Interfacial fracture analysis of bonded dissimilar strips with a functionally graded interlayer under antiplane deformation

This paper provides the solution to the problem of dissimilar, homogeneous semi-infinite strips bonded through a functionally graded interlayer and weakened by an embedded or edge interfacial crack. The bonded system is assumed to be under antiplane deformation, subjected to either traction-free or clamped boundary conditions along its bounding planes. Based on the Fourier integral transform, the problem is formulated in terms of a singular integral equation which has a simple Cauchy kernel for the embedded crack and a generalized Cauchy kernel for the edge crack. In the numerical results, the effects of geometric and material parameters of the bonded system on the crack-tip stress intensity factors are presented in order to quantify the interfacial fracture behavior in the presence of the graded interlayer.     

Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials

Plane thermoelasticity solutions are presented for the problem of a crack in bonded materials with a graded interfacial zone. The interfacial zone is treated as a nonhomogeneous interlayer having spatially varying thermoelastic moduli between dissimilar, homogeneous half-planes. The crack is assumed to exist in one of the half-planes at an arbitrary angle to the graded interfacial zone, disturbing uniform steady-state heat flows. The Fourier integral transform method is employed in conjunction with the coordinate transformations of field variables in the basic thermoelasticity equations. Formulation of the current nonisothermal crack problem lends itself to the derivation of two sets of Cauchy-type singular integral equations for heat conduction and thermal stress analyses. The heat-flux intensity factors and the thermal-stress intensity factors are defined and evaluated in order to quantify the singular characters of temperature gradients and thermal stresses, respectively, in the near-tip region. Numerical results include the variations of such crack-tip field intensity factors versus the crack orientation angle for various combinations of material and geometric parameters of the dissimilar media bonded through the thermoelastically graded interfacial zone. The dependence of the near-tip thermoelastic singular field on the degree of crack-surface partial insulation is also addressed.     

Elastodynamic analysis of a crack at an arbitrary angle to the graded interfacial zone in bonded half-planes under antiplane shear impact

A solution is provided for the elastodynamic problem of a crack at an arbitrary angle to the graded interfacial zone in bonded media under the action of antiplane shear impact. The interfacial zone is modeled by a nonhomogeneous interlayer with the spatially varying shear modulus and mass density in terms of power functions between the two dissimilar, homogeneous half-planes. Based on the use of Laplace and Fourier integral transforms and the coordinate transformations of basic field variables, formulation of the transient crack problem is reduced to solving a Cauchy-type singular integral equation in the Laplace transform domain. The crack-tip response in the physical domain is recovered via the inverse Laplace transform and the values of dynamic mode III stress intensity factors are obtained as a function of time. A comprehensive parametric study is then presented of the effects of crack obliquity on the overshoot behavior of the transient crack-tip response, by plotting the peak values of the dynamic stress intensity factors versus the crack orientation angle for various material and geometric combinations of the bonded system.     

Two mode III internal cracks located within two bonded functionally graded piezoelectric half planes respectively

This paper studies the mode III crack problem of two bonded functionally graded piezoelectric half planes which contain a crack respectively. These two cracks are located normal to the interface. All the material properties are assumed to vary along the direction of the crack line. A system of singular integral equations for electrically impermeable and permeable cracks is derived and solved numerically by using the Gauss–Chebyshev integration formula. The influence of the nonhomogeneous parameters and the dependence of the crack interactions on the stress and electric displacement intensity factors are investigated.     

正交各向异性功能梯度涂层-基底结构共线裂纹问题的断裂分析

论文研究了一正交各向异性功能梯涂层粘结到一均匀基底含共线裂纹的平面I型断裂问题.引入新的双参数指数函数模拟连续改变的材料性质,正交各向异性的主轴方向分别为平行和垂直于带的边界,采用积分变换技术,所求的问题转化为第一类的Cauchy奇异积分方程,获得了共线裂纹尖端应力场,结果显示了材料常数和几何参数对应力强度因子的影响.     

Stress intensity factors for an oblique edge crack in a coating/substrate system with a graded interfacial zone under antiplane shear

This paper investigates the edge crack problem for a coating/substrate system with a functionally graded interfacial zone under the condition of antiplane deformation. With the interfacial zone being modeled by a nonhomogeneous interlayer having the continuously varying shear modulus between the dissimilar, homogeneous phases of the coated medium, the coating is assumed to contain an edge crack at an arbitrary angle to the interfacial zone. The Fourier integral transform method is used in conjunction with the coordinate transformations of basic field variables. Formulation of the proposed crack problem is then reduced to solving a singular integral equation with a generalized Cauchy kernel. The mode III stress intensity factors are defined and evaluated in terms of the solution to the integral equation. In the numerical results, the values of the stress intensity factors are plotted, illustrating the effects of the crack orientation angle for various material and geometric combinations of the coating/substrate system with the graded interfacial zone.     

Mode III fracture problem of a cracked FGPM surface layer bonded to a cracked FGPM substrate

This work deals with the mode III fracture problem of a cracked functionally graded piezoelectric surface layer bonded to a cracked functionally graded piezoelectric substrate. The cracks are normal to the interface and the electro-elastic material properties are assumed to be varied along the crack direction. Potential and flux types of boundary condition are assigned on the edge of the surface layer. The problem under the assumptions of impermeable and permeable cracks can be formulated to the standard singular integral equations, which are solved by using the Gauss–Chebyshev technique. The effects of the boundary conditions, the material properties and crack interaction on the stress and electric displacement intensity factors are discussed.     

梯度材料中矩形裂纹的对偶边界元方法分析

采用对偶边界元方法分析了梯度材料中的矩形裂纹. 该方法基于层状材料基本解,以非裂纹边界的位移和面力以及裂纹面的间断位移作为未知量. 位移边界积分方程的源点配置在非裂纹边界上,面力边界积分方程的源点配置在裂纹面上. 发展了边界积分方程中不同类型奇异积分的数值方法. 借助层状材料基本解,采用分层方法逼近梯度材料夹层沿厚度方向力学参数的变化. 与均匀介质中矩形裂纹的数值解对比,建议方法可以获得高精度的计算结果. 最后,分析了梯度材料中均匀张应力作用下矩形裂纹的应力强度因子,讨论了梯度材料非均匀参数、夹层厚度和裂纹与夹层之间相对位置对应力强度因子的影响.      

Dynamic stress intensity factors of two collinear mode-III cracks perpendicular to and on the two sides of a bi-FGM weak-discontinuous interface

The mechanical model was established for the anti-plane dynamic fracture problem for two collinear cracks on the two sides of and perpendicular to a weak-discontinuous interface between two materials with smoothly graded elastic properties, as opposed to a sharp interface with discontinuously changing elastic properties. The problem was reduced as a system of Cauchy singular integral equations of the first kind by Laplace and Fourier integral transforms. The integral equations were solved by Erdogan's collocation method and the dynamic stress intensity factors in the time domain were obtained through Laplace numerical inversion proposed by Miller and Guy. The influences of geometrical and physical parameters on the dynamic stress intensity factors were illustrated and discussed, based on which some conclusions were drawn: (a) to increase the thickness of the FGM strip on either side of the interface will be beneficial to reducing the DSIF of a crack perpendicular to a bi-FGM interface and embedded at the center of one of the FGM strips; (b) To increase the rigidity of the FGM strip where the crack is located will increase the DSIF. However, when the material in one side of the interface is more rigid, the DSIF of the interface-perpendicular embedded crack in the other side will be reduced; (c) To decrease the weak-discontinuity of a bi-FGM interface will not necessarily reduce the stress intensity factor of a crack perpendicular to it, which is different from the case of interfacial crack; (d) For two collinear cracks with equal half-length, when the distance between the two inner tips is less than about three times of the half-length, the interaction of them is intensified, however, when the distance is greater than this the interaction becomes weak.     

Antiplane crack at the interface of two bonded dissimilar graded piezoelectric materials

The problem of an antiplane crack situated in the interface of two bonded dissimilar graded piezoelectric half-spaces is considered under the permeable crack assumption. The mechanical and electrical properties of the half-spaces are considered for a class of functional forms for which the equilibrium equation has analytic solutions. By using an integral transform technique, the problem is reduced to dual integral equations which are transformed into a Fredholm integral equation by introducing an auxiliary function. The stress intensity factors are obtained in explicit form in terms of auxiliary functions. By solving the Fredholm integral equation numerically, the numerical results for stress intensity factors are obtained which have been displayed graphically to show the influence of the graded piezoelectric materials.     

Mode III fracture problem of two arbitrarily oriented cracks located within two bonded functionally graded material strips

This paper shows the anti-plane crack problem of two bonded functionally graded material (FGM) strips. Each strip contains an arbitrarily oriented crack. The material properties of the strips are assumed in exponential forms varied in the direction normal to the interface. After employing the Fourier transforms, the unknowns are solved from the interface conditions, boundary conditions and the condition on the crack surfaces. The problem can then be reduced to a system of singular integral equations, which are solved numerically by applying the Gauss-Chebyshev integration formula to obtain the stress intensity factors at the crack tips. In the discussions, several degenerated problems are considered to demonstrate the influence of the non-homogeneous parameters, crack orientations, edge effects and the crack interactions on the normalized intensity factors. In general, the factors are larger when crack tips are located in stronger material. Also, the factors increase as the crack is oriented in the direction normal to the interface. The conclusions made in this research can be used to evaluate the safety of two bonded strips once the cracks exist inside the structure.     

The stress intensity factors near the tips of two collinear cracks in composite under in-plane shear

In this paper, the stress-intensity factors for two collinear cracks in a composite bonded by an isotropic and an anisotropic half-plane were calculated. The cracks are paralell to the interface, and the crack surfaces are loaded by uniform shear stresses. By using Fourier transform, the mixed boundary value problem is reduced to a set of singular integral equations. For solving the integral equations, the crack surface displacements are expanded in triangular series and the unknown coefficients in the series are determined by the Schmidt method. The stress intensity factors for the cracks in the boron-fibre plastics and aluminium joined composite and in carbon-fibre reinforced plastics were calculated numerically.     

Basic solutions of multiple parallel symmetric mode-III cracks in functionally graded piezoelectric/piezomagnetic material plane

The Schmidt method is adopted to investigate the fracture problem of multiple parallel symmetric and permeable finite length mode-III cracks in a functionally graded piezoelectric/piezomagnetic material plane. This problem is formulated into dual integral equations, in which the unknown variables are the displacement jumps across the crack surfaces. In order to obtain the dual integral equations, the displacement jumps across the crack surfaces are directly expanded as a series of Jacobi polynomials. The results show that the stress, the electric displacement, and the magnetic flux intensity factors of cracks depend on the crack length, the functionally graded parameter, and the distance among the multiple parallel cracks. The crack shielding effect is also obviously presented in a functionally graded piezoelectric/piezomagnetic material plane with mul- tiple parallel symmetric mode-III cracks.     

Dynamic behavior of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips

The dynamic interaction of two collinear interface cracks between two dissimilar functionally graded piezoelectric/piezomagnetic material strips subjected to the anti-plane shear harmonic stress waves was investigated. By using the Fourier transform, the problem can be solved with the help of a pair of triple integral equations in which the unknown variable is jump of displacement across the crack surfaces. These equations are solved using the Schmidt method. Numerical examples are provided to show the effect of the functionally graded parameter, the circular frequency of the incident waves and the thickness of the strip upon stress, electric displacement and magnetic flux intensity factors of cracks.     

Mode III crack problems of two bonded functionally graded strips with internal cracks

This paper deals with the anti-plane problem of two bonded functionally graded finite strips. Each strip contains an internal crack normal to the interface. The material properties of two strips are assumed to vary along the direction of the crack lines. A system of singular integral equations is derived and then solved numerically by using Gauss–Chebyshev integration formula. The influences of nonhomogeneous parameters, crack interactions and two edge conditions on the mode III stress intensity factors are investigated.     

Periodic cracks in a functionally graded piezoelectric layer bonded to a piezoelectric half-plane

Studied is the problem of a periodic array of cracks in a functionally graded piezoelectric strip bonded to a homogeneous piezoelectric material. The properties of the functionally graded piezoelectric strip, such as elastic modulus, piezoelectric constant and dielectric constant, are assumed in exponential forms and vary along the crack direction. The crack surface condition is assumed to be electrically impermeable or permeable. Integral transform and dislocation density functions are employed to reduce the problem to the solution of a system of singular integral equations. The effects of the periodic crack spacing, material constants and the geometry parameters on the stress intensity factor, the energy release ratio and the energy density factor are studied.     

Mechanical modeling and transient anti-plane fracture analysis for the graded inter-diffusion regions in a bonded structure

An inter-diffusion interface model (IDIM) is put forward for a bonded structure. Laplace and Fourier integral transforms are applied to reduce the transient anti-plane fracture problem of the structure as a Cauchy singular integral equation. Lobatto-Chebyshev collocation method and Laplace numerical inversion transform are employed to evaluate transient stress intensity factors (TSIFs). The effects of geometrical and physical parameters on TSIFs are studied. Specially discussed are the influences of the weak/micro-discontinuity of the interfaces. Comparison between IDIM and the graded interlayer model indicates that if the inter-diffusion between the two original materials is prominent, the former should be applied instead of the latter in fracture analyses of bonded structures.     

Dynamic response of a crack in a functionally graded interface of two dissimilar piezoelectric half-planes

Summary  In this paper, the dynamic anti-plane crack problem of two dissimilar homogeneous piezoelectric materials bonded through a functionally graded interfacial region is considered. Integral transforms are employed to reduce the problem to Cauchy singular integral equations. Numerical results illustrate the effect of the loading combination parameter λ, material property distribution and crack configuration on the dynamic stress and electric displacement intensity factors. It is found that the presence of the dynamic electric field could impede of enhance the crack propagation depending on the time elapsed and the direction of applied electric impact. Received 4 December 2001; accepted for publication 9 July 2002 This work is supported by the National Natural Science Foundation of China through Grant No. 10132010.     

The Anti-plane Dynamic Fracture Analysis of Functionally Graded Materials with Arbitrary Spatial Variations of Material Properties

Anti-plane dynamic fracture analysis is presented for functionally graded materials (FGM) with arbitrary spatial variations of material properties. The FGM with the material properties varying continuously in an arbitrary manner is modeled as a multi-layered medium with the elastic modulus and mass density varying linearly in each sub-layer and continuous at the interfaces between two adjacent sub-layers. With this linearly inhomogeneous multi-layered model, the problem of a crack in a graded interfacial zone bonded to two homogeneous half-spaces or in a coating bonded to a homogeneous half-space subjected to the anti-plane shear impact load is investigated. Laplace and Fourier transforms and transfer matrix are applied to reduce the associated mixed boundary value problem to a Cauchy singular integral equation which is solved numerically in the Laplace transformed domain. The dynamic stress intensity factors (DSIF) are obtained by using the numerical technique of Laplace inversion.     

Dynamic behavior of two collinear anti-plane shear cracks in a functionally graded layer bonded to dissimilar half planes

In recent years, the functionally graded materials (FGMs) have been widely applied in extremely high temperate environment. In this paper, the dynamic behavior of two collinear cracks in FGM layer bonded to dissimilar half planes under anti-plane shear waves is studied by the Schmidt method. By using the Fourier transform technique, the present problem can be solved with a dual integral equation. These equations are solved using the Schmidt method. The present method is used to illustrate the fundamental behavior of the interacting cracks in FGMs under dynamic loading. Furthermore, the effects of the geometry of the interacting cracks, the shear stress wave velocity of the materials and the frequency of the incident wave on the Dynamic Stress Intensity Factor are investigated.