有限尺寸下双材料界面附近裂纹位置对裂纹尖端的影响

随着复合材料的应用和发展,不同材料组成的界面结构越来越受到人们的重视。界面层两侧材料的性能相异会引起材料界面端奇异性,同时界面和界面附近存在裂纹会引起裂尖处的应力奇异性。因此双材料界面附近的力学分析是比较复杂的。本文建立双材料直角界面模型,在材料界面附近预设初始裂纹,计算了有限材料尺寸对界面应力场及其附近裂纹应力强度因子的影响。运用弹性力学中的 Goursat 公式求得直角界面端在有限尺寸下的应力场以及其应力强度系数。通过叠加原理和格林函数法进一步得到在直角界面端附近的裂纹尖端应力强度因子。计算结果表明,在适当范围内改变材料内裂纹与界面之间的距离,界面附近裂纹尖端的应力强度因子随着裂纹与界面距离的增加而减少,并且逐渐趋于稳定。分析结果可以为预测双材料结构复合材料界面失效位置提供参考。     

带有扩展到和通过界面裂纹的各向同性/正交各向异性双层板条

本文分析了各向同性/正交各向异性双层板条的裂纹问题,由Fourier积分变换和问题的边界条件获得了一对奇异积分方程,确定了內部裂纹、边缘裂纹、到达和穿过界面裂纹的裂端及界面上的应力奇异性,利用Gauss-Jacobi和Gauss-Chebyshev积分公式求解奇异积分方程,得到了裂端和界面上的应力强度因子,并讨论了裂纹趋近于界面时进一步扩展的可能方式。     

各向异性双材料界面裂纹扩展裂尖场

应用界面断裂力学理论和Stroh方法,研究了广义平面变形下动态裂纹沿着各向异性双材料界面扩展时的裂尖奇异应力及动态应力强度因子.双材料界面的动态裂尖区域特性主要由两个实矩阵W和D确定,且裂尖奇异应力和动态应力强度因子可以由包含这两个矩阵的柯西奇异积分方程确定,同时给出了动态应力强度因子和能量释放率的显示表达式.算例得出当裂纹以小速度扩展时,裂尖振荡因子ε与静态时几乎相同,当界面裂纹扩展速度接近瑞利波速时,ε趋于无穷大;同时得出应力强度因子及能量释放率随裂纹扩展速度的变化关系.     

界面裂纹萌生与扩展的分子动力学模拟

运用分子动力学模拟方法研究了裂纹在界面端处萌生与沿界面扩展的临界条件. 模拟考虑了一双相材料的3种模型，即构成90°/90°和 90°/180°夹角的两个界面端和一个界面裂纹. 模拟采用了包含原子区域与连续区域的并发型多尺度模型，即在界面端尖端和裂纹尖端附近 采用分子动力学(MD)方法，MD区域之外则按照线弹性有限元方法分析. 结果表明，在断裂启动时刻，3个模型沿界面的最大应力均达到界面理想强度；而且，其界 面能恰好足以克服界面材料的本征内聚能. 因此，界面端裂纹萌生与沿界面扩展的断裂条件可以通过界面理想强度和内聚能联系起来. 并基于模拟计算结果提出了界面断裂启动的统一准则.     

界面裂纹问题中的通用权函数法

热载荷和机械载荷共同作用下复合材料中的裂纹扩展往往发生在界面处.传统求解热冲击及机械载荷共同作用下界面裂纹尖端的应力强度因子的数值方法(如有限元、边界元法等),计算工作量大、效率低.通用权函数与时间无关,运用通用权函数法可以免除对每个时刻的应力分析,计算效率可得到很大提高.本文将通用权函数法推广到求解热载荷和机械载荷共同作用下界面裂纹尖端的应力强度因子过渡过程的问题中,推导出求解平面双材料界面裂纹问题应力强度因子的通用权函数法计算格式.基于此格式,计算热载荷和机械载荷共同作用下界面裂纹尖端的应力强度因子.通过实例计算比较,表明此方法得到的结果可以达到与相互作用积分法相当的工程应用精度.最后,应用此方法研究了热障涂层受热冲击及表面力共同作用时裂纹长度以及涂层厚度对应力强度因子的影响.结果表明:在一定边界条件下,当热障涂层中存在边缘裂纹时,随着涂层厚度的增加,更容易导致裂纹的扩展和涂层的剥落.     

界面端附近裂纹的应力强度因子

结合材料的断裂形式可分为从界面端产生裂纹（沿界面或向母材内部层折）然后断裂与稍稍离开界面端处产生裂纹然后断裂这两种情况，在金属／陶瓷类结合材料中，后者出现的概率更大，本文利用结合材料界面端的奇异应力场和叠加原理，给出了界面端附近裂纹的应力强度因子近似计算公式，并用边界元数值计算验证了其有效性。     

圆柱形界面相裂纹在扭转载荷作用下的动态断裂

本文研究了位于界面相中的圆柱形界面裂纹的扭转冲击问题.采用Laplace、Fourier变换和位错密度函数将混合边值问题转化为求解Cauchy核奇异积分方程,利用Laplace数值反演技术计算了动态应力强度因子.讨论了材料特性和结构的几何尺寸对动态应力强度因子的影响.结果表明,随着界面相厚度的增加,无量纲化的动态应力强度因子减小.当裂纹靠近剪切弹性模量大的材料时,无量纲化的动态应力强度因子增大,反之减小.界面相两侧不同的材料组合对裂尖动态应力强度因子的影响是随着剪切弹性模量和质量密度的比值的增加而减小.界面相中裂纹长度对裂尖动态应力强度因子的影响比其他因素的影响大.     

含弧形裂纹复合陶瓷强度的尺度效应

认为含弧形裂纹复合陶瓷由随机方向的三相胞元与有效介质构成,用细观力学的方法研究了复合陶瓷的损伤失效和强度。首先确定三相胞元的外载应变,再依据复合陶瓷在损伤过程中的细观应力场和广义热力学力,计算出三相胞元内基体和颗粒的损伤等效应力,当基体和颗粒的损伤等效应力分别等于两者的极限应力时,得到基体和颗粒的破坏应力。然后,根据混合型应力强度因子计算弧形裂纹扩展时的能量释放率,进而得到界面的破坏应力。最后综合考虑基体、颗粒和和界面损伤影响,获得含弧形裂纹复合陶瓷的宏观强度及其尺度效应。     

求解界面裂纹应力强度因子的高次权函数法

从界面裂纹完备的特征展开式出发,利用伪正交特性,提出了计算界面裂纹特征展开式系数和应力强度因子的高次权函数法。文中计算的均匀材料应力强度因子,与已有结果吻合得非常好,并给出了同裂纹的应力强度因子Ｋ１／Ｋ０和Ｋ２／Ｋ０随机材料弹性模量比及裂纹长度的变化。     

有限宽的粘接SANDWICH型正交各向异性板条具有界面裂纹或断裂的中间板条

本文研究了有限宽、粘接的对称SANDW(?)CH型正交各向异性板条的静裂纹问题.在中间板条有内部裂纹和完全断裂的两种情形,解法和应力奇异性分析的过程都和板条为各向同性时相似;但在界面裂纹时,却归结为解一组与各向同性粘接板条不同的二类柯西型奇异积分方程.此时,各向同性粘接板条界面裂纹的应力强度因子的定义已不再适用.本文提出一种广义的应力强度因子定义,并给出上述三种裂纹问题的算例,计算裂纹长度、板条宽度或弹性常数对应力强度因子的影响.     

垂直磁压电材料界面三维裂纹的超奇异积分法

应用有限部积分概念和广义位移基本解，垂直于磁压电双材料界面三维复合型裂纹问题被转 化为求解一组以裂纹表面广义位移间断为未知函数的超奇异积分方程问题. 进而，通过主部 分析法精确地求得裂纹尖端光滑点附近的奇性应力场解析表达式. 然后，通过将裂纹表面 位移间断未知函数表达为位移间断基本密度函数与多项式之积，使用有限部积分法对超奇异 积分方程组建立了数值方法. 最后，通过典型算例计算，讨论了广义应力强度因子的变化规 律.     

Arbitrarily oriented crack near interface in piezoelectric bimaterials

Arbitrarily oriented crack near interface in piezoelectric bimaterials is considered. After deriving the fundamental solution for an edge dislocation near the interface, the present problem can be expressed as a system of singular integral equations by modeling the crack as continuously distributed edge dislocations. In the paper, the dislocations are described by a density function defined on the crack line. By solving the singular integral equations numerically, the dislocation density function is determined. Then, the stress intensity factors (SIFs) and the electric displacement intensity factor (EDIF) at the crack tips are evaluated. Subsequently, the influences of the interface on crack tip SIFs, EDIF, and the mechanical strain energy release rate (MSERR) are investigated. The J-integral analysis in piezoelectric bimaterals is also performed. It is found that the path-independent of J₁-integral and the path-dependent of J₂-integral found in no-piezoelectric bimaterials are still valid in piezoelectric bimaterials.     

SINGULARITIES AND EXPLICIT SOLUTIONS OF COLLINEAR CRACK PROBLEM IN ANISOTROPIC MEDIA

The singularities of collinear cracks both in anisotropic single mediumand at the interface of anisotropie bimaterials are studied by combining Stroh formalismand the analytic function method.The formulae for calculating the field potential andstress intensity factor(SIF)are obtained.It is found that the field potentials areexplicitly related to material matrix L and the in-plane and anti-plane fields can beseparately calculated when orthotropic bimaterials are considered.     

Analysis method of planar interface cracks of arbitrary shape in three-dimensional transversely isotropic magnetoelectroelastic bimaterials

Using the fundamental solutions for three-dimensional transversely isotropic magnetoelectroelastic bimaterials, the extended displacements at any point for an internal crack parallel to the interface in a magnetoelectroelastic bimaterial are expressed in terms of the extended displacement discontinuities across the crack surfaces. The hyper-singular boundary integral–differential equations of the extended displacement discontinuities are obtained for planar interface cracks of arbitrary shape under impermeable and permeable boundary conditions in three-dimensional transversely isotropic magnetoelectroelastic bimaterials. An analysis method is proposed based on the analogy between the obtained boundary integral–differential equations and those for interface cracks in purely elastic media. The singular indexes and the singular behaviors of near crack-tip fields are studied. Three new extended stress intensity factors at crack tip related to the extended stresses are defined for interface cracks in three-dimensional transversely isotropic magnetoelectroelastic bimaterials. A penny-shaped interface crack in magnetoelectroelastic bimaterials is studied by using the proposed method.The results show that the extended stresses near the border of an impermeable interface crack possess the well-known oscillating singularity r^?1/2±iε or the non-oscillating singularity r^?1/2±κ. Three-dimensional transversely isotropic magnetoelectroelastic bimaterials are categorized into two groups, i.e., ε-group with non-zero value of ε and κ-group with non-zero value of κ. The two indexes ε and κ do not coexist for one bimaterial. However, the extended stresses near the border of a permeable interface crack have only oscillating singularity and depend only on the mechanical loadings.     

Interfacial fracture analysis of a graded piezoelectric layer on a substrate with finite dimension

In fracture analysis of piezoelectric devices, the structural dimension is often assumed to be infinite at least in one direction. However, all practical piezoelectric structures are finite and their dimensions in different directions are often comparable and cannot be simplified as infinite. The assumption of infinite dimension may lead to inexact theoretical results. The present work aims at studying the interfacial fracture behavior of a functionally graded piezoelectric layer on a dielectric substrate with finite dimension. The crack problem is solved by the methods of Fourier series and Cauchy singular integral equation. Parametric studies on the stress intensity factor (SIF) reveal the following: (a) when a crack tip is near to an interface end, its SIF is mainly governed by the end effect; (b) when a crack is far from the interface ends and the piezoelectric layer is thin, its SIF is principally affected by the thickness of the piezoelectric layer, and (c) only when a crack is far from the interface ends and meanwhile the piezoelectric layer is thick will its SIF be dominated by the non-homogeneity parameter, and in this case, the SIF increases with the increasing non-homogeneity parameter.     

Hypersingular integral equation method for a three-dimensional crack in anisotropic electro-magneto-elastic bimaterials

Using Green’s functions, the extended general displacement solutions of a three-dimensional crack problem in anisotropic electro-magneto-elastic (EME) bimaterials under extended loads are analyzed by the boundary element method. Then, the crack problem is reduced to solving a set of hypersingular integral equations (HIE) coupled with boundary integral equations. The singularity of the extended displacement discontinuities around the crack front terminating at the interface is analyzed by the main-part analysis method of HIE, and the exact analytical solutions of the extended singular stresses and extended stress intensity factors (SIFs) near the crack front in anisotropic EME bimaterials are given. Also, the numerical method of the HIE for a rectangular crack subjected to extended loads is put forward with the extended crack opening dislocation approximated by the product of basic density functions and polynomials. At last, numerical solutions of the extended SIFs of some examples are obtained.     

STRESS INTENSITY FACTOR OF AN ANTI-PLANE CRACK PARALLEL TO THE WEAK/MICRO-DISCONTINUOUS INTERFACE IN A BI-FGM COMPOSITE

The problem considered is a mode Ⅲ crack lying parallel to the interface of an exponential-type functional graded material （FGM） strip bonded to a linear-type FGM substrate with infinite thickness. By applying the Fourier integral transform, the problem was reduced as a Cauchy singular integral equation with an unknown dislocation density function. The collocation method based on Chebyshev polynomials proposed by Erdogan and Gupta was used to solve the singular integral equation numerically. With the numerical solution, the effects of the geometrical and physical parameters on the stress intensity factor （SIF） were analyzed and the following conclusions were drawn： （a） The region affected by the interface or free surface varies with the material rigidity, and higher material rigidity will lead to bigger affected region. （b） The SIF of the crack in the affected region and parallel to the micro-discontinuous interface is lower than those of the weak discontinuous cases. Reducing the weak-discontinuity of the interface will be beneficial to decrease the SIF of the interface-parallel crack in the region affected by the interface. （c） The effect of the free surface on SIF is more remarkable than that of the interface, and the latter is still more notable than that of the material rigidity. When the effects of the interface and free surface are fixed, increase of the material rigidity will enhance the value of SIF.     

基体裂纹与界面刚性线的弹性干涉

研究两种材料界面上的刚性线与其它任意位置处直线裂纹弹性干涉的反平面问题。基于界面上刚性线与任意位置处螺型位错干涉的基本解,运用连续位错密度模型法将问题转化为奇异积分方程。用半开型积分法求解奇异积分方程,得到位错密度函数的离散值,计算裂纹尖端处的应力强度因子。算例说明该方法可用于工程实际问题。     

A cracked sliding interface between anisotropic bimaterials

A general solution for the stresses and displacements of a cracked sliding interface between anisotropic bimaterials subjected to uniform tensile stress at infinity is given by using the Stroh’s formulation. Horizontal and vertical opening displacements on the interface, stress intensity factors, and energy release rate are expressed in real form, which are valid for any kind of anisotropic materials including the degenerate materials such as isotropic materials. It is observed that stresses exhibit the traditional inverse square root singularities near the crack tips, and the vertical opening displacement and energy release rate are intimately related to a real parameter λ determined by the elastic constants of the anisotropic bimaterials.     

压电体中孔边Ⅲ型界面裂纹的动应力强度因子

采用Green函数法研究界面上含圆孔边界径向有限长度裂纹的两半无限压电材料对SH波的散射和裂纹尖端动应力强度因子问题.首先构造出具有半圆型凹陷半空间的位移Green函数和电场Green函数,然后采用裂纹"切割"方法构造孔边裂纹,并根据契合思想和界面上的连接条件建立起求解问题的定解积分方程.最后作为算例,给出了孔边界面裂纹尖端动应力强度因子的计算结果图并进行了讨论.