p型金属氧化物半导体场效应晶体管界面态的积累对单粒子电荷共享收集的影响

由于负偏置温度不稳定性和热载流子注入,p型金属氧化物半导体场效应晶体管(pMOSFET)将在工作中不断退化,而其SiO₂/Si界面处界面态的积累是导致其退化的主要原因之一. 采用三维器件数值模拟方法,基于130 nm体硅工艺,研究了界面态的积累对相邻pMOSFET之间单粒子电荷共享收集的影响. 研究发现,随着pMOSFET SiO₂/Si界面处界面态的积累,相邻pMOSFET漏端的单粒子电荷共享收集量均减少. 还研究了界面态的积累对相邻反相器中单粒子电荷共享收集 关键词： 负偏置温度不稳定性 电荷共享收集 双极放大效应 单粒子多瞬态     

The dual role of multiple-transistor charge sharing collection in single-event transients

As technologies scale down in size, multiple-transistors being affected by a single ion has become a universal phenomenon, and some new effects are present in single event transients (SETs) due to the charge sharing collection of the adjacent multiple-transistors. In this paper, not only the off-state p-channel metal-oxide semiconductor field-effect transistor (PMOS FET), but also the on-state PMOS is struck by a heavy-ion in the two-transistor inverter chain, due to the charge sharing collection and the electrical interaction. The SET induced by striking the off-state PMOS is efficiently mitigated by the pulse quenching effect, but the SET induced by striking the on-state PMOS becomes dominant. It is indicated in this study that in the advanced technologies, the SET will no longer just be induced by an ion striking the off-state transistor, and the SET sensitive region will no longer just surround the off-state transistor either, as it is in the older technologies. We also discuss this issue in a three-transistor inverter in depth, and the study illustrates that the three-transistor inverter is still a better replacement for spaceborne integrated circuit design in advanced technologies.     

New insight into the parasitic bipolar amplification effect in single event transient production

In this paper, a new method is proposed to study the mechanism of charge collection in single event transient (SET) production in 90 nm bulk complementary metal oxide semiconductor (CMOS) technology. We find that different from the case in the pMOSFET, the parasitic bipolar amplification effect (bipolar effect) in the balanced inverter does not exist in the nMOSFET after the ion striking. The influence of the substrate process on the bipolar effect is also studied in the pMOSFET. We find that the bipolar effect can be effectively mitigated by a buried deep P⁺-well layer and can be removed by a buried SO₂ layer.     

选择性埋氧层上硅器件的单粒子瞬态响应的温度相关性

本文建立了90 nm工艺下的绝缘体上硅浮体器件和选择性埋氧层上硅器件模型,通过器件电路混合仿真探究了工作温度对上述两种结构的多级反相器链单粒子瞬态脉冲宽度以及器件内部电荷收集过程的影响.研究表明, N型选择性埋氧层上硅器件相较于浮体器件具有更好的抗单粒子能力,但P型选择性埋氧层上硅器件的抗单粒子能力在高线性能量转移值下与浮体器件基本相同.同时电荷收集的温度相关性分析表明,N型选择性埋氧层上硅器件只存在漂移扩散过程,当温度升高时其电荷收集量变化很小,而N型浮体器件存在双极放大过程,电荷收集量随着温度的升高而显著增加;另外, P型选择性埋氧层上硅器件和浮体器件均存在双极放大过程,当温度升高时P型选择性埋氧层上硅器件衬底中的双极放大过程越来越严重,由于局部埋氧层的存在,反而抑制了其源极的双极放大过程,导致它的电荷收集量要明显少于P型浮体器件.因此选择性埋氧层上硅器件比浮体器件更好地抑制了温度对单粒子瞬态脉冲的影响.     

Temperature dependence of the P-hit single event transient pulse width in a three-transistor inverter chain

A comparison of the temperature dependence of the P-hit single event transient (SET) in a two-transistor (2T) inverter with that in a three-transistor (3T) inverter is carried out based on a three-dimensional numerical simulation.Due to the significantly distinct mechanisms of the single event change collection in the 2T and the 3T inverters,the temperature plays different roles in the SET production and propagation.The SET pulse will be significantly broadened in the 2T inverter chain while will be compressed in the 3T inverter chain as temperature increases.The investigation provides a new insight into the SET mitigation under the extreme environment,where both the high temperature and the single event effects should be considered.The 3T inverter layout structure (or similar layout structures) will be a better solution for spaceborne integrated circuit design for extreme environments.     

Temperature dependence of the P-hit single event transient pulse width in a three-transistor inverter chain

A comparison of the temperature dependence of the P-hit single event transient (SET) in a two-transistor (2T) inverter with that in a three-transistor (3T) inverter is carried out based on a three-dimensional numerical simulation. Due to the significantly distinct mechanisms of the single event change collection in the 2T and the 3T inverters, the temperature plays different roles in the SET production and propagation. The SET pulse will be significantly broadened in the 2T inverter chain while will be compressed in the 3T inverter chain as temperature increases. The investigation provides a new insight into the SET mitigation under the extreme environment, where both the high temperature and the single event effects should be considered. The 3T inverter layout structure (or similar layout structures) will be a better solution for spaceborne integrated circuit design for extreme environments.     

A single-event transient induced by a pulsed laser in a silicon-germanium heterojunction bipolar transistor

A study on the single event transient (SET) induced by a pulsed laser in a silicon-germanium (SiGe) heterojunction bipolar transistor (HBT) is presented in this work. The impacts of laser energy and collector load resistance on the SET are investigated in detail. The waveform, amplitude, and width of the SET pulse as well as collected charge are used to characterize the SET response. The experimental results are discussed in detail and it is demonstrated that the laser energy and load resistance significantly affect the SET in the SiGe HBT. Furthermore, the underlying physical mechanisms are analyzed and investigated, and a near-ideal exponential model is proposed for the first time to describe the discharge of laser-induced electrons via collector resistance to collector supply when both base-collector and collector-substrate junctions are reverse biased or weakly forward biased. Besides, it is found that an additional multi-path discharge would play an important role in the SET once the base-collector and collector-substrate junctions get strongly forward biased due to a strong transient step charge by the laser pulse.     

Recovery of single event upset in advanced complementary metal-oxide semiconductor static random access memory cells

Using computer-aided design three-dimensional (3D) simulation technology,the recovery mechanism of single event upset and the effects of spacing and hit angle on the recovery are studied.It is found that the multi-node charge collection plays a key role in recovery and shielding the charge sharing by adding guard rings.It cannot exhibit the recovery effect.It is also indicated that the upset linear energy transfer (LET) threshold is kept constant while the recovery LET threshold increases as the spacing increases.Additionally,the effect of incident angle on recovery is analysed and it is shown that a larger angle can bring about a stronger charge sharing effect,thus strengthening the recovery ability.     

90 nm CMOS工艺下p+深阱掺杂浓度对电荷共享的影响

基于3维TCAD器件模拟,研究了90 nm CMOS双阱工艺下p⁺深阱掺杂对电荷共享的影响. 研究结果表明:改变p⁺深阱的掺杂浓度对PMOS管之间的电荷共享的影响要远大于NMOS管;通过增加p⁺深阱的掺杂浓度可以有效抑制PMOS管之间的电荷共享. 这一结论可用于指导电荷共享的加固. 关键词： 电荷共享 单粒子效应 +深阱掺杂')" href="#">p⁺深阱掺杂 双极晶体管效应     

The temperature dependence of single-event transients in 90-nm CMOS dual-well and triple-well NMOSFETs

This paper investigates the temperature dependence of single-event transients(SETs) in 90-nm complementary metat-oxide semiconductor(CMOS) dual-well and triple-well negative metal-oxide semiconductor field-effect transistors(NMOSFETs).Technology computer-aided design(TCAD) three-dimensional(3D) simulations show that the drain current pulse duration increases from 85 ps to 245 ps for triple-well but only increases from 65 ps to 98 ps for dual-well when the temperature increases from-55℃ to 125℃,which is closely correlated with the NMOSFET sources.This reveals that the pulse width increases with temperature in dual-well due to the weakening of the anti-amplification bipolar effect while increases with temperature in triple-well due to the enhancement of the bipolar amplification.     

单粒子瞬变中的双极放大效应研究

采用三维数值模拟的方法对比研究了单个NMOS晶体管和反相器链中的单粒子瞬变（single event transient,SET）电流脉冲,发现深亚微米工艺下双极放大电流在单管的SET电流脉冲中占主要成分,而在反相器链的SET模拟中不明显,分析二者的区别解释了源/体结偏压的形成过程和放大机理,并证明了双极放大效应受源/体结偏压影响的结论.在此基础上分析了NMOS管中源极的正向电流及其机理,发现台阶区的源极正向电流主要是由扩散作用形成的. 关键词： 单粒子瞬变 双极放大 混合模拟 台阶区电流     

重离子导致的锗硅异质结双极晶体管单粒子效应电荷收集三维数值模拟

针对国产锗硅异质结双极晶体管(SiGe HBTs), 采用半导体器件模拟工具, 建立SiGe HBT单粒子效应三维损伤模型, 研究影响SiGe HBT单粒子效应电荷收集的关键因素. 分析比较重离子在不同位置入射器件时, 各电极的电流变化和感生电荷收集情况, 确定SiGe HBT电荷收集的敏感区域. 结果表明, 集电极/衬底结内及附近区域为集电极和衬底收集电荷的敏感区域, 浅槽隔离内的区域为基极收集电荷的敏感区域, 发射极收集的电荷可以忽略. 此项工作的开展为下一步采用设计加固的方法提高器件的抗辐射性能打下了良好的基础. 关键词： 锗硅异质结双极晶体管 单粒子效应 电荷收集 三维数值仿真     

Temperature and drain bias dependence of single event transient in 25-nm FinFET technology

In this paper,we investigate the temperature and drain bias dependency of single event transient(SET) in 25-nm fin field-effect-transistor(FinFET) technology in a temperature range of 0-135°C and supply voltage range of 0.4 V-1.6 V.Technology computer-aided design(TCAD) three-dimensional simulation results show that the drain current pulse duration increases from 0.6 ns to 3.4 ns when the temperature increases from 0 to 135°C.The charge collected increases from 45.5 fC to 436.9 fC and the voltage pulse width decreases from 0.54 ns to 0.18 ns when supply voltage increases from 0.4 V to 1.6 V.Furthermore,simulation results and the mechanism of temperature and bias dependency are discussed.     

Temperature dependence of single event transient in 90-nm CMOS dual-well and triple-well NMOSFETs

This paper investigates the temperature dependence of single event transient (SET) in 90-nm complementary metat-oxide semiconductor (CMOS) dual-well and triple-well negative metal-oxide semiconductor field-effect transistors (NMOSFETs). Technology computer-aided design (TCAD) three-dimensional (3D) simulations show that the drain current pulse duration increases from 85 ps to 245 ps for triple-well but only increases from 65 ps to 98 ps for dual-well when the temperature increases from -55℃ to 125℃, which is closely correlated with the source of NMOSFETs. This reveals that the pulse width increases with temperature in dual-well due to the weakening of anti-amplification bipolar effect while increases with temperature in triple-well due to the enhancement of the bipolar amplification.     

带有n+深阱的三阱CMOS工艺中寄生NPN双极效应及其对电荷共享的影响

基于三维TCAD器件模拟, 研究了带有 n⁺深阱的90 nm三阱CMOS器件在重离子辐照下产生的电荷共享效应. 研究结果表明在重离子辐照时, n⁺深阱会导致寄生的NPN双极型晶体管触发, 显著增强NMOS间的电荷共享, 其放大因子达到双阱工艺中寄生PNP晶体管放大因子的2---4倍. 进而分别研究了n阱接触和p 阱接触对寄生NPN双极放大的影响, 结果表明增大p阱接触的面积和减小 n 阱接触的距离将抑制NPN晶体管的放大作用, 而增大n 阱接触的面积将增强NPN的放大作用.