负电子亲和势GaN真空面电子源研究进展

结合国内和国外的最新研究成果,论述了目前在NEA GaN真空面电子源研究方面的现状. 从光电发射理论、表面净化方法、阴极激活工艺、光谱响应测试以及材料本身特性等方面针对GaN真空电子源的研究取得了一定成绩:初步研究了NEA GaN电子源的光电发射机理;给出了可获得原子级清洁表面的净化方法;采用Cs或Cs/O对GaN材料进行了有效激活;测试了GaN真空电子源材料的光谱响应;探讨了影响电子源量子效率的材料特性. 指出了下一步研究需要关注的内容. 关键词： NEA GaN 电子源 光谱响应     

GaN光电阴极表面势垒对电子逸出几率的影响

针对GaN光电阴极表面势垒对电子逸出几率的影响问题,应用玻尓兹曼分布和基于Airy函数的传递矩阵法计算了GaN光电阴极的电子逸出几率,发现电子逸出几率主要由I势垒决定,II势垒对电子逸出几率的影响有限.利用自行研制的GaN光电阴极激活评估实验系统,测试了透射式GaN光电阴极样品的激活光电流.实验发现,Cs单独激活引起电子逸出几率的显著增加,而Cs单独充分激活后的Cs/O交替激活对电子逸出几率的影响有限.理论计算结果与激活光电流测试结果一致,其原因是Cs单独激活对降低真空能级的贡献远大于Cs/O共同激活.     

负电子亲和势GaN光电阴极铯吸附机理研究

为了得到铯吸附与阴极电子亲和势变化之间的定量关系,利用NEA光电阴极激活评估实验系统对GaN光电阴极进行了铯激活.根据半导体光电发射理论和双偶极层模型,通过对电子亲和势随铯覆盖度变化的实验结果进行拟合运算,得到电子亲和势与铯覆盖度之间的函数关系式.分析了铯的吸附机理,得到激活过程中铯的吸附过程与GaN材料有效电子亲和势下降之间的关系.实验表明:负电子亲和势GaN光电阴极材料在铯激活时光电流随着铯覆盖度的增加而从本底值增为极大值,激活过程中GaN电子能量分布曲线低动能截止点的位置决定于铯的覆盖度.当铯的覆盖度从0、1/2、2/3到1个单层变化时,低动能截止点依次向左移动,当覆盖度从0增加到1个单层时,低动能截止点向左移动了约3eV的距离.研究表明,低动能截止点左移本质上是由于对电子逸出起促进作用的有效偶极子[GaN(Mg):Cs]数量的增多造成的,有效偶极子数量的增多带来了材料表面真空能级的下降.     

NEA GaN光电阴极表面模型研究

针对目前NEAGaN光电阴极研究中Cs激活或Cs/O激活后表面状态的形成过程还不清楚的问题,围绕NEAGaN光电阴极的光电发射机理,结合GaN光电阴极激活过程中出现的现象及成功激活的最终效果,给出了GaN光电阴极铯氧激活后的表面模型[GaN(Mg):Cs]:O-Cs。利用该模型可很好地解释单独用Cs激活时约-1.0eV的有效电子亲和势和Cs/O共同激活时-1.2eV的有效电子亲和势的成因,也较好地解释了表面吸附原子的组合形式,即Cs/O激活后激活层的化学结构由Cs2O2和CsO2构成。     

负电子亲和势GaN光电阴极激活机理研究

利用自行研制的光电阴极激活评估实验系统,给出了GaN光电阴极Cs激活及Cs/O激活的光电流曲线.针对GaN光电阴极的负电子亲和势（NEA）特性的成因,结合激活过程中光电流变化规律和成功激活后的阴极表面模型,研究了NEA GaN光电阴极激活机理.实验表明：GaN光电阴极在单独导入Cs激活时就可获得明显的NEA特性,Cs/O激活时引入O后光电流的增长幅度不大.用双偶极层模型［GaN（Mg）：Cs］：O—Cs较好地解释了激活成功后GaN光电阴极NEA特性的成因. 关键词： 负电子亲和势 GaN 激活 光电流     

AlGaN/GaN高电子迁移率晶体管肖特基高温退火机理研究

在不同应力条件下,研究了AlGaN/GaN高电子迁移率晶体管高温退火前后的电流崩塌、栅泄漏电流以及击穿电压的变化.结果表明,AlGaN/GaN高电子迁移率晶体管通过肖特基高温退火以后,器件的特性得到很大的改善.利用电镜扫描(SEM)和X射线光电子能谱(XPS)对高温退火前、后的肖特基接触界面进行深入分析,发现器件经过高温退火后,Ni和AlGaN层之间介质的去除,并且AlGaN材料表面附近的陷阱减少,使得肖特基有效势垒提高,从而提高器件的电学特性. 关键词： AlGaN/GaN高电子迁移率晶体管 肖特基接触 界面陷阱     

AlGaN/GaN 高电子迁移率晶体管漏电流退化机理研究

本文首先制备了与AlGaN/GaN高电子迁移率晶体管 (HEMT) 结构与特性等效的AlGaN/GaN异质结肖特基二极管, 采用步进应力测试比较了不同栅压下器件漏电流的变化情况, 然后基于电流-电压和电容-电压测试验证了退化前后漏电流的传输机理, 并使用失效分析技术光发射显微镜 (EMMI) 观测器件表面的光发射, 研究了漏电流的时间依赖退化机理. 实验结果表明: 在栅压高于某临界值后, 器件漏电流随时间开始增加, 同时伴有较大的噪声. 将极化电场引入电流与电场的依赖关系后, 器件退化前后的 log(I_FT/E)与√E 都遵循良好的线性关系, 表明漏电流均由电子Frenkel-Poole (FP) 发射主导. 退化后 log(I_FT/E)与√E 曲线斜率的减小, 以及利用EMMI在栅边缘直接观察到了与缺陷存在对应关系的“热点”, 证明了漏电流退化的机理是: 高电场在AlGaN层中诱发了新的缺陷, 而缺陷密度的增加导致了FP发射电流I_FT的增加. 关键词： AlGaN/GaN 高电子迁移率晶体管 漏电流 退化机理     

GaN高电子迁移率晶体管强电磁脉冲损伤效应与机理

提出了一种新型GaN异质结高电子迁移率晶体管在强电磁脉冲下的二维电热模型,模型引入材料固有的极化效应,高场下电子迁移率退化、载流子雪崩产生效应以及器件自热效应,分析了栅极注入强电磁脉冲情况下器件内部的瞬态响应,对其损伤机理和损伤阈值变化规律进行了研究.结果表明,器件内部温升速率呈现出"快速-缓慢-急剧"的趋势.当器件局部温度足够高时(2000 K),该位置热电子发射与温度升高形成正反馈,导致温度急剧升高直至烧毁.栅极靠近源端的柱面处是由于热积累最易发生熔融烧毁的部位,严重影响器件的特性和可靠性.随着脉宽的增加,损伤功率阈值迅速减小而损伤能量阈值逐渐增大.通过数据拟合得到脉宽τ与损伤功率阈值P和损伤能量阈值E的关系.     

电子阻挡层Al组分对GaN基蓝光激光二极管光电性能的影响

采用SiLENSe（Simulator of light emitters based on nitride semiconductors）软件仿真研究了Al_xIn_yGa_1-x-yN电子阻挡层（EBL）Al组分渐变方式对GaN基激光二极管（LD）光电性能的影响,实现了提高输出功率和电光转换效率的目的。文中提出的四种Al组分渐变方式分别是传统均匀组分、右阶梯渐变组分（0～0.07～0.16）、三角形渐变组分（0～0.16～0）、左阶梯渐变组分（0.16～0.07～0）。结果表明,与传统均匀组分EBL结构相比,Al组分阶梯渐变Al_xIn_yGa_1-x-yN EBL LD导带底的电子势垒显著提高,价带顶的空穴势垒降低。这主要是由于该结构能有效抑制电子泄漏和提高空穴注入效率,从而提高有源区载流子浓度,进而提高有源区辐射复合效率。当注入电流为0.48 A时,采用Al组分阶梯渐变Al_xIn_yGa_1-x-y...     

表面势垒对梯度掺杂GaN光电阴极电子逸出几率的影响

研究表面势垒对梯度掺杂GaN光电阴极电子逸出几率的影响.计算梯度掺杂透射式GaN光电阴极的电子能量分布及逸出几率,结果显示梯度掺杂与均匀掺杂相比,可以获得更大的电子逸出几率;I势垒对电子逸出几率的影响显著,而Ⅱ势垒影响较小.利用GaN光电阴极多信息量测试系统,测试两种GaN阴极样品的光电流.实验结果表明,梯度掺杂GaN样品比均匀掺杂电子逸出几率更大;单独进行Cs激活形成的I势垒对电子逸出几率有显著影响,而Cs/O共同激活形成的Ⅱ势垒对其影响较小.     

Photoemission of graded-doping GaN photocathode

We study the photoemission process of graded-doping GaN photocathode and find that the built-in electric fields can increase the escape probability and the effective diffusion length of photo-generated electrons,which results in the enhancement of quantum efficiency.The intervalley scattering mechanism and the lattice scattering mechanism in high electric fields are also investigated.To prevent negative differential mobility from appearing,the surface doping concentration needs to be optimized,and it is calculated to be 3.19×10 17 cm 3.The graded-doping GaN photocathode with higher performance can be realized by further optimizing the doping profile.     

负电子亲和势GaN光电阴极的研究进展

GaN材料由于其优良的性能,成为紫外探测和真空电子源领域极具发展潜力的材料之一;目前制备的反射式GaN光电阴极的量子效率已达到70%以上,透射式也达到了30%.本文对GaN光电阴极的结构设计、表面清洗和Cs/O激活三大方面进行了综述,分析了影响量子效率的关键因素,并对今后可能的发展方向进行了展望. 关键词： GaN光电阴极 负电子亲和势 量子效率 进展     

Degradation mechanism of two-dimensional electron gas density in high Al-content AlGaN/GaN heterostructures

This paper finds that the two-dimensional electron gas density in high Al-content AlGaN/GaN heterostructures exhibits an obvious time-dependent degradation after the epitaxial growth. The degradation mechanism was investigated in depth using Hall effect measurements, high resolution x-ray diffraction, scanning electron microscopy, x-ray photoelectron spectroscopy and energy dispersive x-ray spectroscopy. The results reveal that the formation of surface oxide is the main reason for the degradation, and the surface oxidation always occurs within the surface hexagonal defects for high Al-content AlGaN/GaN heterostructures.     

Neutron irradiation effects on A1GaN//GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors(HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10 15 cm 2.The dc characteristics of the devices,such as the drain saturation current and the maximum transconductance,decreased after neutron irradiation.The gate leakage currents increased obviously after neutron irradiation.However,the rf characteristics,such as the cut-off frequency and the maximum frequency,were hardly affected by neutron irradiation.The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism.It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas(2DEG) decreased after neutron irradiation.There was no evidence of the full-width at half-maximum of X-ray diffraction(XRD) rocking curve changing after irradiation,so the dislocation was not influenced by neutron irradiation.It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices.     

The effects of GaN capping layer thickness on two-dimensional electron mobility in GaN/AlGaN/GaN heterostructures

In this paper we present a study of the effect of GaN capping layer thickness on the two-dimensional (2D)-electron mobility and the two-dimensional electron gas (2DEG) sheet density which is formed near the AlGaN barrier/buffer GaN layer. This study is undertaken using a fully numerical calculation for GaN/Al_xGa_1−xN/GaN heterostructures with different Al mole fraction in the Al_xGa_1−xN barrier, and for various values of barrier layer thickness. The results of our analysis clearly indicate that increasing the GaN capping layer thickness leads to a decrease in the 2DEG density. Furthermore, it is found that the room-temperature 2D-electron mobility reaches a maximum value of approximately 1.8×10³ cm² /Vs⁻¹ for GaN capping layer thickness grater than 100 Å with an Al_0.32Ga_0.68N barrier layer of 200 Å thick. In contrast, for same structure, the 2DEG density decreases monotonically with GaN capping layer thickness, and eventually saturates at approximately 6×10¹² cm⁻² for capping layer thickness greater than 500 Å. A comparison between our calculated results with published experimental data is shown to be in good agreement for GaN capping layers up to 500 Å thickness.