基于ISM与FMECA的加工中心故障分析

故障分析是实现加工中心可靠性水平增长的重要环节,因此提高故障分析的准确性至关重要.鉴于此,本文首先充分考虑加工中心故障子系统间影响关系,基于ISM法构建递阶结构模型,使得关联故障子系统间复杂影响关系层次化,以求得深层故障子系统,确定可靠性改进薄弱环节.其次对所得薄弱环节进行FMECA分析,进而确定关键故障模式,为提高加工中心可靠性奠定基础.最后以某系列加工中心现场故障数据为研究对象进行实例研究,证明了ISM和FMECA法在加工中心故障分析中的准确有效性.     

Band Structures of Ultrathin Bi(110) Films on Black Phosphorus Substrates Using Angle-Resolved Photoemission Spectroscopy

The band structures of two-monolayer Bi(110) films on black phosphorus substrates are studied using angleresolved photoemission spectroscopy. Within the band gap of bulk black phosphorus, the electronic states near the Fermi level are dominated by the Bi(110) film. The band dispersions revealed by our data suggest that the orientation of the Bi(110) film is aligned with the black phosphorus substrate. The electronic structures of the Bi(110) film strongly deviate from the band calculations of the free-standing Bi(110) film, suggesting that the substrate can significantly affect the electronic states in the Bi(110) film. Our data show that there are no non-trivial electronic states in Bi(110) films grown on black phosphorus substrates.