键伸缩振动模式的典型吸收带.它们的室温光致发光图谱显示,在420nm左右都有一很强的发射带,表明其将在纳米光电器件中有潜在应用.另外,Si3N4纳米线发光峰与纳米带的发光相比有少许蓝移(蓝移约4nm),这可能和晶须尺寸的少许差别有关.至于纳米带的发光强度大于纳米线的原因,可能是纳米带的比表面积相对较大,有利于悬键的形成,从而导致材料结构内缺陷的浓度较大.     

铁、钴掺杂氧化锌纳米材料及其红外吸波性能研究

以氢氧化钠、氯化锌、氯化铁及氯化钴为原料,采用水热法制备了Fe、Co掺杂的片状氧化锌材料,并采用XRD、SEM、EDS、FT-IR等手段对它们的理化性质进行了表征分析.结果表明,该氧化锌片具有纳米级的空间尺度(其厚度约为10～20 nm).掺杂铁和钴的纳米氧化锌的红外光谱在3500 cm-1和1600 cm-1处的吸收峰发生红移,在430 cm-1与500 cm-1处的峰形和位置出现了明显的宽化现象,同时掺杂钴的材料在670cm-1和1040 cm-1左右处出现了新的吸收峰,表现出良好的红外吸波特性.     

多振子声子晶体的低频特性研究

本文设计了一种由硅橡胶包覆层包裹4个钨振子的新型声子晶体结构,通过有限元法计算该结构的色散曲线、振动模态和传输损失谱。结果表明,该结构的带隙范围为18.85~225.28 Hz,与传输损失谱频率衰减范围相吻合,能够有效抑制20~200 Hz的弹性波在声子晶体中传播。通过分析色散曲线上点的振动模态,说明带隙产生的原因。本文讨论了声子晶体板的缺口角度和振子之间的纵向和横向间距对带隙的影响,结果表明:当缺口角度减小时,带隙下边界几乎保持不变,带隙上边界升高从而增加了带隙的宽度;振子之间横向或纵向间距增大时,带隙下边界和上边界均上升,带隙变宽,进而优化了声子晶体模型的带隙。同时声子晶体板的缺口设计能够节省材料,从而减轻结构的质量。     

基于ISIGHT的二维手性声子晶体带隙最优设计

本文首先利用有限元仿真软件COMSOL计算了二维手性声子晶体的带隙,分析了散射体参数与韧带涂层参数变化对带隙的影响规律。在此基础上,确定手性声子晶体带隙最优设计的有效参数设计空间;然后基于ISIGHT优化设计平台嵌入遗传算法,开展二维手性声子晶体带隙的最优设计。在带隙的最优设计过程中,先以二维手性声子晶体的有效构型参数为设计变量,相对带隙宽度最大为目标,设计手性声子晶体单胞构型。再以此优化单胞构型为初始构型,以手性声子晶体的有效材料参数为设计变量,相对带隙宽度最大为目标,进一步实现二维手性声子晶体带隙的最优设计。本工作极大限度地挖掘了二维手性声子晶体带隙最优设计潜能,为充分发挥手性声子晶体在减振降噪中的作用提供了可靠有效的分析设计方法。     

采用溶胶凝胶前驱物制备氮化镓纳米晶体

采用溶胶凝胶法制备的前驱物进一步在900℃,氨气气氛中氮化得到粒径相对均匀、平均粒径为11.2nm的六方相氮化镓纳米晶体.XRD, HRTEM, SAED, EDS, FTIR被用于表征产物的微结构及组成.室温光致发光光谱显示产物位于3.46eV的带边发光峰和从 2.6～3.2eV 的宽的发光带.产物可直接用于制备氮化镓量子点复合材料和制备高质量的一维氮化镓晶体.     

Method for modulating the wafer bow of free-standing GaN substrates via inductively coupled plasma etching

The bowing curvature of the free-standing GaN substrate significantly decreased almost linearly from 0.67 to 0.056 m⁻¹ (i.e. the bowing radius increased from 1.5 to 17.8 m) with increase in inductively coupled plasma (ICP) etching time at the N-polar face, and eventually changed the bowing direction from convex to concave. Furthermore, the influences of the bowing curvature on the measured full width at half maximum (FWHM) of high-resolution X-ray diffraction (HRXRD) in (0 0 2) reflection were also deduced, which reduced from 176.8 to 88.8 arcsec with increase in ICP etching time. Decrease in the nonhomogeneous distribution of threading dislocations and point defects as well as V_Ga–O_N complex defects on removing the GaN layer from N-polar face, which removed large amount of defects, was one of the reasons that improved the bowing of the free-standing GaN substrate. Another reason was the high aspect ratio of needle-like GaN that appeared at the N-polar face after ICP etching, which released the compressive strain of the free-standing GaN substrate. By doing so, crack-free and extremely flat free-standing GaN substrates with a bowing radius of 17.8 m could be obtained.     

Impact of the gas flow ratio on the physical properties of GaN grown by vertical flow metalorganic chemical vapour deposition

We studied the effect of gas flow ratio of the H₂ carrier gas to the NH₃ precursor on the physical and crystal properties of GaN. GaN was grown by vertical reactor metalorganic chemical vapour deposition (MOCVD) on a low-temperature-deposited GaN buffer layer. A (0 0 0 1) sapphire substrate was used. The impact of the gas flow ratio as it was varied from 0.25 to 1 was investigated and discussed. With increase in flow ratio, the concentrations of magnesium and carbon impurities in GaN increased. The flow ratio of 0.5 is the optimum value to minimise the background electron concentration and to maintain crystal quality. The decrease in the background electron concentration is due to the compensation mechanism of acceptor-like magnesium and carbon impurities.     

Fabrication of a freestanding GaN layer by direct growth on a ZnO template using hydride vapor phase epitaxy

A new hydride vapor phase epitaxy (HVPE)-based approach for the fabrication of freestanding GaN (FS-GaN) substrates was investigated. For the direct formation of low-temperature GaN (LT-GaN) layers, the growth parameters were optimized: the polarity of ZnO, the growth temperature, and the V/III ratio. The FS-GaN layer was achieved by gas etching in an HVPE reactor. A fingerprint of Zn out-diffusion was detected in the photoluminescence measurements, especially for the thin (80 μm) FS-GaN film; however, a thicker film (400 μm) was effectively reduced by optimization of GaN growth.     

The effects of annealing on non-polar (1 1 2¯ 0) a-plane GaN films

Non-polar a-plane (1 1 2¯ 0) GaN films were grown on r-plane sapphire by metal–organic vapor phase epitaxy and were subsequently annealed for 90 min at 1070 °C. Most dislocations were partial dislocations, which terminated basal plane stacking faults. Prior to annealing, these dislocations were randomly distributed. After annealing, these dislocations moved into arrays oriented along the [0 0 0 1] direction and aligned perpendicular to the film–substrate interface throughout their length, although the total dislocation density remained unchanged. These changes were accompanied by broadening of the symmetric X-ray diffraction 1 1 2¯ 0 ω-scan widths. The mechanism of movement was identified as dislocation glide, occurring due to highly anisotropic stresses (confirmed by X-ray diffraction lattice parameter measurements) and evidenced by macroscopic slip bands observed on the sample surface. There was also an increase in the density of unintentionally n-type doped electrically conductive inclined features present at the film–substrate interface (as observed in cross-section using scanning capacitance microscopy), suggesting out-diffusion of impurities from the substrate along with prismatic stacking faults. These data suggest that annealing processes performed close to film growth temperatures can affect both the microstructure and the electrical properties of non-polar GaN films.     

Growth of GaN based structures on Si(1 1 0) by molecular beam epitaxy

The growth of GaN based structures on Si(1 1 0) substrates by molecular beam epitaxy using ammonia as the nitrogen precursor is reported. The structural, optical and electrical properties of such structures are assessed and are quite similar to the ones obtained on Si(1 1 1) in-spite of the very different substrate surface symmetry. A threading dislocation density of 3.7×10⁹ cm⁻² is evaluated by transmission electron microscopy, which is in the low range of typical densities obtained on up to 2 μm thick GaN structures grown on Si(1 1 1). To assess the potential of such structure for device realization, AlGaN/GaN high electron mobility transistor and InGaN/GaN light emitting diode heterostructures were grown and their properties are compared with the ones obtained on Si(1 1 1).     

GaN/GaAs(1 0 0) superlattices grown by metalorganic vapor phase epitaxy using dimethylhydrazine precursor

Superlattices of cubic gallium nitride (GaN) and gallium arsenide (GaAs) were grown on GaAs(1 0 0) substrates using metalorganic vapor phase epitaxy (MOVPE) with dimethylhydrazine (DMHy) as nitrogen source. Structures grown at low temperatures with varying layer thicknesses were characterized using high resolution X-ray diffraction and atomic force microscopy. Several growth modes of GaAs on GaN were observed: step-edge, layer-by-layer 2D, and 3D island growth. A two-temperature growth process was found to yield good crystal quality and atomically flat surfaces. The results suggest that MOVPE-grown thin GaN layers may be applicable to novel GaAs heterostructure devices.     

Correlations between photoluminescence and Hall mobility in GaN/sapphire grown by metalorganic chemical vapor deposition

We have investigated photoluminescence (PL) and electron Hall mobility for unintentionally doped GaN epitaxial layers grown by low-pressure metalorganic chemical vapor deposition on c-plane Al₂O₃ substrates. Four GaN films having identical dislocation density but remarkably different electron Hall mobility were exploited. At low temperature (12 K), a PL line associated with a bound exciton was observed and strong correlations were found between the Hall mobility and the PL intensity of the exciton transition. That is, relative PL intensity of the bound exciton to a donor-bound exciton monotonously increased with decreasing the electron mobility of the GaN films. This correlation was interpreted in terms of electrical compensation. Efforts to find the chemical origin of the PL line led to the conclusion that the BE line originated neither from threading dislocations nor from extrinsic point defects. Intrinsic acceptors such as Ga vacancy and GaN anti-site were suspected as plausible origin.     

Effect of the N/Al ratio of AlN buffer on the crystal properties and stress state of GaN film grown on Si(1 1 1) substrate

The effect of the N/Al ratio of AlN buffers on the optical and crystal quality of GaN films, grown by metalorganic chemical vapor deposition on Si(1 1 1) substrates, has been investigated. By optimizing the N/Al ratio during the AlN buffer, the threading dislocation density and the tensile stress have been decreased. High-resolution X-ray diffraction exhibited a (0 0 0 2) full-width at half-maximum as low as 396 acrsec. The variations of the tensile stress existing in the GaN films were approved by the redshifts of the donor bound exiton peaks in the low-temperature photoluminescence measurement at 77 K.     

Reducing dislocation density in GaN films using a cone-shaped patterned sapphire substrate

The threading dislocation (TD) density in GaN films grown directly on flat sapphire substrates is typically >10¹⁰/cm², which can deteriorate the properties of GaN-based LEDs significantly. This paper reports an approach to reducing the TD density in a GaN layer using a variety of patterned sapphire substrates (PSS). A cone-shaped PSS produced by metal organic chemical vapor deposition (MOVCD) was used for GaN deposition. Three types of GaN specimens were prepared at the initial nucleation stage, middle growth stage and final growth stage. The TDs generated on the cone-shaped PSS were analyzed by transmission electron microscopy (TEM) and a strain mapping simulation using HRTEM images, which evaluated the residual strain distribution. A large number of TDs were generated and the residual strain by the lattice distortions remained above the top of the cone-shaped regions. However, no TDs and residual strain were observed at the slope of the cone-shaped regions. This might be due to the formation of a GaN layer by lateral overgrowth at the slope of the cone-shaped regions, resulting in less lattice mismatch and incoherency between the GaN and sapphire. In conclusion, the TD density in the GaN layer could be reduced significantly, approximately 10⁷/cm², using the cone-shaped PSS.     

Inversion domains and parallel growth in ammonothermally grown GaN crystals

Macro-defects such as twins, inversion domains, crevices, and columnar growth occasionally appear in ammonothermally grown GaN crystals. Twinning mechanisms and parallel growth are proposed to explain the formation of these defects. As a polar crystal with wurtzite structure, GaN can have several different kinds of twins depending on the polarity arrangement of each individual twin. Inversion domains are formed in one of the twinning mechanisms. Parallel growth is used to explain the formation of pits on the nitrogen face and the columnar growth on the gallium face. Etching in hot H₃PO₄ is used to reveal the polarities and defects of GaN crystals when they are indistinguishable. Optical microscopy, scanning electron microscope, and cathodoluminescence are also employed to study these defects. In addition, seed quality, avoidance of macro-defect formation, and impurity effects are also discussed.