低能Pt原子与Pt(111)表面相互作用的分子动力学模拟

利用分子动力学模拟方法详细研究了低能Pt原子与Pt(111)表面的相互作用所导致的表面吸附原子、溅射原子、表面空位的产生及分布规律,给出了表面吸附原子产额、溅射原子产额和表面空位产额随入射Pt原子能量的变化关系.模拟结果显示:溅射产额、表面吸附原子产额和表面空位产额随入射原子的能量的增加而增加,溅射原子、表面吸附原子的分布花样呈3度旋转对称性质;当入射粒子能量高于溅射阈值时,表面吸附原子主要是基体最表面原子的贡献,入射粒子直接成为表面吸附原子的概率很小.其主要原因是:当入射粒子能量高于溅射能量阈值时,入射 关键词： 分子动力学 低能粒子 表面原子产额 空位缺陷 溅射     

低能原子沉积在Pt(111)表面的分子动力学模拟

采用嵌入原子方法的原子间相互作用势,利用分子动力学方法模拟了六种贵金属原子(Ni,Pd,Pt,Cu,Ag,Au)分别在Pt(111)表面低能沉积的动力学过程.结果表明:随着入射能量从0.1eV升高到200eV,基体表面原子是按层迁移的,沉积过程对基体表面的影响和沉积原子在基体表层的作用均存在两个转变能量(ET1≈5eV,ET2≈70eV).当入射能量低于5eV时,基体表面几乎没有吸附原子和空位形成,沉积原子在基体表层几乎没有注入产生;当入射能量在5—70eV范围内时,沉积原子在基体表层有注入产生,其注入深度小于两个原子层,即为亚注入,此时吸附原子主要由基体表层原子形成,基体表面第三层以下没有空位形成;当入射能量高于70eV时,沉积原子的注入深度大于两个原子层,将会导致表面以下第三层形成空位,并且空位产额随入射能量的升高而急剧增加.基于分子动力学模拟的结果,对低能沉积作用下的薄膜生长以及最优沉积参数的选择进行了讨论.     

Pt(111)表面低能溅射现象的分子动力学模拟

利用嵌入原子方法的原子间相互作用势，通过分子动力学模拟，详细研究了贵金属原子在Pt (111)表面的低能溅射现象.模拟结果显示：对于垂直入射情况，入射原子的质量对Pt (11 1)表面的溅射阈值影响不大.当入射原子的能量小于溅射阈值时，入射原子基本以沉积为主 ；当入射原子的能量大于溅射阈值时，溅射产额随入射原子能量的增加而线性增大；当入射 原子能量达到200 eV时，各种入射原子的溅射产额都达到或接近1，此时入射原子主要起溅 射作用.溅射原子发射的角分布概率和溅射花样与高能溅射相类似.研究表明：与基于二体碰 撞近似的线性级联溅射理论不同，当入射原子能量大于溅射阈值时，低能入射原子的溅射产 额正比于入射原子的约化能量和入射原子与基体原子的质量比.通过对低能入射原子的钉扎 能力分析，提出了支配低能溅射的入射原子反射物理机理. 关键词： 分子动力学模拟、低能溅射     

替位杂质对低能Pt原子与Pt(111)表面相互作用影响的分子动力学模拟

采用嵌入原子方法的原子间相互作用势，通过分子动力学方法模拟了低能Pt原子与Cu，Ag，Au，Ni，Pd替位掺杂Pt(111)表面的相互作用过程，系统研究了替位原子对表面吸附原子产额、溅射产额和空位缺陷产额的影响规律，分析了低能沉积过程中沉积原子与基体表面的相互作用机理以及替位原子的作用及其影响规律.研究结果显示：替位原子的存在不仅影响着沉积能量较低时的表面吸附原子的产额与空间分布，而且对沉积能量较高时的低能表面溅射过程和基体表面空位的形成产生重要影响.替位原子导致的表面吸附原子产额、表面原子溅射以及空位形 关键词： 分子动力学 低能粒子 替位掺杂 表面原子产额 溅射 空位     

Surface defects created by low energy (20 < E < 240 eV) ion bombardment of Ge(001)

Surface defects created on Ge(001) exposed to low energy Xe ions are characterized by in situ scanning tunneling microscopy (STM). The temperature of the sample during ion bombardment is 165 C and ion energies range from 20 to 240 eV. The ion collisions create defects (vacancies and adatoms) which nucleate and form vacancy and adatom islands. For fixed total vacancy creation, the vacancy island number density increases with increasing ion energy: the vacancy island number density is 1.6 × 10⁻²⁰ cm⁻² for 40 eV ion bombardment and increases to 4.4 × 10⁻²⁰ cm⁻² for 240 eV ion bombardment. The increased nucleation rate for vacancies is attributed to clustering of defects. The sputtering yield of Ge(001) is also measured by STM. The sputtering yield for 20 eV ions is approximately 10⁻³ per ion but the net yield for surface defects (sum of adatoms and vacancies) is an order of magnitude higher, 10⁻², due to adatom-vacancy pair creation.     

载能Ni原子斜入射Pt(111)表面的分子动力学模拟

采用嵌入原子方法的原子间相互作用势,利用分子动力学模拟,详细研究不同角度入射的载能Ni原子在Pt(111)基体表面的沉积过程.结果表明,随着入射角度θ从0°增加到80°,溅射产额、表面吸附原子产额、空位产额的变化情况均可按入射角度近似地分为θ≤20°,20° < θ < 60°和θ≥60°三个区域.当θ≤20°时,载能沉积对基体表面的影响与垂直入射时的情况类似,表面吸附原子的分布较为集中,入射原子容易达到基体表面第二层及以下,对基体内部晶格产生-定的影响;在20° < θ < 60°的范围内,入射原子的注入深度有所下降,对基体内部晶格的影响减小,表面吸附原子的分布较为均匀,有利于薄膜的均匀成核与层状生长;当θ≥60°时,所有入射原子均直接被基体表面反射,表面吸附原子产额、溅射产额、表面空位产额均接近0,载能沉积作用没有体现.     

Study on low-energy bombardment of Au (1 1 1) by noble metal atoms with molecular dynamics simulations

The low-energy bombardment of Au (1 1 1) surface by noble metal atoms is studied with molecular dynamics (MD) simulations. With the incident-energy dependence of adatom yields, sputtering yields, and vacancy yields for different projectiles, we find that the implantation of projectiles in shallow layers below surface can be distinguished by subplantation (in the first and second layers) and implantation (deeper than the third layer). The transition from subplantation to implantation occurs at the incident energy of about 45 eV for the low-energy bombardment of noble metal atoms on Au (1 1 1). The incident-energy dependence of defect yields is obviously different for the subplantation and implantation of projectiles. Based on our MD simulations, we discuss the influence of low-energy bombardment on film growth and the guide to the search for optimum deposition parameters.     

连续碳纤维增强碳化硅的辐照效应

连续碳纤维增强碳化硅材料除了具有碳化硅材料固有的低中子活化性能,低衰变热性能和低氚渗透性能等优点以外,还具有密度低、线性膨胀系数小、高比强度、高比模量、耐高温、抗氧化、抗蠕变、抗热震、耐化学腐蚀、耐盐雾、优良的电磁波吸收特性等一系列优异性能,是各类核工程重要的潜在候选材料。在核聚变工程应用领域,连续碳纤维增强碳化硅材料作为第一壁材料不可避免地会受到各种辐射粒子的影响。研究清楚这些辐射粒子对它的辐照效应对其在核工程领域的安全使用至关重要。采用蒙特卡罗方法与分子动力学方法进行模拟计算,研究了氕、氘、氚和氦四种粒子对连续碳纤维增强碳化硅的辐照效应。SRIM和LAMMPS计算结果表明:当入射原子能量为100 eV,连续碳纤维增强碳化硅中碳的浓度在80%~85%时,氕、氘、氚和氦原子的溅射率存在最小值;入射粒子的种类对溅射率的影响显著,氦原子的溅射率大于氘原子和氚原子,而氘原子和氚原子的溅射率相差不大但均显著大于氕原子;溅射率随入射能量的增加先迅速增加后逐渐减小,氕、氘、氚和氦原子入射能量分别在200,400,600和800 eV时存在溅射率最大值;当氦原子入射能量为100 eV时,溅射率随入射角度的增加而逐渐减少。这些结果对连续碳纤维增强碳化硅材料在核工程上的应用具有一定的参考意义。Continuous carbon fiber reinforced silicon carbide material has the low neutron activation, low decay heat performance and tritium permeability, which are inherent performance of silicon carbide materials. It also has other advantages such as low density, small linear expansion coefficient, specific strength and specific modulus, high temperature resistance, oxidation resistance, creep resistance, thermal shock, resistance to chemical corrosion, salt fog resistance, excellent electromagnetic wave absorption properties, etc. It is an important potential candidate material in various field of nuclear engineering. In the field of nuclear fusion engineering applications, continuous carbon fiber reinforced silicon carbide as the first wall material will inevitably be bombarded by a variety of radiation particles. The radiation effect is critical to its safe use in nuclear engineering. The Monte Carlo method and the molecular dynamics method were used to study the radiation effect of protium, deuterium, tritium and helium on continuous carbon fiber reinforced silicon carbide. The SRIM and LAMMPS simulation results show that when the incident energy is 100 eV and the concentration of carbon in the continuous carbon fiber reinforced silicon carbide is about 80% ~ 85%, the sputtering yield of protium, deuterium, tritium and helium atoms have the minimum values. The kind of incident particle has a significant effect on the sputtering yield. The sputtering yield of helium atoms is larger than that of tritium atoms and deuterium atoms. There is not much difference between the sputtering yield of deuterium atoms and tritium atoms, and both the sputtering yield of deuterium atoms and tritium atoms are larger than that of protium atoms. The sputtering yield initially increases rapidly with the increase of the incident energy and then decreases gradually. The incident energy of the protium, deuterium, tritium and helium atoms has the maximum value of the sputtering yield at 200, 400, 600 and 800 eV, respectively. When the incident energy of helium atoms is 100 eV, the sputtering yield decreases while the increase of the incident angle. These results can provide a certain reference for the application of continuous carbon fiber reinforced silicon carbide materials in nuclear engineering.     

Simulation of the interaction of bipartite bimetallic clusters with low-energy argon clusters

Molecular-dynamics simulation of the evolution of bipartite bimetallic clusters consisting of 390 atoms during bombardment by Ar_n (n = 1, 2, 13) clusters with initial energies from 1 eV to 1.4 keV is performed. Binary Cu–Au and Ni–Al clusters consisting of equal atomic fractions of corresponding elements were used as a target. As a result of simulation, the temperatures, changes in the potential energy, sputtering yields, and intensities of collision-stimulated displacement of atoms through the interface of monometallic parts of binary clusters, depending on the size and energy of incident particle, are obtained.

     

Ni原子倾斜轰击Pt(111)表面低能溅射现象的分子动力学模拟

采用嵌入原子方法的原子间相互作用势,通过分子动力学模拟详细研究了以不同角度入射的低能Ni原子与Pt (111)基体表面相互作用过程中的低能溅射行为.结果表明:随着入射角度从0°增加到80°,溅射产额Y_s和入射原子钉扎系数S的变化均可以根据入射角θ近似地分为以下三个区域:当θ ≤ 20°时,Y_s和S几乎保持不变,其值与垂直入射时接近,溅射原子的发射角分布和能量分布也与垂直入射时的情 关键词： 分子动力学模拟 入射角 低能溅射     

溅射功率对金属锰膜光学性质的影响

采用磁控溅射方法在Si（111）基片上制备金属锰膜,用椭圆偏振光谱在入射光子能量为2.0–4.0 eV范围内研究了溅射功率对薄膜光学性质的影响. 利用德鲁得-洛伦兹色散模型对椭偏数据进行拟合,结果表明在测量范围内随溅射功率增加薄膜的折射率减小;消光系数随入射光子能量增加先增加后减小,在3.0 eV附近处出现极大值,并且极大值所处的位置随溅射功率增加而向低能方向移动,这主要与溅射沉积的锰薄膜的质量有关,且随溅射功率的增加薄膜的消光系数逐渐趋近于金属锰的数值. 研究结果还表明溅射功率的增加减少了薄膜中的空隙,有利于薄膜的生长. 关键词： 磁控溅射 金属锰膜 椭圆偏振光谱 德鲁得-洛伦兹色散模型     

Subthreshold sputtering at high temperatures

The sputtering of tungsten from a target at a temperature of 1470 K during irradiation by 5-eV deuterium ions in a steady-state dense plasma is discovered. The literature values of the threshold for the sputtering of tungsten by deuterium ions are 160–200 eV. The tungsten sputtering coefficient measured by the loss of weight is found to be 1.5×10^?4 atom/ion at a deuterium ion energy of 5 eV. Previously, such a sputtering coefficient was usually observed at energies of 250 eV. The sputtering is accompanied by a change in the target surface relief, i.e., by the etching of the grain boundaries and the formation of a wavy structure on the tungsten surface. The subthreshold sputtering at a high temperature is explained by the possible sputtering of adsorbed tungsten atoms that are released from the traps around the interstitial atoms and come to the target surface from the space between the grains. The wavy structure on the surface results from the merging of adsorbed atoms into ordered clusters.     

Energy exchange in structure scattering: a molecular dynamics study for Cs from Pt(1 1 1)

We have employed a classical molecular dynamics simulation to investigate the energy transfer of a heavy projectile ion to a surface, i.e. Cs⁺ impacting onto Pt(1 1 1), for incidence energies between 25 and 100 eV and an incidence angle of 45°. The in-plane scattering results show a continuous increase of the final energy with increasing scattering angle. All scattering intensities have a main supraspecular peak and scattering into subspecular angles increases with increasing incidence energy. The large projectile/target mass ratio causes a high energy loss and a strong angular dependence of the final energy distribution. The trends of the energy transfer and its angular dependence can be understood in terms of a binary collision model, augmented with double collisions and an the image charge correction. Backscattering at high incidence energies leads to a distribution of very low final energies, indicating the onset of surface sputtering. Peaks in the energy spectra arise from impact site dependent scattering and can be assigned to single, double, triple or sputtering type collisions.     

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The molecular dynamics simulation of interaction between CH⁺ with various energy and fusion material tungsten is conducted. The simulated results show that in the incident process, the sputtering rates of C and H atoms change suddenly at the different exposure doses when the incident energy is 50, 100 and 150eV respectively, a few of W atoms are sputtered in the interaction process, but the sputtering rate is less than 0.24%. When the exposure dose is about 3.92×10¹⁶cm⁻², the incident energy is 50eV, a hydrocarbon firm without W atom is formed on the sample surface bombarded by the ions. A mixed film of W, C and H is formed at the other energy. The deposited rates of C and H atom first decrease then increase with the incident energy increament, the minimum deposited rats appear at 250 and 200eV respectively. The density profiles of C, H atoms, C−H, C−C, W−C bonds in the sample after bombardment move towards the inside of sample, and the C sp³ dominated the sample.     

Optical characterization and laser damage of fused silica optics after ion beam sputtering

The sputtering process of fused silica bombarded by Ar ion beam is simulated with the SRIM software. The effects of ion beam energy and incident angle on sputtering yield and surface damage are computed. Since ion beam sputtering will result in defects in fused silica, such as E′ color centers and other lattice defects and probably Argon bubbles, the optimized sputtering energy is selected below 1 keV so that the projected range of Ar ions is less than 10 Å. The experimental results show that the scratches in subsurface of fused silica can be smoothed obviously and better surface can be obtained as the optimized parameters are used for ion beam sputtering. The laser induced damage threshold of fused silica increases by about 18% after ion beam sputtering.     

Relative sputtering yields from close-packed directions in nickel under low-energy Ar bombardment

A new approach to low-energy sputtering was developed wherein a monoenergetic Ar⁺ ion beam of the order of 10⁻⁹ A impinged onto a crystalline nickel target. Target preparation consisted of plating about 100 monolayers of high specific activity Ni-63 onto a coldrolled nickel substrate and then heating the target above its recrystallization temperature under ultra-high vacuum. The result was a highly ordered polycrystalline structure which, when sputtered, behaved like the (100) surface of a nickel single crystal. Approximately 25 percent of the surface atoms were Ni-63. Sputtered material was collected on a molybdenum foil which was subsequently analyzed by radiotracer techniques.

Experimental results concerning sputtering from [110] and [100] close-packed directions in nickel under bombardment by Ar⁺ ions of energy 25 eV to 600 eV are reported. The relative sputtering yields from [110] directions are presented as a function of incident ion energy for 75° and 15° ion incidence measured with respect to the [110] directions, and the extrapolated thresholds are compared with theoretical predictions.

In addition to the expected deposits on the foil due to sputtering from individual closepacked directions, secondary deposits occurred which are attributed to specular reflection of sputtered nickel atoms from the molybdenum foil.     

Probability of ionization of sputtered particles as a function of their energy: Part I: Negative Si ions

In this study we have investigated how the probability of ionization of sputtered Si atoms to form negative ions depends on the energy of the atoms. We have determined the ionization probability from experimental SIMS energy distributions using a special experimental technique, which included de-convolution of the energy distribution with an instrumental transmission function, found by separate measurements.We found that the ionization probability increases as a power law ∼E^0.677 for particles sputtered with energies of 0-10 eV, then becomes a constant value (within the limits of experimental error) for particles sputtered with energies of 30-100 eV. The energy distributions of Si⁻ ions, measured under argon and cesium ion sputtering, confirmed this radical difference between the yields from low and high-energy ions.To explain these results we have considered ionization mechanisms that are different for the low energy atoms (<10 eV) and for the atoms emitted with higher energy (>30 eV).     

Point-defect properties of,and sputtering events in,the {001} surfaces of Ni3Al. II. Sputtering events at and near surfaces

Atomic recoil events at and near {001} surfaces of Ni₃Al due to elastic collisions between electrons and atoms have been simulated by molecular dynamics to obtain the sputtering threshold energy as a function of atomic species, recoil direction and atomic layer of the primary recoil atom. The minimum sputtering energy occurs for adatoms and is 3.5 and 4.5?eV for Al and Ni adatoms on the Ni–Al surface (denoted ‘M’), respectively, and 4.5?eV for both species on the pure Ni surface (denoted ‘N’). For atoms within the surface plane, the minimum sputtering energy is 6.0?eV for Al and Ni atoms in the M plane and for Ni atoms in the N surface. The sputtering threshold energy increases with increasing angle, θ, between the recoil direction and surface normal, and is almost independent of azimuthal angle, ?, if θ<60°; it varies strongly with ? when θ>60°, with a maximum at ??=?45° due to ?{110}? close-packed atomic chains in the surface. The sputtering threshold energy increases significantly for subsurface recoils, except for those that generate efficient energy transfer to a surface atom by a replacement collision sequence. The implications of the results for the prediction of the mass loss due to sputtering during microanalysis in a FEG STEM are discussed.     

磁控溅射铂抑制镀银表面的二次电子发射

降低表面的二次电子产额是抑制微波部件二次电子倍增效应和提升功率阈值的有效途径之一,目前主要采用在表面构造陷阱结构和沉积非金属薄膜的方法降低二次电子产额,其缺点是会改变部件的电性能.针对此问题,采用在表面沉积高功函数且化学惰性的金属薄膜来降低二次电子产额.首先,采用磁控溅射方法在铝合金镀银样片表面沉积100 nm铂,测量结果显示沉积铂后样片的二次电子产额最大值由2.40降至1.77,降幅达26%.其次,用相关唯象模型对二次电子发射特性测量数据进行了拟合,获得了在40-1500 eV能量范围内能够准确描述样片二次电子产额特性的Vaughan模型参数,以及在0-50 eV能量范围内能够很好地拟合二次电子能谱曲线的Chung-Everhart模型参数.最后,将获得的实验数据和相关拟合参数用于Ku频段阻抗变换器的二次电子倍增效应功率阈值仿真研究,结果表明通过沉积铂可将部件的功率阈值由7500 W提升至36000 W,证实了所提方法的有效性.研究结果为金属材料二次电子发射特性的研究提供实验数据参考,对抑制大功率微波部件二次电子倍增效应具有参考价值.     

超二代像增强器多碱阴极光电发射特性研究

通过测量超二代像增强器多碱阴极的光谱反射率和透射率,根据能量守恒定律计算得到了多碱阴极的光谱吸收率.结果表明,只有当光子的能量大于1.333 eV以后,多碱阴极的吸收率才开始快速增大.这说明多碱阴极的光谱吸收存在一个1.333 eV的长波吸收限,入射光的光子能量如果小于该吸收限,多碱阴极将不吸收.在多碱阴极的表面电子亲合势进一步降低的情况下,多碱阴极光电发射的长波理论阈值由长波吸收限所决定.多碱阴极在吸收光子之后的电子跃迁过程中,跃迁电子的能量增加小于所吸收入射光子的能量,即存在一个"能量损失".光子的能量越高,所激发的跃迁电子所处的能级越高,能量损失越大.同时光子的能量越高,跃迁电子所处的能级越高,电子跃迁的几率越低.多碱阴极的量子效率由吸收率、跃迁几率和跃迁能级、扩散过程中的能量损失等因素共同决定,因此多碱阴极的量子效率存在长波阈的同时也存在短波阈.多碱阴极的量子效率在2.11 eV达到最大值之后,随着光子能量的增加而单调减小,在3.6 eV时,量子效率减小到零.多碱阴极在3.6 eV时的吸收系数仍然很高,但由于电子跃迁的几率低,同时电子扩散过程中的能量损失大,导致尽管多碱阴极对短波具有较高的吸收系数,但量子效率仍然较低.因此对多碱阴极所吸收的光子能量中,转换成为光电导、晶格热振动等其他非光电发射形式能量的比例而言,短波较长波高,对光电发射的贡献率而言,短波较长波低.