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磷掺杂纳米硅薄膜的研制 总被引:8,自引:0,他引:8
用PECVD薄膜沉积方法,成功地制备了磷掺杂纳米硅(nc-Si:H(P))薄膜.用扫描隧道电镜(STM)、Raman散射、傅里叶变换红外吸收(FTIR)谱、电子自旋共振(ESR)、共振核反应(RNR)技术对掺磷纳米硅进行了结构分析,确认了样品的微结构为纳米相结构.掺磷后膜中纳米晶粒的平均尺寸d减小,一般在25—45nm之间,且排列更加有序.掺磷nc-Si:H膜具有较高的光吸收系数,光学带隙在173—178eV之间,和本征nc-Si:H相同.掺杂nc-Si:H薄膜电导率在10-1关键词: 相似文献
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掺杂纳米硅薄膜中电子自旋共振研究 总被引:2,自引:0,他引:2
研究了掺杂纳米硅薄膜(nc∶Si∶H)中的电子自旋共振(ESR)及与之相关的缺陷态.样品是用等离子体增强化学气相沉积方法制成,为两相结构,即纳米晶粒镶嵌于非晶本体之中.对掺磷的nc-Si∶H样品,测量出其ESR信号的g值为1.9990—1.9991,线宽ΔHpp为(40—42)×10-4T,ESR密度Nss为1017cm-3数量级.对掺硼的nc-Si∶H样品,其ESR信号的g值为2.0076—2.0078,ΔH关键词:纳米硅薄膜微结构电子自旋共振 相似文献
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氢化纳米硅(nc-Si:H)薄膜由于其具有奇异的结构和独特的性质,而引起广泛的关注.本文在等离子体增强化学气相淀积(PECVD)系统中,以高纯H2高度稀释SiH4为反应气体源,在射频和直流双重功率源的激励下制备成功具有纳米结构的nc-Si:H薄膜.利用高分辨率电子显微镜(HREM)、Raman散射谱(RSS)、扫描隧道电子显微镜(STM)等实验技术对nc-Si:H薄膜样品作了研究.基于对薄膜制备过程的动力学分析,提出nc-Si:H薄膜的分形生长模型:扩散与反应限关键词: 相似文献
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本文根据不确定度的分析方法,结合杨氏模量测量实验的教学情况,对用尺读望远镜视丝测距的不确定度进行了详细的分析,并给出了完整的测量和计算结果。 相似文献
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Summary We have shown through M?ssbauer spectroscopy that the electric field gradient (EFG), associated with an atomic defect, is
sensitive to the bending of ultrathin Si crystals. The changes in the EFG depend on the bending direction. A direct application
is the derivation of the orientation of defects that are located in the crystal’s surface region. We have used this observation
for determining the configuration of Co dimers in Si. Based on the bending experiments, the pair axis is found to point in
the <110> direction with respect to the host lattice.
Paper presented at ICAME-95, Rimini, 10–16 September 1995. 相似文献
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Xiaodong Zhu Jiajun Li Huibing Yang Fengbo Zhu Zhaoyi Guo Kun Huang Pengjie Hang Tao Chen Xuegong Yu Deren Yang 《固体物理学:研究快报》2024,18(3):2300349
Silicon nanomembrane (SiNM) has drawn great attention for the application in nanoelectrical devices as it shows excellent flexibility and is compatible with the integrated circuit process. The mechanical property measurement of the SiNM with nanoscale thickness is critical. A suspended SiNM (40 nm thick) for mechanical measurements is fabricated by transferring a chemically etched ultrathin monocrystalline silicon film from silicon on insulator wafer to a substrate with a multi-hole array. And then, the atomic force probe is utilized to load force on the free-standing SiNM to obtain a force deflection curve, and then the Young's modulus of such floating SiNM can be directly calculated based on the large deflection plane model. It shows that the Young's modulus of such SiNM is basically consistent with that of the bulk silicon. However, the SiNMs’ floating area significantly affects the results, i.e., the Young's modulus varies with the ratio of the suspended area diameter (i.e., hole diameter) to the film thickness. The Young's modulus is independent of hole diameter when the ratio is greater than 425. According to this relationship, the variation of Young's modulus can be predicted for arbitrary thick SiNMs and any transferable nanofilms. 相似文献
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掺杂石英系单模光纤对BSBS频移的影响 总被引:1,自引:0,他引:1
报道了对几种掺杂SiO2石英系单模光纤的背向受激布里渊散射(BSBS)谱的实验结果,结果表明其布里渊散射斯托克斯频移主要取决于纤芯的掺杂材料和浓度,进一步分析证明了光纤掺杂后将主要通过调制杨氏模量的变化,从而导致BSBS频移量减小. 相似文献
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In the analytic solution of residual stresses and bending in multi‐layer/substrate systems, Young's modulus of contact‐etch‐stop layer (CESL) stressor is a potential factor affecting the channel stress of complementary metal–oxide–semiconductor (CMOS) devices. To increase the level of Young's modulus of CESL stressor, the stress level of silicon channels could be boosted at a constant stress level and thickness of CESL as the result of stress simulation. Young's moduli of two widely adopted CESL stressors measured by a nanoindenter instrument, low‐pressure chemical vapor deposition silicon nitride (LP‐SiN) and plasma‐enhanced chemical vapor deposition silicon nitride (PE‐SiN), were 375.7 and 224.7 GPa, respectively. As a result of stress stimulation, the channel stress induced by LPSiN CESL could increase 30% higher than that of PE‐SiN CESL. Through the use of a tensile 1 GPa CESL stressor for the 90 nm n‐FETs, an extra 4% enhancement in drive current ID,sat was obtained in the device with an LP‐SiN CESL as compared to that with PE‐SiN. The electrical data is in good agreement with the prediction of the stress simulation. 相似文献
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采用电化学腐蚀制备多孔硅,利用场致发射扫描式电子显微镜(field emission scanning electron microscope,FESEM)观测多孔硅的二维微观形貌,利用Nano Indenter XP中的纳米轮廓扫描仪组件(nano profilometry, NP)得到其三维拓扑分析图像,分析了微观结构差异的原因并讨论了多孔硅内部微观结构对其机械性能的影响;利用MTS Nano Indenter XP纳米压入测量仪器,研究了多孔硅的显微硬度和杨氏模量随压入深度的变化规律,比较了不同孔隙率多孔硅的机械性能差别.实验结果测得40mA/cm2,60mA/cm2,80mA/cm2和100mA/cm2四个不同腐蚀电流密度条件下制备多孔硅样品的孔隙率在60%—80%范围内,孔隙率随着腐蚀电流密度的增加而增大;在氢氟酸(HF)浓度为20%的条件下制备出多孔硅样品的厚度在40μm—50μm范围内;测得多孔硅的平均硬度、平均杨氏模量分别在0.478GPa—1.171GPa和10.912GPa—17.15GPa范围内,并且其数值随腐蚀电流密度的增加而减小,在纳米硬度范围内随压入深度的增加而减小,在显微硬度范围内其数值保持相对恒定,分析了样品表面、厚度、微观结构,及环境对其机械性能的影响,得到了多孔硅力学性能随其微观尺度形貌的变化规律.关键词:多孔硅微观结构硬度杨氏模量 相似文献
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测量重力加速度的一种新方法 总被引:1,自引:0,他引:1
提出了一种测量重力加速度的新方法,结合CCD杨氏模量实验仪给出了重力加速度和杨氏模量的物理关系式,从测量结果可知,所测重力加速度与标准值相比其相对误差甚小,说明该实验方案确实可行,具有一定的应用价值。 相似文献
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针对宽波段微型光谱仪缺乏宽波段柔性探测器这一难题,提出了一种在紫外-可见-近红外波段内具有高吸收效率的掺杂柔性黑硅作为探测器吸光材料。首先,基于第一性原理计算了S和F元素掺杂后柔性黑硅的电子结构、能带结构和紫外-可见-近红外波段的光学吸收特性,得到了不同元素及浓度掺杂时,柔性黑硅的光学吸收系数。其次,将第一性原理计算结果与时域有限差分算法相结合,建立了柔性黑硅的吸收光谱模型。结果表明,掺入S和F元素后柔性黑硅的能带带隙均减小,吸收截止波长发生红移,且掺杂浓度越高,光学吸收系数越大。在1 500 nm波长处,50%浓度的S元素掺杂黑硅的吸光系数是1.5%浓度的S元素掺杂黑硅的吸光系数的8.3倍,50%浓度的F元素掺杂黑硅的吸光系数是1.5%浓度的F元素掺杂黑硅的吸光系数的3倍。在相同掺杂条件下,表面具有小尺寸微结构的柔性黑硅在近红外波段具有最高的吸收效率。最后,测试了制作的柔性黑硅样品,其吸光效率在紫外-可见波段高于95%,在近红外波段为70%~80%。 相似文献
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Nanoindentation was carried out on thin films of hydrogenated amorphous silicon (a-Si:H) prepared by plasma-enhanced chemical vapor deposition. The composite values of elastic (Young's) modulus, E c, and hardness, H c, of the film/substrate system were evaluated from the load–displacement curves using the Oliver–Pharr approach. The film-only parameters were obtained employing the extrapolation of the depth profiles of E c and H c. Scanning probe microscopy was employed to image the nanoindenter impressions and to estimate the effect of film roughness and material pile-up on the testing results. It was established that the elastic modulus of thin a-Si:H films is in the range 117–131 GPa, which is lower than for crystalline silicon. In contrast, the values of hardness are in the range 12.2–12.7 GPa, which is comparable to crystalline silicon and higher than for hydrogen-free amorphous silicon. It is suggested that the plastic deformation of a-Si:H proceeds through plastic flow and it is the presence of hydrogen in the amorphous matrix that leads to a higher hardness. 相似文献