Deceleration of surface structural relaxation in chlorine-containing silica glass due to chlorine volatilization

Both surface and bulk fictive temperatures of chlorine-containing silica glass were measured using the IR method, after thermal, mechanical and chemical treatments. A metastable equilibrium state at 1200 °C was first established for the glass by heat-treatment and a uniform fictive temperature was observed except for the sample surface created by polishing after the heat-treatment. The densified layer of the polished surface shifted the IR peak wavenumber, making the fictive temperature appear higher than the bulk. During the second heat-treatment at 950 °C, the sample with the as-heat-treated surface and uniform fictive temperature of 1200 °C developed non-uniform fictive temperature distribution with the bulk fictive temperature becoming lower than the surface fictive temperature. Usually, surface structural relaxation is faster than bulk structural relaxation and the surface fictive temperature becomes lower than the bulk fictive temperature when heat-treated at a lower temperature than the initial fictive temperature. The observed anomalous feature was attributed to chlorine volatilization from the glass surface layer creating a high viscosity surface layer. This conclusion was supported by the diffusion data of chlorine in the glass available in the literature.     

Simulation of surface structural relaxation kinetics in silica glass accelerated by water vapor

It is known that surface structural relaxation of silica glass takes place more rapidly than bulk structural relaxation, especially in the presence of water vapor. The effect of water vapor pressure, heat-treatment temperature and initial fictive temperature on the surface structural relaxation kinetics in silica glasses was investigated by measuring the change of the surface fictive temperature determined from the IR reflection peak shift of silica structural bands. The superimposed component of bulk structural relaxation was subtracted from the measured surface structural relaxation data to isolate the true surface structural relaxation kinetics. The obtained surface structural relaxation data as a function of fictive temperature, heating temperature and water vapor pressure were simulated with a model based on the diffusion equation with time-dependent surface concentration. The simulation model was used to predict the surface structural relaxation kinetics of the optical fiber having a high fictive temperature of ～ 1650 °C at 950 °C under 355 torr of water vapor, and it was confirmed that the present model can simulate surface structural relaxation of the fiber reasonably well.     

Infrared semiconductor laser irradiation used for crystallization of silicon thin films

We report the rapid thermal crystallization of silicon films using infrared semiconductor laser. Carbon films were used on silicon films to absorb the laser light. Uniform crystalline regions were achieved by a line shape laser beam with a length of 20 μm. Polycrystalline silicon thin film transistors were fabricated in crystallized regions. The effective electron carrier mobility and threshold voltage were achieved to be 130 cm²/Vs and 0.4 V, respectively, when the crystalline volume ratio of the silicon films was 0.95.     

Mapping of mechanical stress in silicon thin films on silicon cantilevers by Raman microspectroscopy

We have used plasma enhanced chemical vapor deposition (PECVD) to deposit silicon thin films (～0.2–1 μm) with different crystallinity fractions on Nanosensors PtIr5 coated atomic force microscopy (AFM) cantilevers (450 × 50 × 2 μm³). Microscopic measurements of Raman scattering were used to map both internal stress and extrinsic stress induced in the films by bending the cantilevers using a nanomanipulator (Kleindiek Nanotechnik MM3A). Thanks to the excellent elasticity of the cantilevers, the films could be bent to curvature radii down to 300 μm. We observed the stress induced shift of the TO–LO phonon Raman band of more than 3 cm^?1 for fully microcrystalline film corresponding to the stress ～0.8 GPa. The shift of the similar film with amorphous structure was ～2.5 cm^?1.     

Generating ordered Si nanocrystals via atomic force microscopy

We describe two successful routes for generating ordered arrays of Si nanocrystals by using atomic force microscopy (AFM) and amorphous silicon thin films (200–400 nm) on Ti/Ni coated glass substrates. First, we show that field-enhanced metal-induced solid phase crystallization at room temperature can be miniaturized to achieve highly spatially localized (below 100 nm) current-induced crystallization of the amorphous silicon films using a sharp tip in AFM. In the second route, resistive nano-pits are formed at controlled positions in the amorphous silicon thin films by adjusting (lowering and/or stabilizing) the exposure currents in the AFM process. Such templated substrates are further used to induce localized growth of Si nanocrystals in plasma-enhanced chemical vapor deposition process. In both cases the crystalline phase is identified in situ as features of enhanced current in current-sensing AFM maps.     

Erbium- and ytterbium-doped sol–gel SiO2–HfO2 crack-free thick films onto silica on silicon substrate

Aware of the difficulties in applying sol–gel technology on the preparation of thin films suitable for optical devices, the present paper reports on the preparation of crack-free erbium- and ytterbium-doped silica: hafnia thick films onto silica on silicon. The film was obtained using a dispersion of silica-hafnia nanoparticles into a binder solution, spin-coating, regular thermal process and rapid thermal process. The used methodology has allowed a significant increase of the film thickness. Based on the presented results good optical-quality films with the required thickness for a fiber matching single mode waveguide were obtained using the erbium- and ytterbium-activated sol–gel silica:hafnia system. The prepared film supports two transversal electric modes at 1550 nm and the difference between the transversal electric mode and the transversal magnetic mode is very small, indicating low birefringence. Photoluminescence of the ⁴I_13/2 → ⁴I_15/2 transition of erbium ions shows a broad band centered at 1.53 μm with full width at a half maximum of 28 nm. Up-conversion emission was carried out under different pump laser powers, and just one transition at red region was observed.     

Characteristics of p-type nanocrystalline silicon thin films developed for window layer of solar cells

Different rf-power and chamber pressures have been used to deposit boron doped hydrogenated silicon films by the PECVD method. The optoelectronic and structural properties of the silicon films have been investigated. With the increase of power and pressure the crystallinity of the films increases while the absorption decreases. As a very thin p-layer is needed in p–i–n thin film solar cells the variation of properties with film thickness has been studied. The fraction of crystallinity and thus dark conductivity vary also with the thickness of the film. Conductivity as high as 2.46 S cm⁻¹ has been achieved for 400 Å thin film while for 3000 Å thick film it is 21 S cm⁻¹. Characterization of these films by XRD, Raman Spectroscopy, TEM and SEM indicate that the grain size, crystalline volume fraction as well as the surface morphology of p-layers depend on the deposition conditions as well as on the thickness of the film. Optical band gap varies from 2.19 eV to 2.63 eV. The thin p-type crystalline silicon film with high conductivity and wide band gap prepared under high power and pressure is suitable for application as window layer for Silicon thin film solar cells.     

Characterization of pure ZnO thin films prepared by a direct photochemical method

In this paper, amorphous ZnO thin films were obtained by direct UV irradiation of β-diketonate Zn(II) precursor complexes spin-coated on Si(1 0 0) and fused silica substrates. ZnO films were characterized by means of XPS, X-ray diffraction (XRD) and Atomic Force Microscopy (AFM). These analyses revealed that as-deposited films are amorphous and have a rougher surface than thermally treated films. Optical characterization of the films showed that these are highly transparent in the visible spectrum with an average transmittance of up to 95% over 400 nm, and an optical band-gap energy of 3.21 eV for an as-deposited film, and 3.27 eV for a film annealed at 800 °C. Low resistivity values were obtained for the ZnO films (1.0 × 10⁻² Ω cm) as determined by Van der Pauw four-point probe method.     

Fictive temperature measurement of alumino-silicate glasses using IR spectroscopy

A simple IR reflection method was used in a previous study to determine the fictive temperature of silica glasses and a soda-lime glass. The IR method is based upon the fact that the silica structural band of a glass takes a unique wavenumber at a particular fictive temperature. When this method was applied to an alumino-silicate glass in this study, however, the IR reflection peak wavenumber of the glass surface was found to be strongly affected by the reaction of the glass with water vapor in the atmosphere. Still, it was possible to measure the fictive temperature of the alumino-silicate glass using IR spectroscopy by taking an IR reflection of the bulk sample after eliminating the surface layer affected by the reaction with water vapor. The IR peak wavenumber of the silica structural band decreased with increasing fictive temperature for the alumino-silicate glass, similar to silica glass.     

Irradiation effects on the absorption edge of silica glass

Vacuum ultraviolet absorption experiments were carried out on a variety of specimens of amorphous silica β-irradiated at different doses from ∼10³ to 5 × 10⁶ kGy. Changes in the width of the absorption (Urbach) edge were investigated. These changes strongly depend on the kind of silica considered: in particular the Urbach energy of silica of industrial manufacture increases in the irradiated samples, whereas in sol–gel silica it is poorly influenced by the irradiation. The fictive temperature of the different materials before and after irradiation was also monitored. The changes of the Urbach energy and of the fictive temperature are tentatively discussed considering the disorder degree induced by irradiation.     

Transition from amorphous semiconductor to amorphous insulator in hydrogenated carbon–germanium films investigated by IR spectroscopy

Thin a-Ge_XC_1?X:H plasma polymerized films, depending on deposition conditions, can be produced in two very different structures, namely amorphous semiconductor and amorphous insulator. The transition from amorphous insulator to amorphous semiconductor is related to the formation of germanium nanoclusters due to ions bombarding the surface of the growing material. This paper concentrates on investigations of the transition by means of IR spectroscopy. To this end a quantitative analysis of IR spectra obtained for thin films deposited on silicon substrate has been described and used for estimation of hydrogen atom concentration and bonding in the investigated material. It was found that the probability that a given H atom is bonded to a germanium or to a carbon atom is almost the same. This conclusion is true both for a-S and a-I films. The average concentration of hydrogen in the investigated material was found to be about 2.4–3.4 × 10²² cm^?2 which means that there are two times more atoms of the carbon family than hydrogen atoms in the film structure.     

Spectroscopic ellipsometry study of nickel induced crystallization of a-Si

The aim of this work is to present a spectroscopic ellipsometry study focused on the annealing time effect on nickel metal induced crystallization of amorphous silicon thin films. For this purpose silicon layers with 80 and 125 nm were used on the top of which a 0.5 nm Ni thick layer was deposited. The ellipsometry simulation using a Bruggemann Effective Medium Approximation shows that films with 80 nm reach a crystalline fraction of 72% after 1 h annealing, appearing to be full crystallized after 2 h. No significant structural improvement is detected for longer annealing times. On the 125 nm samples the crystalline volume fraction after 1 h is only around 7%, requiring 5 h to get a similar crystalline fraction than the one achieved with the thinner film. This means that the time required for full crystallization will be strongly determined by the Si layer thickness. Using a new fitting approach the Ni content within the films was also determined by SE and related to the silicon film thickness.     

Insights into effects of annealing on microstructure from SnO2 thin films prepared by pulsed delivery

Tin dioxide thin films were prepared by pulsed laser deposition techniques on clean glass substrates, and the thin films were then annealed for 30 min from 50 to 550 °C with a step of 50 °C, respectively. The influence of the annealing temperature on the microstructural and morphological properties of the tin dioxide thin films was investigated using X-ray diffraction, scanning electron microscopy, transmission electron microscopy and selected area electron diffraction. The experimental results showed that the amorphous microstructure almost transformed into a polycrystalline tin dioxide phase exhibiting a preferred orientation related to the (1 1 0), (1 0 1) and (2 1 1) crystal planes with increased temperatures. The thin film annealed at 200 °C demonstrated the best crystalline properties, viz. optimum growth conditions. However, the thin film annealed at 100 °C revealed the minimum average root-mean-square roughness of 20.6 nm with average grain size of 26.6 nm. These findings indicate that the annealing temperature is very important parameter to determining the thin film quality, which involves the phase formation, microstructure and preferred orientation of the thin films.     

Fabrication and ionic conductivity of amorphous Li–Al–Ti–P–O thin film

Li⁺ ion conducting Li–Al–Ti–P–O thin films were fabricated on ITO-glass substrates at various temperatures from 25 to 400 °C by RF magnetron sputtering method. When the substrate temperature is higher than 300 °C, severe destruction of ITO films were confirmed by XRD (X-ray diffraction) and the abrupt transformation of one semi-circle into two semi-circles on the impedance spectra. These as-deposited Li–Al–Ti–P–O solid state electrolyte thin films have an amorphous structure confirmed by XRD and a single semicircle on the impedance spectra. Good transmission higher than 80% in the visible light range of these electrolyte thin films can fulfill the demand of electro-chromic devices. Field emission scanning electron microscopy and atomic force microscopy showed the denser, smoother and more uniform film structure with the enhanced substrate temperature. Measurements of impedance spectra indicate that the gradual increased conductivity of these Li–Al–Ti–P–O thin films with the elevation of substrate temperature from room temperature to 300 °C is originated from the increase of the pre-exponential factor (σ₀). The largest Li-ion conductivity can come to 2.46 × 10^? 5 S cm^? 1. This inorganic solid lithium ion conductor film will have a potential application as an electrolyte layer in the field such as lithium batteries or all-solid-state EC devices.     

Amorphous to crystalline transition and optoelectronic properties of nanocrystalline indium tin oxide (ITO) films sputtered with high rf power at room temperature

ITO thin films were deposited on quartz substrates by the rf sputtering technique using various rf power keeping the substrates at room temperature. The influence of rf power on the structural, electrical, optical and morphological properties was studied by varying the rf power in the range 50–350 W. X-ray diffraction results show an amorphous – crystalline transition with nano grains. At a power of 250 W, the ITO film showed preferential orientation along (4 0 0) peak. It is observed from the optical transmission studies that the optical band gap increased from 3.57 to 3.69 eV when the rf power was increased from 50 to 250 W. The resistivity value is minimum and grain size is maximum for the ITO film deposited at 250 W. The X-ray photoelectron spectroscopy (XPS), Energy dispersive X-ray (EDX) and Atomic force microscopy AFM results confirm that the ITO films are stoichiometric and the surface contained nano-sized grains distributed uniformly all over the surface. It can be concluded that the ITO film deposited at room temperature with 250 W rf power, can provide the required optical and electrical properties useful for developing optoelectronic devices at lower temperatures.     

Properties of thin film silicon,prepared at high growth rate in a wide range of thicknesses

Preparation of thin film silicon at high growth rate is an important target for its application in solar cells. The properties of hydrogenated microcrystalline silicon, prepared with the help of PECVD multi-hole cathode in a high pressure and depletion regime in a wide range of thicknesses are described in detail. We illustrate the surprising result that we can prepare high growth rate microcrystalline silicon from 0.4 up to 30 μm thickness without great peel-off problems. The room temperature dark DC conductivity, as well as the crystallinity, increased up to 5 μm film thickness and then started to decrease again. These results are explained by the initial temperature profiling and a thickness-induced increase of the lateral inhomogeneity.     

PECVD a-Sic:H Young’s modulus obtained by MEMS resonant frequency

In this paper we study the Young’s modulus of PECVD obtained silicon rich (x > 0.5) a-Si_xC_1?x:H thin films through the study of the resonance frequency of free standing cantilevers. These structures are fabricated based on front side bulk micromachining of Si substrate and actuated thermally. In this approach, an alternating electric current passes through a photolithography patterned metallic film deposited on the cantilever, heating the structure by Joule effect and inducing vibrations on the cantilever. This method of actuation is independent of the separation between the structure and substrate, which is its main advantage, because it allows the actuation of cantilevers that are bent upwards or downwards, which is an aspect of particular importance in the characterization of PECVD materials for MEMS applications. The work is focused on low stress silicon rich amorphous hydrogenated silicon carbide films obtained by PECVD at low temperatures (320 °C). The measurements were carried out in groups of cantilevers with different length (between 550 and 200 μm) and utilizing a-SiC:H films obtained with three different compositions. The results show that the films exhibit modulus of elasticity in the range of 20–35 GPa, low residual stress (～90 GPa) and maintain excellent chemical inertness in KOH and HF solutions.     

Absorption and luminescence in amorphous SixGe1-xO2 films fabricated by SPCVD

Optical absorption and photoluminescence of Ge-doped silica films fabricated by the surface-plasma chemical vapor deposition (SPCVD) are studied in the 2–8 eV spectral band. The deposited on silica substrate films of about 10 μm in thickness are composed as x·GeO₂-(1-x)·SiO₂ with x ranging from 0.02 to 1. It is found that all as‐deposited films do not luminesce under the excitation by a KrF (5 eV) excimer laser, thus indicating lack of oxygen deficient centers (ODCs) in them. After subsequent fusion of silicon containing (x < 1) films by a scanning focused CO₂ laser beam absorption band centered at 5 eV as well as two luminescence bands centered at blue (3.1 eV) and UV (4.3 eV) wavelengths arise, highlighting the formation of the ODCs. The excitation of unfused SPCVD films by an ArF (6.4 eV) excimer laser yields a luminescence spectrum with two bands typical for the ODCs, but with a faster decay kinetics. Intensities of these bands grow up with samples cooling down to a temperature of 80–60 K. Unfused films excited by the ArF laser also demonstrate luminescence due to recombination of a trapped charge resulted from the excitation of localized electron states of the glass network. In the unfused GeO₂ film luminescence related to a self-trapped exciton (STE) typical for GeO₂ crystals with α-quartz structure is observed. The observed STE luminescence can be indicative of the crystalline fraction availability in the film. Whereas GeO₂ crystals are known as not containing twofold coordinated germanium, a polycrystalline inclusion in the SPCVD GeO₂ film serves as a factor explaining the absence of any spectroscopic manifestation of this type of defects in it even after fusion. On the other hand, lack of STE luminescence in other unfused films with x < 1 testifies truly amorphous state of the matter in them.     

Plasma enhanced chemical vapor deposition of ZnO thin films

Zinc oxide thin films were deposited on silicon and corning-7059 glass substrates by plasma enhanced chemical vapor deposition at different substrate temperatures ranging from 36 to 400 °C and with different gas flow rates. Diethylzinc as the source precursor, H₂O as oxidizer and argon as carrier gas were used for the preparation of ZnO films. Structural and optical properties of these films were investigated using X-ray diffraction, reflection high energy electron diffraction, atomic force microscopy and photoluminescence. Highly oriented films with (0 0 2) preferred planes were obtained on silicon kept at 300 °C with 50 ml/min flow rate of diethylzinc without any post annealing. Reflection high energy electron diffraction pattern also showed the crystalline nature of these films. A textured surface with rms roughness ∼28 nm was observed by atomic force microscopy for the films deposited at 300 °C. A sharp peak at 380 nm in the PL spectra indicated the UV band-edge emission.     

Holographic recording in amorphous chalcogenide thin films

Holographic recording by He–Ne laser (line 632.8 nm) light in amorphous As_0.55Se_0.45 thin films for different film thickness and grating period was studied. A strong dependence of the diffraction efficiency of the gratings on the readout light wavelength (650 nm, 805 nm and 1150 nm) was observed. A decrease in diffraction efficiency for longer wavelengths is explained by a decrease in the photoinduced changes of refractive index. It is shown that high efficiency gratings can be recorded in As_0.55Se_0.45 films with a thickness of ∼1 μm.