High temperature property studies of the 6H-SiC MOS capacitor

N-type and p-type 6H-SiC metal oxide semiconductor (MOS) capacitor samples are fabricated with a typical method,and the high frequency capacitor voltage (C-V) curves of these samples are measured at temperatures ranging from 293 to 533 K.There exists huge difference between the n-type and p-type samples.Flat-band voltage shift of the n-type sample becomes larger with temperature rising,but that of the p-type sample have very little change.This may be caused by the residual Al in the p-type oxide.Both types ...     

Surface redox induced bipolar switching of transition metal oxide films examined by scanning probe microscopy

The bipolar resistive switching mechanisms of a p-type NiO film and n-type TiO₂ film were examined using local probe-based measurements. Scanning probe-based current–voltage (I–V) sweeps and surface potential/current maps obtained after the application of dc bias suggested that resistive switching is caused mainly by the surface redox reactions involving oxygen ions at the tip/oxide interface. This explanation can be applied generally to both p-type and n-type conducting resistive switching films. The contribution of oxygen migration to resistive switching was also observed indirectly, but only in the cases where the tip was in (quasi-) Ohmic contact with the oxide.     

Impédance des jonctions entre une électrode polycristalline d'alliage GaxIn1−xP et un électrolyte aqueux

Impedance measurements were made in the dark on n-type Ga_xIn_1?xP polycrystal electrodes (0 ? x ? 1) in different electrolyte aqueous solutions as a function of applied voltage and of frequency. The observed frequency dependence of the impedance elements can be attributed to dipole relaxation phenomena in the space charge layer of the semiconductor electrode, in relation to the surface etching and polishing. It is possible to measure the number of majority carriers and position of the flat band potential with the composition x. Impedance measurements coupled with the illumination can be used to obtain the position of energy levels. We have shown a linear shift of the flat band potential with x.     

0.18μm CMOS工艺栅极氧化膜可靠性的衬底和工艺依存性

用斜坡电压法(Voltage Ramp, V-ramp)评价了0.18μm双栅极 CMOS工艺栅极氧化膜击穿电量(Charge to Breakdown, Q_bd)和击穿电压(Voltage to Breakdown, V_bd). 研究结果表明，低压器件(1.8V)的栅极氧化膜(薄氧)p型衬底MOS电容和N型衬底电容的击穿电量值相差较小，而高压器件(3.3V)栅极氧化膜(厚氧)p衬底MOS电容和n衬底MOS电容的击穿电量值相差较大，击穿电压测试值也发现与击穿电量 关键词： 薄氧 可靠性 击穿电压 击穿电量     

Photoemission study of the adsorption of O2, CO and H2 on GaAs(110)

Ultraviolet photoemission spectroscopy with hv < 12 eV has been used to study O₂, CO, and H₂ adsorption on the cleaved GaAs(110) face. It was found that O₂ exposures above 10⁵ L(1LM = 10^?6 Torr sec) were required to produce changes in the energy distribution curves. At O₂ exposures of 10⁶ L on p-type and 10⁸ L on n-type an oxide peak is observed in the EDC's located 4 eV below the valence band maximum. On p-type GaAs, O₂ exposures cause the Fermi level at the surface to move up to a point 0.5 eV above the valence band maximum, while on n-type GaAs O₂ exposures do not remove the Fermi level pinning caused by empty surface states on the clean GaAs. CO was found to stick to GaAs, but to desorb over a period of hours, and not to change the surface Fermi level position. H₂ did not affect the EDC's, but atomic H lowered the electron affinity and raised the surface position of the Fermi level on p-type GaAs. A correlation is found in which gases which stick to the GaAs cause an upward movement of the Fermi level at the surface on p-type GaAs, while gases which stick only temporarily do not change the surface position of the Fermi level.     

Scanning tunneling microscopy luminescence from nanoscale surface of GaAs(1 1 0)

Scanning tunneling microscopy luminescence (STML) was induced from the nanometer scale surfaces of cleaved n-type and p-type GaAs(1 1 0) wafers by using of an ITO-coated optical fiber probe in an ultrahigh-vacuum chamber. The STML from n-type GaAs(1 1 0) surface was induced under negative sample bias when the applied bias exceeds a threshold voltage around −1.5 V. Whereas the STML from p-type GaAs(1 1 0) surface was induced under positive sample bias when the applied bias exceeds a threshold voltage around +1.5 V. The excitation energies at the threshold voltages are consistent with the band gap of GaAs (1.42 eV) at 295 K. The typical quantum efficiencies for n-type and p-type GaAs are about 3 × 10⁻⁵ and 2 × 10⁻⁴ photons/electron, respectively. The observed STML from are attributed to a radiative recombination of electron-hole pairs generated by a hole injection for n-type GaAs under negative sample bias and an electron injection for p-type GaAs under positive sample bias, respectively.     

On the differential capacitance of the n- and p-type gallium arsenide electrode

Impedance measurements on the n- and p-type GaAs electrode show that in both cases, a depletion region exists under reverse bias. The capacitive behaviour of n-type GaAs is relatively simple and allows to determine the position of the conduction and valence band edge at the surface with respect to a reference electrode level. From the pH-dependence of this position, it follows that an acid-base equilibrium is established at the GaAs surface. The impedance behaviour of p-type GaAs is rather complex, and is interpreted on the basis of a model in which localized levels at large energy distance from the valence band edge are involved. The results indicate that the position of the band edges at the surface of GaAs in contact with a given electrolyte is essentially the same for n- and p-type material. The data obtained permit to explain qualitatively the electrochemical reactivity of the hexacyanoferrate (III) ion as well as the lack of reactivity of certain reducing agents at the GaAs electrode.     

The effect of potential of impedance in the pulsed-laser-deposited SrBi2Ta2O9 thin film

Ferroelectrics SrBi₂Ta₂O₉ (SBTO) thin films were grown on a highly oriented Pt/Ti/SiO₂/Si substrates using the pulsed laser ablation. The ac impedance of SBTO thin films have been measured at room temperature both in the frequency range from 10⁻¹ to 10⁶ Hz and bias voltage range from −6 to 6 V. The ac impedance dispersion was observed at low frequency with increasing bias voltage, which was interpreted based on a blocked charge. We can explain that the blocking interface gives rise to constant phase element (CPE) response, and we give an impedance model function that can fit data along the low frequency range when such a CPE is found. The low frequency dispersion phenomena of SBTO thin film are related to a charge diffusion process at the surface of thin film.     

Measurement of active carbon on ruthenium (110): Relevance to catalytic methanation

Hall measurements of charge carrier mobility and concentration in the channels appearing at germanium surfaces cleaved in liquid nitrogen, have been carried out to define the surface state charge Q_ss. The n-type germanium samples with various Sb atom concentrations and p-type germanium samples with various Sb and Au atom concentrations have been investigated. It has been established that surface states lie below the valence band top, and ¦Q_ss¦increases with the growth of the bulk doping level. The results obtained imply that the surface state density depends on the bulk impurity concentration. Possible explanation of the found bulk impurity influence on the surface state characteristics is proposed.     

Electrical characteristics of argon radio frequency glow dischargesin an asymmetric cell

Measurements of the current and voltage at both electrodes of a parallel-plate, capacitively coupled RF discharge cell (the Gaseous Electronics Conference Reference Cell) were combined with measurements of the voltage on a wire inserted into the glow region between the electrodes, for argon discharges at pressures of 1.3-133 Pa and peak-to-peak applied voltages ⩽400 V. Together, these measurements determined the RF voltage, current, impedance, and power of each sheath of the plasma. Simple power laws were found to describe changes in sheath impedances observed as voltage and pressure were varied. An equivalent circuit model for the electrical behavior of the discharge was obtained. The equivalent circuit model can be used to relate the electrical data to plasma properties such as electron densities, ion currents, and sheath widths. The results differ from models previously proposed for asymmetric RF discharges, and the implications of this disagreement are discussed     

GaN基垂直结构LED的n型电极结构设计及芯片制备

首先利用电流路径模型分析n型电极尺寸及间距等对垂直结构发光二极管(VS-LEDs)电流分布均匀性的影响,依此设计出一种螺旋状环形结构电极。其次,通过建立有限元分析软件Comsol仿真模型模拟VSLEDs有源层的电流密度分布,发现螺旋状环形结构电极的环间距越小,电流密度分布越均匀。最后,利用VS-LEDs芯片制备技术实现具有螺旋状环形电极的垂直结构LED芯片。实验结果显示,在350 m A电流驱动下,电极环间距为146.25μm的芯片具有最大的功能转换效率,达到26.8%。     

Characterization of thermal, optical and carrier transport properties of porous silicon using the photoacoustic technique

In this work, the porous silicon layer was prepared by the electrochemical anodization etching process on n-type and p-type silicon wafers. The formation of the porous layer has been identified by photoluminescence and SEM measurements. The optical absorption, energy gap, carrier transport and thermal properties of n-type and p-type porous silicon layers were investigated by analyzing the experimental data from photoacoustic measurements. The values of thermal diffusivity, energy gap and carrier transport properties have been found to be porosity-dependent. The energy band gap of n-type and p-type porous silicon layers was higher than the energy band gap obtained for silicon substrate (1.11 eV). In the range of porosity (50-76%) of the studies, our results found that the optical band-gap energy of p-type porous silicon (1.80-2.00 eV) was higher than that of the n-type porous silicon layer (1.70-1.86 eV). The thermal diffusivity value of the n-type porous layer was found to be higher than that of the p-type and both were observed to increase linearly with increasing layer porosity.     

Reduction of the concentration of slow insulator states in SiO2/InP-MIS structures

The well-known drift phenomena usually found in the InP-metal-insulator-semiconductor (MIS) devices can be explained by the assumption of a spatial and energetical distribution of slow states located within the insulator. The concentration of these states can be reduced by far more than one order of magnitude if a suitable technique of insulator deposition is applied. In this paper we will discuss the influence of the deposition temperature, the spatial separation of sample and plasma (“indirect plasma method”), and the addition of phosphorus into the reaction chamber during the initial period of insulator deposition on the properties of n-type and p-type InP-MIS capacitors. Plasma-enhanced chemical vapor deposited silicon dioxide is used as insulator. The samples were characterized by means of capacitance/voltage (C(V)) and deep level transient spectroscopy (DLTS) measurements. Only minor hysteresis of the C(V) curves and concentrations of slow insulator states of only (1–2)×10¹¹ cm^-2 eV^-1 are measured for the best of our samples.     

Impact of nickel contamination on carrier recombination in n- and p-type crystalline silicon wafers

The effect of Ni surface contamination on carrier recombination after high temperature processing of crystalline silicon wafers has been studied for a range of n- and p-type resistivities. The results suggest that the presence of Ni precipitates at the wafer surfaces, formed during cooling, dominate the measured lifetimes. These precipitates exhibit a greater impact on the low-injection lifetime in p-type samples than in n-type. In addition, the injection-dependent lifetime curves for the n-type samples changed from increasing to decreasing with injection-level as the resistivity increased above approximately 10 Ω cm. In most cases, the surface recombination velocity attributable to the presence of these Ni precipitates at the oxidized surfaces increased linearly with the Ni dose. PACS 72.20.Jv; 73.20.Hb; 71.55.Cn     

Visible electroluminescence from p-n junction porous Si diode with a polyaniline film contact

We have fabricated a light emitting diode using a p-type conducting polyaniline layer deposited on a n-type porous silicon (PS) layer. The contact formed between a p-type conducting polyaniline layer and a n-type PS wafer has rectified behaviour demonstrated clearly by the I-V curves. The series resistance Rs in the p-type conducting polyaniline/n-PS diode is reduced greatly and has a lower onset voltage compared with ITO/n-PS diode. The PS has an orange photoluminescence (PL) band after coating with polyaniline. Visible electroluminescence (EL) has been obtained from this junction when a forward bias is applied. The emission band is very broad extending from 600-803 nm with a peak at 690 nm.     

Analysis of the electrical properties of p–n GaAs homojunction under dc and ac fields

In this work, the n-type GaAs films were grown on p-type GaAs single crystalline substrate by metal organic chemical vapor deposition (MOCVD). The temperature dependence of the current density–voltage (J–V) characteristics of n-GaAs/p-GaAs homojunction contacts were measured in the temperature range 293–413 K. These characteristics showed a rectifying behavior consistent with a potential barrier formed at the interface. The forward current density–voltage characteristics under low voltage biasing were explained on the basis of thermionic emission mechanism. The high values of ideality factor (n) may be ascribed to the presence of an interfacial layer. Analysis of the experimental data under the reverse voltage biasing suggests a dominant mechanism was found to be a Schottky effect. The impedance properties and the alternating current (ac) conductivity of n-GaAs/p-GaAs homojunction were investigated as a function of frequency and temperature. The ac conductivity was found to obey the universal power law. The variation of the exponent s with the temperature suggested that the conduction mechanism is an overlapping large-polaron tunneling (OLPT) model associated with correlated barrier hopping (CBH) model at the higher temperature.     

Doping-dependent evolution of low-energy excitations and quantum phase transitions within an effective model for high-T<Subscript>c</Subscript> copper oxides

In this paper a mean-field theory for the spin-liquid paramagnetic non-superconducting phase of the p- and n-type high-T_c cuprates is developed. This theory applied to the effective t-t'-t′′-J^* model with the ab initio calculated parameters and with the three-site correlated hoppings. The static spin-spin and kinematic correlation functions beyond Hubbard-I approximation are calculated self-consistently. The evolution of the Fermi surface and band dispersion is obtained for the wide range of doping concentrations x. For p-type systems the three different types of behavior are found and the transitions between these types are accompanied by the changes in the Fermi surface topology. Thus a quantum phase transitions take place at x = 0.15 and at x = 0.23.Due to the different Fermi surface topology we found for n-type cuprates only one quantum critical concentration, x = 0.2. The calculated doping dependence of the nodal Fermi velocity and the effective mass are in good agreement with the experimental data.     

Study on shunt impedance and voltage distribution of 4-rod RFQ cavity

A high current RFQ (radio frequency quadrupole) is being studied at the Institute of Modern Physics,CAS for the direct plasma injection scheme. Shunt impedance is an important parameter when designing a 4-rod RFQ cavity,it reflects the RF efficiency of the cavity,and has a direct influence on the cost of the structure.Voltage distribution of a RFQ cavity has an effect on beam transmission,and particles would be lost if the actual voltage distribution is not as what it should be.The influence of cell length,stem thickness and height on shunt impedance and voltage distribution have been studied,in particular the effect of projecting electrodes has been investigated in detail.     

Influence of silicon doping density on vacuum field emission triode at high frequency range

Silicon FEA will affect the high frequency application of field emission tubes when it works at the microwave frequency range. This article shows that the electron emitting will be influenced by the majority carrier response time in semiconductor silicon. The surface capacitance and delay time of n-type and p-type silicon are calculated by using semiconductor theory. The result shows that the semiconductor conductivity will determine the maximum work frequency of device. The maximum work frequency (no considering other effects such as C_gc, g_m etc.) will be decreased from about 200 GHz to 2 GHz when the resistivity of p-type silicon is increased from 0.1 · cm to 10 cm.     

Surface photovoltage for real n- and p-type in the visible and near spectroscopy (110) CdTe surfaces infra-red spectral range

Surface photovoltage spectroscopy has been carried out on real n- and p-type (110) CdTe surfaces in the wavelength range 0.36-1 μm at room temperature (300 K), and at atmospheric pressure. The measurements show the existence of surface states at 1.3; 1.48, and 1.2; 1.46 eV within the energy gap of n- and p-type CdTe, respectively. Surface states greater than the energy gap at 2.24, 2.38, 2.68, and 3.1 eV have also been detected in n-type samples and at 1.66, 2.12, 2.69 eV in p-type samples.