Flash – lamp annealing of phosphorus and antimony implanted silicon

The structure and electrophysical properties of a silicon layers after P⁺ and Sb⁺ ion implantation and subsequent pulse annealing of millisecond lengths have been investigated by the transmission electron microscopy and four-point probe measurements. It has been demonstrated, that for certain implantation and annealing conditions the epitaxially grown layers can involve the microtwins and dislocation loops. The impurity redistribution under the pulse annealing depends on the implantation dose and rather weaker the light irradiation energy density.     

Thermal annealing induced photocarrier radiometry enhancement for ion implanted silicon wafers

An experimental study on the photocarrier radiometry signals of As⁺ ion implanted silicon wafers before and after rapid thermal annealing is performed. The dependences of photocarrier radiometry amplitude on ion implantation dose (1×10¹¹--1×10¹⁶/cm²), implantation energy (20--140 keV) and subsequent isochronical annealing temperature (500--1100 du are investigated. The results show that photocarrier radiometry signals are greatly enhanced for implanted samples annealed at high temperature, especially for those with a high implantation dose. The reduced surface recombination rate resulting from a high built-in electric field generated by annealing-activated impurities in the pn junction is believed to be responsible for the photocarrier radiometry signal enhancement. Photocarrier radiometry is contactless and can therefore be used as an effective in-line tool for the thermal annealing process monitoring of the ion-implanted wafers in semiconductor industries.     

Peculiarities of the electron structure of nanosized ion-implanted layers in silicon

The effect of implantation of Ba, P, B, and alkali element ions with a low energy (E ₀ < 5 keV) on the electron structure of a thin surface region of p- and n-type Si(111) single crystals is investigated by photoelectron and secondary electron-electron spectroscopy. It is shown that irrespective of the ion species, high-dose ion implantation leads to a sharp narrowing of the band gap in silicon, which can be explained by overlapping of the wavefunctions of electrons of impurity atoms and the formation of the impurity subband overlapping with the allowed band. After implantation thermal annealing, SiP, BaSi, and SiB3 films of nano-sized thickness are obtained for the first time. Optimal regimes of ion implantation and subsequent annealing for the formation of silicide films are determined, and their electron structure is investigated.     

高剂量离子注入形成的非晶层重新结晶过程中杂质外扩散的物理模型

本文提出了一个杂质沉淀引起位错生成、位错-杂质相互作用、杂质原子沿晶粒间界快速扩散的模型,用以解释高剂量离子注入形成的非晶层在重新结晶的退火过程中杂质外扩散和缺陷运动现象。给出了在位错的合应力场的影响下杂质的扩散方程。以能量为80keV,剂量为10¹⁶cm^-2的Pb⁺注入Si(111)面为例,对扩散方程进行了数学物理处理,从而给出了根据实验测量推演表观扩散系数随时间变化及位错的合应力场对杂质的作用力的纵向分布的方法。实验测得的位错合应力场对杂质的作用系数α≈8.4×10^-28dyn·cm³,退火时间在5×10³sec至8.25×10³sec内,表观扩散系数D随时间的变化为一指数关系。 关键词：     

Impurity lattice location and recovery of structural defects in semiconductors studied by emission channeling

Doping of semiconductors by ion implantation usually requires implantation doses below 10¹³ cm^–2 to obtain typical impurity concentrations of <10¹⁸ cm^–3. The lattice location of impurities as well as the defect recovery after such low dose implantations can be studied using the emission channeling technique. In this technique, single crystals are doped with radioactive probe atoms and the channeling effects of electrons, positrons or -particles emitted from these atoms are measured. We present a quantitative analysis of electron emission channeling measurements after heavy-ion implantation into Si and III–V compound semiconductors by comparison with calculated channeling profiles based on the dynamical theory of electron diffraction. For In atoms implanted into Si, complete substitutionality was found after rapid thermal annealing to 1200 K. For lower annealing temperatures, the observed channeling effects indicate small mean displacements (of about 0.2 Å) of the In atoms from substitutional sites, caused by residual implantation defects. For GaAs, GaP and InP implanted at low temperatures with In or Cd isotopes, pronounced recovery stages around 300, 400 and 350 K, respectively, were observed and substitutional fractions close to 100% were derived after annealing above the stage.     

Optical investigation of phosphorous-ion-implantation induced InAs/GaAs quantum dots' intermixing

This work reports on InAs/GaAs quantum dots (QDs) intermixing, induced by phosphorous ion implantation and subsequent rapid thermal annealing. The implantation process was carried out at room temperature at various doses (5×¹⁰¹⁰-¹⁰¹⁴ ions/cm²), where the ions were accelerated at 50 keV. To promote the atomic intermixing, implanted samples are subjected to rapid thermal annealing at 675 °C for 30 s. Low temperature photoluminescence (PL) measurements are carried out to investigate the influence of the interdiffusion process on the optical and electronic properties of the QDs. PL emission energy; linewidth and integrated intensity are found to exhibit a drastic dependence on the ion implantation doses. The band gap tuning limit has been achieved for an implantation dose of 5×¹⁰¹³ ions/cm². However, our measurement reveals that the accumulated defects for implantation doses higher than ¹⁰¹² ions/cm² drive the system towards the degradation of the QDs structure's quality.     

Correlation between impurities in Fe-Si amorphous layers synthesized by Fe implantation and photoluminescence property of β-FeSi2 precipitates in Si

Completely amorphous Fe-Si layers are formed by Fe implantation into Si substrate at a dosage of 5×10¹⁵ cm⁻² using a metal vapor vacuum arc (MEVVA) ion source under 80 kV extraction voltage and cryogenic temperature. After thermal annealing, β-FeSi₂ precipitates are formed in Si matrix. The influence of impurities in these amorphous Fe-Si layers on the photoluminescence (PL) from β-FeSi₂ precipitates is investigated. PL is found to be significantly enhanced by optimizing the impurity concentration and annealing scheme. After 60 s of rapid thermal annealing (RTA) at 900 °C, β-FeSi₂ precipitates in medium boron-doped Si substrate give the strongest PL intensity without boron out-diffusion from them.     

Reduction of the annealing temperature of radiation-induced defects in ion-implanted MOS structures

Si-SiO₂ structures irradiated with 11-MeV electrons for 10 s and then implanted with B⁺ ions with an energy of 10 keV at a dose of 1.0×10¹² cm^-2 through the oxide were annealed at different temperatures. MOS capacitors including such oxide layers were studied by quasi-static C/V and thermally stimulated current (TSC) methods. A comparison of the radiation defect annealing of double-treated (electron-irradiated and ion-implanted) samples and of implanted-only samples was carried out. It is shown that a preceding low-dose high-energy electron irradiation of the samples leads to a lowering of the annealing temperature of radiation defects introduced by ion implantation. After annealing at 500 °C for 15 min, no TSC spectra for the double-treated samples were observed. The spectra of the other samples (which were not previously irradiated) showed that after the same thermal treatment only some of the radiation defects introduced by ion implantation are annealed. The difference between the annealed interface state density of previously electron-irradiated and current MOS structures is also demonstrated. A possible explanation of the results is proposed . PACS 61.82.Fk; 85.40.Ry; 61.80.Fe     

Origin of ferromagnetism in iron implanted rutile single crystals

⁵⁷Fe doped titanium oxide monocrystals, prepared by ion implantation at different temperatures and subsequent thermal treatment, were characterized by conversion electron Mössbauer spectrometry, synchrotron radiation x-ray diffraction and superconducting quantum interference device magnetometry. After implantation at room temperature Fe is present in divalent state. Upon annealing in high vacuum Fe^2?+? is reduced to metallic Fe for the most part. After implantation at 623 K most iron is in metallic state. During annealing on air Fe is gradually oxidized from Fe^2?+? to Fe^3?+?. Depending on preparation conditions and thermal treatment the role of different nanosized secondary phases is discussed in terms of their influence on the magnetic properties of Fe:TiO₂. α-Fe nanoparticles are found to be responsible for ferromagnetism observed in TiO₂.     

Ti离子注入和退火对ZnS薄膜结构和光学性质的影响

利用真空蒸发法在石英玻璃衬底上制备了ZnS薄膜,将能量80 keV,剂量1×10¹⁷ cm^-2的Ti离子注入到薄膜中,并将注入后的ZnS薄膜进行退火处理,退火温度500—700 ℃.利用X射线衍射（XRD）研究了薄膜结构的变化,利用光致发光（PL）和光吸收研究了薄膜光学性质的变化.XRD结果显示,衍射峰在500 ℃退火1 h后有一定程度的恢复;光吸收结果显示,离子注入后光吸收增强,随着退火温度的上升,光吸收逐渐降低,吸收边随着退火温度的提高发生蓝移;PL显示,薄 关键词： ZnS薄膜 离子注入 X射线衍射 光致发光     

He离子注入ZnO中缺陷形成的慢正电子束研究

在ZnO单晶样品中注入了能量为20—100keV、总剂量为4.4×10¹⁵cm^-2的He离子.利用基于慢正电子束的多普勒展宽测量研究了离子注入产生的缺陷.结果表明，He离子注入ZnO产生了双空位或更大的空位团.在400℃以下退火后，He开始填充到这些空位团里面，造成空位团的有效体积减少.经过400℃以上升温退火后，这些空位团的尺寸开始增大，但由于有少量的He仍然占据在空位团内，因此直到800℃这些空位团仍保持稳定.高于800℃退火后，由于He的脱附，留下的空位团 关键词： 慢正电子束 ZnO 离子注入 缺陷     

在不同的退火温度下钴注入二氧化钛结构与磁性

选用能量为180 keV,温度为623 K,注入4×10¹⁶ cm^-2剂量的钴离子束注入TiO₂样品.在不同的退火温度下,用高分辨的扫描电镜、同步辐射X射线衍射、卢瑟福背散射/沟道实验和超导量子干涉仪,分别对样品进行结构与磁性的测试. SR-XRD和HRTEM测试结果表明: 在Co注入TiO₂后,形成了钴的体心立方(hcp)相和面心立方(fcc)相,且在TiO₂中,钴-纳米粒子也已经形成. 随着退     

Structure, electrical and magnetic properties, and the origin of the room temperature ferromagnetism in Mn-implanted Si

The structure and the electrical and magnetic properties of Mn-implanted Si, which exhibits ferromagnetic ordering at room temperature, are studied. Single-crystal n- and p-type Si wafers with high and low electrical resistivities are implanted by manganese ions to a dose of 5 × 10¹⁶ cm^?2. After implantation and subsequent vacuum annealing at 850°C, the implanted samples are examined by various methods. The Mn impurity that exhibits an electric activity and is incorporated into the Si lattice in interstitial sites is found to account for only a few percent of the total Mn content. The main part of Mn is fixed in Mn₁₅Si₂₆ nanoprecipitates in the Si matrix. The magnetization of implanted Si is found to be independent of the electrical resistivity and the conductivity type of silicon and the type of implanted impurity. The magnetization of implanted Si increases slightly upon short-term postimplantation annealing and disappears completely upon vacuum annealing at 1000°C for 5 h. The Mn impurity in Si is shown to have no significant magnetic moment at room temperature. These results indicate that the room temperature ferromagnetism in Mn-implanted Si is likely to be caused by implantation-induced defects in the silicon lattice rather than by a Mn impurity.     

Effects of Additional Vacancy-Like Defects Produced by Ion Impealations on Boron Thermal Diffusion in Silicon

The effects of additional vacancy-like defects on thermal diffusion of B atoms in silicon were investigated by using secondary ion mass spectroscopy. B atoms were introduced into silicon by 30keV B ion implantation at a dose of 2×10¹⁴cm^－2, while the additional vacancy-like defects were produced by two different ways. One was via 40 or 160keV He ion implantation at a dose of 5×10¹⁶cm－2 and followed by an annealing at 800°C for 1h, which produced a well-defined cavity band near the projected range of He ions. The other was via 0.5MeV F or O ion implantation at a dose of 5×10¹⁵cm^－2,which creates excess vacancy-like defects around the 1/2 projected range of F or O ions. Our results clearly show that the additional vacancy-like defects could suppress the boron diffusion during subsequent thermal annealing at 800°C for 30 min. The suppressing effects were found to depend on both the ion type and ion energy. The results were qualitatively discussed in combination with the results obtained by using transmission electron microscopy and Rutherford backscattering spectroscopy.     

Modeling of the transient interstitial diffusion of implanted atoms during low-temperature annealing of silicon substrates

It has been shown that many of the phenomena related to the formation of “tails” in the low-concentration region of ion-implanted impurity distribution are due to the anomalous diffusion of nonequilibrium impurity interstitials. These phenomena include boron implantation in preamorphized silicon, a “hot” implantation of indium ions, annealing of ion-implanted layers et cetera. In particular, to verify this microscopic mechanism, a simulation of boron redistribution during low-temperature annealing of ion-implanted layers has been carried out under different conditions of transient enhanced diffusion suppression. Due to the good agreement with the experimental data, the values of the average migration length of nonequilibrium impurity interstitials have been obtained. It has been shown that for boron implanted into a silicon layer preamorphized by germanium ions the average migration length of impurity interstitials at the annealing temperature of 800 °C can be reduced from 11 nm to approximately 6 nm due to additional implantation of nitrogen. The further shortening of the average migration length is observed if the processing temperature is reduced to 750 °C. It is also found that for implantation of BF₂${\mathrm{BF}}_2$ ions into silicon crystal, the value of the average migration length of boron interstitials is equal to 7.2 nm for thermal treatment at a temperature of 800 °C.     

InSb中离子注入二次缺陷研究

本文用平面的透射电子显微术(TEM)、剖面的透射电子显微术(XTEM)以及卢瑟福背散射和沟道谱(RBS),研究InSb中离于注入Zn⁺,Mg⁺,Be⁺产生的二次缺陷。以及它们的退火特性。结果表明,轻离子Be⁺注入产生的二次缺陷比重离子Zn⁺注入产生的要少得多,而Mg⁺离子介于Be⁺离子和Zn⁺离子之间,在中等剂量下(1×10¹³cm^-2附近),注入损伤并不严重,而且容易恢复。从360℃到440℃之间作了退火温度的研究。从研究结果发现,退火温度以360℃为佳。离子注入InSb中的二次缺陷的形貌与Si中的不同,InSb中的二次缺陷以位错网为主,位错环所占比例不大且尺寸较小,而沉淀物和层错四面体也出现在其中。 关键词：     

Recrystallization and formation of spheroidal gold particles in amorphous-like AlN–TiB<Subscript>2</Subscript>–TiSi<Subscript>2</Subscript> coatings after annealing and subsequent implantation

The recrystallization of the structure of an X-ray amorphous AlN–TiB₂–TiSi₂ coating containing short-range order regions with characteristic sizes of 0.8–1.0 nm has been performed using a negative gold ion (Au^–) beam and high-temperature annealing. Direct measurements using methods of high-resolution transmission electron microscopy (HRTEM) and energy-dispersive X-ray spectral (EDXS) microanalysis have demonstrated that thermal annealing at a temperature of 1300°C in air results in the formation of nanoscale (10–15 nm) phases AlN, AlB₂, Al₃O₃, and TiO₂, whereas the ion implantation of negative ions Au^– leads to a fragmentation (decrease in the size) of nanograins to 2–5 nm with the formation of spheroidal gold nanocrystallites a few nanometers in size, as well as to the formation of an amorphous oxide film in the depth (near-surface layer) of the coating due to ballistic ion mixing and collision cascades.     

Ti--Al based ohmic contacts to n-type 6H-SiC with P+ ion implantation

The Ti--Al ohmic contact to n-type 6H-SiC has been fabricated. An array of TLM (transfer length method) test patterns with Au/Ti/Al/Ti/SiC structure is formed on N-wells created by P⁺ ion implantation into Si-faced p-type 6H-SiC epilayer. The specific contact resistance \rho _c as low as 8.64×10^-6\Omega\cdot cm² is achieved after annealing in N₂ at 900℃ for 5\,min. The sheet resistance R_sh of the implanted layers is 975\Omega/\sqcap\!\!\!\!\sqcup. X-ray diffraction (XRD) analysis shows the formation of Ti_-3SiC₂ at the metal/n-SiC interface after thermal annealing, which is responsible for the low resistance contact.     

Residual defects in high-energy B-, P- and As-implanted Si by rapid thermal annealing

The annealing behavior of secondary defects generated in 2 MeV B- and P-, and 1 MeV As-implanted (100) Si with a dose of 5×10¹⁴ ions/cm² has been investigated after rapid thermal annealing (RTA) treatment using cross-sectional TEM observations. The results are compared with ones obtained by furnace annealing (FA) treatment. RTA is more effective than FA for the defect density reduction of deep defects existing beyond 2 m depths from the surface in B- and P-implanted layers. However, when a dislocation loop diameter is close to the substrate surface, as in the case of As implantation, the loops climb up to the surface by 1250 °C RTA. Moreover, repeated RTA is effective for the suppression of secondary defect growth in B- and P-implanted layers, while there is no difference in defect density or configuration for As implantation between repeated and simple RTA.     

Dosimetry techniques

The formation and annealing of defects in ion implanted silicon dioxide layers and in connection with them the refractive index change are of high interest for the production of electronic and integrated optical devices.

Several studies have shown that the ion implantation in fused silica leads to a compaction of the material and in consequence to an increasing of the refractive index.^1–6 On the other hand the defect formation in crystalline quartz is connected with a decreasing of the refractive index up to nearly the same value for ion implanted quartz and fused silica layers in the high dose region.^1,5 On the base of this effects optical waveguides had been produced by ion implantation in both material.^2,7–12 However, the nature of the mechanisms responsible for the defect formation and for the changes of the optical properties are not well understood.

This paper reports on the ion dose and annealing temperature dependence of several defects in connection with the refractive index change.