Preparation of microcrystalline silicon solar cells on microcrystalline silicon carbide window layers grown with HWCVD at low temperature

N-type microcrystalline silicon carbide layers prepared by hot-wire chemical vapor deposition were used as window layers for microcrystalline silicon n–i–p solar cells. The microcrystalline silicon intrinsic and p-layers of the solar cells were prepared with plasma-enhanced chemical vapor deposition at a very high frequency. Amorphous silicon incubation layers were observed at the initial stages of the growth of the microcrystalline silicon intrinsic layer under conditions close to the transition from microcrystalline to amorphous silicon growth. ‘Seed layers’ were developed to improve the nucleation and growth of microcrystalline silicon on the microcrystalline silicon carbide layers. Raman scattering measurement demonstrates that an incorporation of a ‘seed layer’ can drastically increase the crystalline volume fraction of the total absorber layer. Accordingly, the solar cell performance is improved. The correlation between the cell performance and the structural property of the absorber layer is discussed. By optimizing the deposition process, a high short-circuit current density of 26.7 mA/cm² was achieved with an absorber layer thickness of 1 μm, which led to a cell efficiency of 9.2%.     

Effect of ex-situ hydrogen passivation on the structural properties of e-beam evaporated amorphous silicon thin film for solar cell applications

Thin-film photovoltaics greatly reduce the semiconductor material content in the finished product, using 150–200 times less material as compared with conventional Si wafer based cells. Electron beam evaporation (e-beam), a non-ultra-high vacuum technique has the potential for being inexpensive, and simpler process for a-Si deposition. It offers specific advantages such as high Si deposition rate (up to 1 μm/min), excellent Si source material usage, avoidance of toxic gases, and simple sample preparation conditions. In this work, we report the growth of a-Si films using e-beam at a growth rate exceeding 30 Å/s (1–5 Å/s for conventional PECVD process). We report the effect of hydrogen passivation on amorphous silicon network and on silicon-bonded hydrogen configuration under ex-situ hydrogenation in hydrogen plasma. The hydrogen concentration and silicon-hydrogen bonding configuration was evaluated using nuclear reaction analysis (NRA) and Fourier transform infrared spectroscopy (FTIR). Hydrogen plasma treatment shows an increase in the monohydride bond concentration with substrate temperature, and is corroborated by our FTIR investigation, in addition to reducing clustered monohydride bonds or polyhydride bonds in a-Si:H film. Raman analysis indicates reduction in silicon bond angle as well as the bond distance, both leading to significant structural improvement in short-range and medium range order in the amorphous phase. Thus, ex-situ hydrogenation clearly demonstrates the possibility of comparable hydrogen passivation in e‐beam evaporated a-Si films with high growth rate. One can easily extrapolate this result to microcrystalline film growth, assuming the structural improvement of the silicon network preceding the microcrystalline nucleation, where ex-situ passivation is most effective. Thus ex-situ hydrogenation opens up new possibilities in minutely tailoring the a:Si film properties especially for solar cell applications.     

Optical properties of microcrystalline 3C–SiC:H films measured by resonant photothermal bending spectroscopy

Optical absorption coefficient spectra of hydrogenated microcrystalline cubic silicon carbide (μc-3C–SiC:H) films prepared by Hot-Wire CVD method have been estimated for the first time by resonant photothermal bending spectroscopy (resonant-PBS). The optical bandgap energy and its temperature coefficient of μc-3C–SiC:H film is found to be about 2.2 eV and 2.3 × 10⁻⁴ eV K⁻¹, respectively. The absorption coefficient spectra of localized states, which are related to grain boundaries, do not change by exposure of air and thermal annealing. The localized state of μc-3C–SiC:H has different properties for impurity incorporation compared with that of hydrogenated microcrystalline silicon (μc-Si:H) film.     

Deposition of microcrystalline silicon films at ultrafast rate by using a new microwave induced plasma source

Synthesis of microcrystalline silicon (μc-Si) film at an ultrafast deposition rate over 100 nm/s is achieved from SiH₄ + He by using a high density microwave plasma source even without employing H₂ dilution and substrate heating techniques. Systematic deposition studies show that high SiH₄ flow rate and working pressure increase film deposition rate while high He flow rate decreases the rate. On the other hand, crystallinity of deposited Si film decreases with increasing SiH₄ or He flow rate and working pressure. Enhancements of gas phase and surface reactions during film deposition process are responsible for the achievement of high deposition rate and high film crystallinity.     

Fictive temperature measurement of amorphous SiO2 films by IR method

The structure and properties of amorphous materials, in general, change with their thermal history. This is usually explained using the concept of fictive temperature, i.e., the temperature at which the super-cooled liquid state turned into a glassy state. In earlier studies, a simple IR method was used to determine the fictive temperature of silica glasses, both bulk and fiber. In the present study the applicability of the same technique for thin amorphous silica films on silicon was examined. It was found that the IR absorption as well as reflection peak wavenumber of the silica structural band can be used to determine the fictive temperature of amorphous silica films on silicon with an unknown thermal history. Specifically, IR absorbance spectra of an amorphous silica film of thickness greater than 0.5 μm grown on silicon can be taken before and after etching a thin surface layer of 20–30 nm and the peak wavenumber of the difference signal can be compared with the pre-determined calibration curve to convert the peak wavenumber to the fictive temperature. For a film thicker than ∼2 μm, IR reflection peak wavenumber can be converted directly to the fictive temperature of the film by using the calibration curve.     

Optoelectronic properties of hot-wire silicon layers deposited at 100 °C

Hot-wire chemical vapor deposition is employed for the deposition of amorphous and microcrystalline silicon layers at substrate temperature kept below 100 °C with the aid of active cooling of the substrate holder. The hydrogen dilution is varied in order to investigate films at the amorphous-to-microcrystalline transition. While the amorphous layers can be produced with a reasonably low defect density as deduced from subgap optical absorption spectra and a good photosensitivity, the microcrystalline layers are of a lesser quality, most probably due to a decrease of crystallinity during the film growth. In the amorphous growth regime, the Urbach energy values decrease with increasing hydrogen dilution, reaching a minimum of 67 meV just before the microcrystalline threshold. By varying the total gas pressure, the growth rate of the films is changed. The lowest deposition rate of this study (0.16 nm/s) produced the amorphous sample with the highest photoresponse (1 × 10⁶).     

Mapping of mechanical stress in silicon thin films on silicon cantilevers by Raman microspectroscopy

We have used plasma enhanced chemical vapor deposition (PECVD) to deposit silicon thin films (～0.2–1 μm) with different crystallinity fractions on Nanosensors PtIr5 coated atomic force microscopy (AFM) cantilevers (450 × 50 × 2 μm³). Microscopic measurements of Raman scattering were used to map both internal stress and extrinsic stress induced in the films by bending the cantilevers using a nanomanipulator (Kleindiek Nanotechnik MM3A). Thanks to the excellent elasticity of the cantilevers, the films could be bent to curvature radii down to 300 μm. We observed the stress induced shift of the TO–LO phonon Raman band of more than 3 cm^?1 for fully microcrystalline film corresponding to the stress ～0.8 GPa. The shift of the similar film with amorphous structure was ～2.5 cm^?1.     

Argon-plasma-induced growth of crystalline grains in microcrystalline silicon: Formation mechanism of grains

A thick (∼300 nm) microcrystalline silicon (μc-Si:H) film with a low crystalline volume fraction (∼24%) and a columnar grain size of about 100 nm was exposed to an argon plasma at a substrate temperature of 220 °C after deposition. It is shown that argon plasma treatment significantly enhances film-crystallinity throughout the μc-Si:H layer: over a factor of 2 in crystalline fraction and by a factor of 3 in columnar grain size after a 90-min argon treatment. Based on these experimental results, it is proposed that crystallization of μc-Si:H is likely mediated by the energy transferred from energetic argon atoms.     

The application of very high frequency inductively coupled plasma to high-rate growth of microcrystalline silicon films

High-rate growth of microcrystalline silicon films (μc-Si:H) from inductively coupled plasma (ICP) of H₂ diluted SiH₄ generated with a very high frequency (VHF: 60 MHz) power source has been studied from the viewpoint of efficient gas dissociation. From the VHF power and gas pressure dependences of the film growth rate and optical emission intensities, we have found that the Si and SiH emission intensities and the intensity ratio of H_α to SiH are good indicators for the film growth rate and crystallinity, respectively. The generation rate of film precursors is reflected by the Si and SiH emission intensities while the flux ratio of atomic hydrogen to film precursors, which plays an important role on the structural relaxation for the crystalline network formation, is characterized by the intensity ratio of H_α to SiH. An increase in SiH emission while keeping the intensity ratio of H_α to SiH at a certain level enables us to enhance the film growth rate without significant deterioration in the crystallinity. In this study, a growth rate as high as 10 nm/s was obtained for highly crystallized films.     

Characteristics of p-type nanocrystalline silicon thin films developed for window layer of solar cells

Different rf-power and chamber pressures have been used to deposit boron doped hydrogenated silicon films by the PECVD method. The optoelectronic and structural properties of the silicon films have been investigated. With the increase of power and pressure the crystallinity of the films increases while the absorption decreases. As a very thin p-layer is needed in p–i–n thin film solar cells the variation of properties with film thickness has been studied. The fraction of crystallinity and thus dark conductivity vary also with the thickness of the film. Conductivity as high as 2.46 S cm⁻¹ has been achieved for 400 Å thin film while for 3000 Å thick film it is 21 S cm⁻¹. Characterization of these films by XRD, Raman Spectroscopy, TEM and SEM indicate that the grain size, crystalline volume fraction as well as the surface morphology of p-layers depend on the deposition conditions as well as on the thickness of the film. Optical band gap varies from 2.19 eV to 2.63 eV. The thin p-type crystalline silicon film with high conductivity and wide band gap prepared under high power and pressure is suitable for application as window layer for Silicon thin film solar cells.     

Properties of thin-film silicon solar cells at very high irradiance

The focussed beam of a low-power helium–neon laser is used to study accelerated light-induced degradation (Staebler–Wronski effect) and high steady-state photocarrier generation rates in amorphous and microcrystalline silicon thin-film solar cells, at up to 13 MW m^? 2 irradiance. Even at these high power densities, COMSOL® simulations indicate that heat diffusion into the substrate, aided by spreading conduction via the Ag back-contact, restricts the temperature rise to less than 14 °C. Short-circuit current may be measured directly, and the I–V characteristic estimated by taking into account shunting by the inactive part of the cell. The improved resistance to degradation of microcrystalline silicon cells is shown to persist to high irradiance. Computer simulations of an amorphous silicon solar cell are presented that are consistent with measured un-degraded and degraded properties, and offer insight into prevailing defect creation processes and carrier recombination mechanisms.     

Effect of thermal annealing and hydrogen-plasma treatment in boron-doped microcrystalline silicon

We have investigated the effects of temperature (during film growth and post-deposition thermal annealing) and H₂-plasma treatment on the electronic and structural properties of p-type microcrystalline silicon films (p-μc-Si:H) for solar cell applications. The highest dark conductivity is obtained in the thermally annealed p-μc-Si:H prepared at low substrate temperature of 50 °C. This dark conductivity is decreased by two orders of magnitude when the film is exposed to H₂-plasma, being completely restored after thermal annealing. Namely, reversible dual-conductivity cycle is observed between thermally annealed state and H₂-plasma-treated state in p-μc-Si:H. The dual-conductivity cycle is accompanied with the reversible change in the infrared-absorption spectrum at around 1845 cm^? 1 assigned as SiHB complex in p-μc-Si:H network structure. Taking into account of the reversible structural change by H₂-plasma-exposure and thermal-annealing cycles, necessary process-procedure condition has been proposed for obtaining high photovoltaic performance in thin-film-Si solar cells with high quality p-μc-Si:H.     

Influence of crystalline volume fraction on the performance of high mobility microcrystalline silicon thin-film transistors

The influence of the crystalline volume fraction of hydrogenated microcrystalline silicon on the device performance of thin-film transistors fabricated at temperatures below 200 °C was investigated. Transistors employing microcrystalline silicon channel material prepared close to the transition to amorphous growth regime exhibit the highest charge carrier mobilities exceeding 50 cm²/V s. The device parameters like the charge carrier mobility, the threshold voltage and the subthreshold slope will be discussed with respect to the crystalline volume fraction of the intrinsic microcrystalline silicon material.     

A narrow process window for the preparation of polytypes of microcrystalline silicon carbide thin films by hot-wire CVD method

Effects of deposition conditions on the structure of microcrystalline silicon carbide (μc-SiC) films prepared by hot-wire chemical vapor deposition (hot-wire CVD) method have been investigated. It is found from X-ray diffraction patterns of the film that a diffraction peak from crystallites from hexagonal polytypes of SiC is observed in addition to those of 3 C-SiC crystallites. This result is obtained in the film under a narrow deposition conditions of SiH₃CH₃ gas pressure of 8 Pa, the H₂ gas pressure of 80–300 Pa and the total gas pressure of 40–300 Pa under fixed substrate and filament temperatures employed in this study. Furthermore, the grain size of hexagonal crystallites (about 20 nm) on c-Si substrates becomes larger than that of 3 C-SiC crystallites (about 10 nm) for the films deposited under the total gas pressure of 36–88 Pa. The fact that microcrystalline hexagonal SiC can be deposited under limited deposition conditions could be interpreted in the context of a result for c-SiC polytypes prepared by thermal CVD method.     

Infrared semiconductor laser irradiation used for crystallization of silicon thin films

We report the rapid thermal crystallization of silicon films using infrared semiconductor laser. Carbon films were used on silicon films to absorb the laser light. Uniform crystalline regions were achieved by a line shape laser beam with a length of 20 μm. Polycrystalline silicon thin film transistors were fabricated in crystallized regions. The effective electron carrier mobility and threshold voltage were achieved to be 130 cm²/Vs and 0.4 V, respectively, when the crystalline volume ratio of the silicon films was 0.95.     

Toward the fast deposition of highly crystallized microcrystalline silicon films with low defect density for Si thin-film solar cells

In this study, employing a high-density, low-temperature SiH₄–H₂ mixture microwave plasma, we investigate the influence of source gas supply configuration on deposition rate and structural properties of microcrystalline silicon (μc-Si) films, and demonstrate the plasma parameters for fast deposition of highly crystallized μc-Si films with low defect density. A fast deposition rate of 65 Å/s has been achieved for a SiH₄ concentration of 67% diluted in H₂ with a high Raman crystallinity of X_c > 65% and a low defect density of (1–2) × 10¹⁶ cm⁻³ by adjusting source gas supply configuration and plasma conditions. A sufficient supply of deposition precursors, such as SiH₃, as well as atomic hydrogen H on film growing surface is effective for the high-rate synthesis of highly crystallized μc-Si films, for the reduction in defect density, and for the improvement in film homogeneity and compactability. A preliminary result of p–i–n structure μc-Si thin-film solar cells using the resulting μc-Si films as an intrinsic absorption layer is presented.     

Hydrothermal synthesis of BaTiO3 thin films on nanoporous TiO2 covered Ti substrates

It is well known that there is an upper limit (<0.25 μm) for the thickness of hydrothermal thin films grown on Ti substrate in the 100–200 °C temperature range, even the reaction time is extended to several weeks. In this paper, BaTiO₃ thin films have been firstly hydrothermally synthesized on titanium substrates covered with a nanoporous TiO₂ layer. By using TiO₂ covered substrates, the thickness of BaTiO₃ films can easily reach ∼1.0 μm at 110 °C after only 2 h hydrothermal treatment. It is found that the large quantity of pores with size at the tens of nanometer range in the oxide layer served as easy paths for the diffusion of Ba²⁺ and OH⁻ and enabled the film grow thicker. SEM and XRD results show that the films are crack-free and in polycrystalline phase.     

Low concentrator hetero-junction microcrystalline silicon solar cells

Multi-junction silicon-based thin-film solar cells are attractive materials for further cost-reduction and high efficiency. Meanwhile, it is also well considered that a concentrator solar cell is another alternative approach to enhance the conversion efficiency. In concentrator solar cells, the photocurrent linearly increases with the concentration ratio of incident light. At the same time, the open-circuit voltage (V_oc) of solar cells increases logarithmically with the photocurrent. This leads to an increase in efficiency with increasing sunlight intensity.We proposed a novel hetero-junction structure microcrystalline silicon (μc-Si:H) solar cell structure using wide-gap microcrystalline silicon oxide (μc-Si_1 ? xO_x:H) as p-layer and it has some advantages over conventional homo-junction μc-Si:H solar cells under low concentrations. It was observed that wide-gap doped layers can reduce carrier recombination rate especially in p-layer and at the p/i interface and V_oc enhancement with increasing light intensity improves as the band gap of p-layer is increased. Our best solar cell has efficiencies of 9.2% at 1 sun and 10.4% at 11.8 suns. We also investigated the degradation behavior of hetero-junction μc-Si:H solar cells. The degradation in efficiency for this type of solar cell was less than 6%. Therefore, hetero-junction μc-Si:H solar cell is the promising alternative for low-light concentration.     

ZnO growth on Si with low-temperature ZnO buffer layers by ECR-assisted MBE

High-quality ZnO films were grown on Si(1 0 0) substrates with low-temperature (LT) ZnO buffer layers by an electron cyclotron resonance (ECR)-assisted molecular-beam epitaxy (MBE). In order to investigate the optimized buffer layer temperature, ZnO buffer layers of about 1.1 μm were grown at different growth temperatures of 350, 450 and 550 °C, followed by identical high-temperature (HT) ZnO films with the thickness of 0.7 μm at 550 °C. A ZnO buffer layer with a growth temperature of 450 °C (450 °C-buffer sample) was found to greatly enhance the crystalline quality of the top ZnO film compared to others. The root mean square (RMS) roughness (3.3 nm) of its surface is the smallest, compared to the 350 °C-buffer sample (6.7 nm), the 550 °C-buffer sample (7.4 nm), and the sample without a buffer layer (6.8 nm). X-ray diffraction (XRD), photoluminescence (PL) and Raman scattering measurements were carried out on these samples at room temperature (RT) in order to characterize the crystalline quality of ZnO films. The preferential c-axis orientations of (0 0 2) ZnO were observed in the XRD spectra. The full-width at half-maximum (FWHM) value of the 450 °C-buffer sample was the narrowest as 0.209°, which indicated that the ZnO film with a buffer layer grown at this temperature was better for the subsequent ZnO growth at elevated temperature of 550 °C. Consistent with these results, the 450 °C-buffer sample exhibits the highest intensity and the smallest FWHM (130 meV) of the ultraviolet (UV) emission at 375 nm in the PL spectrum. The ZnO characteristic peak at 438.6 cm⁻¹ was found in Raman scattering spectra for all films with buffers, which is corresponding to the E₂ mode.     

Erbium- and ytterbium-doped sol–gel SiO2–HfO2 crack-free thick films onto silica on silicon substrate

Aware of the difficulties in applying sol–gel technology on the preparation of thin films suitable for optical devices, the present paper reports on the preparation of crack-free erbium- and ytterbium-doped silica: hafnia thick films onto silica on silicon. The film was obtained using a dispersion of silica-hafnia nanoparticles into a binder solution, spin-coating, regular thermal process and rapid thermal process. The used methodology has allowed a significant increase of the film thickness. Based on the presented results good optical-quality films with the required thickness for a fiber matching single mode waveguide were obtained using the erbium- and ytterbium-activated sol–gel silica:hafnia system. The prepared film supports two transversal electric modes at 1550 nm and the difference between the transversal electric mode and the transversal magnetic mode is very small, indicating low birefringence. Photoluminescence of the ⁴I_13/2 → ⁴I_15/2 transition of erbium ions shows a broad band centered at 1.53 μm with full width at a half maximum of 28 nm. Up-conversion emission was carried out under different pump laser powers, and just one transition at red region was observed.