| Apparatus for Real—Time Measurement of Stress in Thin Films at Elevated Temperatures |
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| 引用本文： | 安兵,张同俊,袁超,崔崑.Apparatus for Real—Time Measurement of Stress in Thin Films at Elevated Temperatures[J].中国物理快报,2003,20(8):1387-1389. |
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| 作者姓名： | 安兵 张同俊 袁超 崔崑 |
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| 作者单位： | StateKeyLaboratoryofPlasticFormingSimulationandDieandMouldTechnology,HuazhongUniversityofScienceandTechnology,Wuhan430074 |
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| 摘 要： | As a prerequisite of biaxial zero creep experiments, a novel sensitive apparatus is developed for real-time filmstress measurement during thermal cycles. The optical sensor with a fixed multi-beam emitter and a CCD detector is investigated during an annealing process of Ag/Co multilayer thin film. The monitoring plots of stress as functions of temperature and time demonstrate the capability of this set-up. The typical sensitivity for measuring the wafer curvature radius is 2 km.
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| 关 键 词： | 薄膜测量 实时测量 光学传感器 热循环 温度 CCD 二轴零蠕变实验 |
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