氧化SiGe/Si多量子阱制备Si基SiGe弛豫衬底

SiGe弛豫衬底是制备高性能Si基SiGe光电子器件的基础平台。本文通过1050℃不同时间氧化SiGe/SiMQW材料,分析氧化过程中Ge组分、弛豫度的变化趋势,制备位错密度低、表面平整、弛豫度超过60%的Si基Si0.75Ge0.25缓冲层。     

氢化硅薄膜的晶化机理研究

采用PECVD工艺制备了非晶,微晶和多形硅薄膜,研究了电极间热梯度对氢化硅薄膜结构的影响.根据拉曼光谱得到了微晶硅的晶化率,并在椭偏仪中用BEMA模型验证了其准确性.根据理论模型研究了热梯度对微晶和多形硅薄膜沉积机理的影响.研究薄膜厚度对晶化率的影响表明微晶薄膜底端和表面之间存在晶化梯度,而多形硅薄膜中无晶化梯度存在.采用Tauc-Lorentz模型拟合得到薄膜的结构参数表明非晶硅薄膜的致密度和有序度低,而多形硅和微晶硅薄膜的有序度、致密度相近,且明显高于非晶硅. 关键词： 氢化硅 晶化 热梯度 结构     

应变Si1-xGex层中p型杂质电离常温和低温特性

本文采用解析的方法计算了应变Si1-xGex层中p型杂质电离度与Ge组分x、温度T以及掺杂浓度N的关系.发现常温时,在同一Ge组分下,随着掺杂浓度的升高,杂质的电离度的先变小,而后又迅速上升到1.在同一掺杂浓度下,轻掺杂时,杂质的电离度随Ge组分的增加先变大,而后几乎不变;重掺杂时,杂质电离能变为0后,杂质电离度为1.低温下,轻掺杂时,载流子低温冻析效应较为明显,杂质的电离度普遍较小,当掺杂浓度大于Mott转换点时,载流子冻析效应不再明显,电离率迅速上升到1.在同一Ge组分下,随着掺杂浓度的升高,杂质的电离度先变小,后变大,而后又迅速上升到1.在同一掺杂浓度下,轻掺杂时,杂质的电离度随Ge组分的增加变大;重掺杂时,杂质电离能变为0后,杂质电离度为1.     

700℃退火下铝调制镍硅锗薄膜的外延生长机理

文章研究了在700℃退火下,铝插入层调制镍和硅锗合金反应形成单相镍硅锗化物的生长机理.透射电镜测试结果表明,镍硅锗薄膜和硅锗衬底基本达到赝晶生长;二次质谱仪和卢瑟福沟道背散射测试结果表明,在镍硅锗薄膜形成的过程中,铝原子大部分移动到镍硅锗薄膜的表面.研究结果表明,铝原子的存在延迟了镍和硅锗合金的反应,镍硅锗薄膜的热稳定性和均匀性都得到了提高.最后,基于上述实验结果给出了铝原子调制形成外延镍硅锗薄膜的生长机理.     

热处理对富硅氧化硅薄膜中硅纳米晶形成的影响

采用磁控溅射法制备了富硅氧化硅薄膜, 然后分别经过一步热处理、两步热处理和快速热处理制备了镶嵌有硅纳米晶的氧化硅薄膜. 实验结果表明, 在硅含量为～ 42.63 at.%的富硅氧化硅薄膜中, 三种热处理均能形成10¹²/cm²量级的硅纳米晶. 其中在两步热处理中, 硅纳米晶的密度最高, 达到2.2× 10¹²/cm², 并且尺寸均匀、结晶完整性好; 一步热处理后的样品中, 硅纳米晶密度较低, 并且部分纳米晶结晶不充分; 快速热处理后的样品中, 硅纳米晶密度最低、尺寸分布不均匀, 并且存在孪晶结构. 分析认为, 热处理初始阶段的形核过程对纳米晶的密度及微观结构有着重要的影响, 两步热处理中的低温段促进了纳米晶的成核, 有助于形成高密度高质量硅纳米晶.     

纳米晶聚合物复合薄膜PbTiO3-PEK-c的电光特性及其弛豫过程的研究

制备了掺杂型纳米晶聚合物钛酸铅聚醚醚酮 (PbTiO3 PEK c)复合薄膜 ,采用简单透射技术测量了该复合薄膜的线性电光系数 ,并研究了该复合薄膜的电光特性的弛豫过程     

高压下的Ge和Si的相变

 本文采用赝势方法研究Ⅳ族元素Ge和Si宰高压下的共价键－金属相相变，计算了状态方程、相平衡压力、体积跃变量及其金属相的超导临界温度。结果表明，理论与实验符合都比较好。     

氢钝化对硅纳米晶发光强度的影响

通过热蒸发方法在单晶硅衬底上沉积了SiO/SiO₂超晶格样品,在氮气保护下对样品进行高温退火,得到硅纳米晶/SiO₂超晶格结构。随后将该结构样品分别注入3.0×1014和3.0×1015 cm-2两种剂量的H+。通过对样品的光致发光光谱的分析发现,H+注入后未经过二次退火的样品发光强度急剧下降;二次退火后的样品,随着退火温度的升高,发光强度逐渐增强;注入足够剂量的H+,其发光强度可以远远超过未注入时的发光强度。研究表明,样品发光强度的变化取决于样品内部缺陷面密度的改变,而缺陷面密度是由氢离子的注入剂量和注入后再退火的温度等因素决定的。     

低温拉曼光谱研究二氧化钛纳米晶的相变

本文通过对二氧化钛纳米晶在-190℃温度的低温拉曼光谱的研究,得到了在二氧化钛纳米晶聚集体中,可以发生锐钛矿到板钛矿然后到金红石和/或直接到金红石的相变;也可发生板钛矿到锐钛矿然后到金红石和/或直接到金红石的相变。     

准晶的弹性,塑性与位错

本文较系统地综述了适合准晶的线弹性理论，准品位错的基本理论和实验鉴定，准晶位错的弹性理论，以及准晶高温塑性形变的微观机制。     

分子束外延生长SiGe合金中位错密度的研究

Schimmel腐蚀液腐蚀结合高倍光学显微镜观察发现，不同尺寸的掩膜窗内生长的SiGe外延层中的位错密度在整个外延层中从SiGe/Si界面到SiGe外延层表面由少到多，再由多到少明显地分成3个区，无掩膜窗限制的大面积区内的SiGe层则只呈现2个区，掩膜材料与掩膜窗尺寸不同，这3个区的位错密度也不同，掩膜形成过程中产生的应力对衬底晶格的影响，以及掩膜边界对衬底与外延层的影响是造成这种不同的根本原因。     

Si/SiGe异质结构的硅盖层中应变对Raman谱特征的影响

应变Si/SiGe异质结构通过大剂量Ge离子注入并结合高温快速热退火制备而成。325 nm波长的紫外激光被用于调查应变Si盖层的Raman谱特征。实验发现,硅盖层中的张应变导致硅的520 cm-1的一级拉曼散射峰向低频方向偏移,峰的偏移程度反映硅盖层中横向张应力的大小约为12.5×108 N·m-2。硅盖层中的张应变并未导致1 555和2 330 cm-1的次级拉曼散射峰的变化。     

Oxidation process of SiGe on SOI substrates

The oxidation of SiGe film epitaxial grown on top of SOI wafers has been studied. These SiGe/SOI samples were oxidized at 700, 900, 1100 °C. Germanium atoms were rejected from SiGe film to SOI layer. A new Si_1−xGe_x (x is minimal) layer formed at SiGe/Si interface. As the germanium atoms diffused, the new Si_1−xGe_x (x is minimal) layer moved to Si/SiO₂ interface. Propagation of threading dislocation in SiGe film to SOI substrate was hindered by the new SiGe/Si interface. Strain in SOI substrate transferred from SiGe film was released through dislocation nucleation and propagation inner. The relaxation of SiGe film could be described as: strain relaxed through strain equalization and transfer process between SiGe film and SOI substrates. Raman spectroscopy was used to characterize the strain of SiGe film. Microstructure of SiGe/SOI was observed by transmission electron microscope (TEM).     

pn结电容-电压法测量应变SiGe禁带宽度

利用应变SiGe/Si异质pn结电容-电压（C-V）特性确定SiGe禁带宽度的技术.该技术根据SiGe/Si异质pn结C-V实验曲线，计算出 pn结接触电势差，并得到SiGe/Si的价带偏移量和导带偏移量，进而求得SiGe禁带宽度.该技术测试方法简便，其过程物理意义清晰，既适用于分立的SiGe/Si异质pn结，也可直接分析SiGe/Si异质结器件中的SiGe 禁带宽度.实验结果与理论计算及其他相关文献报道的结果符合较好. 关键词： SiGe/Si 异质pn结 C-V 禁带宽度     

Electron spin resonance of the two-dimensional metallic state and the quantum Hall state in a Si/SiGe quantum well

We report electrically detected electron spin resonance (ESR) measurements of a high mobility two-dimensional (2D) electron system formed in a Si/SiGe quantum well, with millimeter wave in a high magnetic field . The negative ESR signal observed under an in-plane magnetic field gives direct evidence that the spin polarization leads to a resistance increase in the 2D metallic state. Suppression of spin decoherence was observed in the quantum Hall state at the Landau level filling factor ν=2. Strength of the nuclear magnetic field in the resonance is evaluated to be less than , much smaller than that reported for GaAs/AlGaAs heterostructures.     

Role of Ge interlayer in the growth of high-quality strain relaxed SiGe layer with low dislocation density

High-quality strain relaxed SiGe layer has been fabricated on Si using a thin Ge interlayer grown at 330 °C. The properties of SiGe layers with and without the low-temperature Ge interlayer are compared. The results indicate that the Ge interlayer plays an important role in the preparation of SiGe layer. The strain relaxed low-temperature Ge interlayer with coalesced island surface, acting as a stable and compliant template, could remove the cross-hatch misfit dislocation lines on surface and promote the strain relaxation in the SiGe layer homogeneously.     

SiGe/Si异质结缺陷的光致发光研究

本文用光致发光(PL)光谱对Si0.87Ge0.13/Si异质结的缺陷进行了研究。对PL光谱中与SiGe外延层应变驰豫产生的失配位错相关的D-Band进行了分析,发现应变驰豫同时在SiGe层和Si衬底中诱生了位错。由于在PL光谱中观察到了D1而没有观察到D2,因此D1,D2很可能并不对应于相同的位错。通过进一步的分析,我们推测引起SiGe/Si异质结的PL光谱中D-Band的位错的微观结构很可能和Si-Si相关。     

First principles calculation of the opto-electronic properties of (110) growth axis SiGe superlattices

Using two versions of the first principles full potential linear muffin-tin orbitals method (FPLMTO) which enable an accurate treatment of the interstitial regions, the electronic and optical properties of (110) growth axis Si/SiGe superlattices are investigated. A comparative study with (001) growth axis superlattices is made. In particular, it is found that the bottom of the conduction band (CB) is closer to Γ$\Gamma$ in the (110) system but the optical activity is not enhanced. Furthermore, the absorption spectra of the superlattices are calculated and are found to be quite different from those of bulk Si and Ge but fairly close to their average.     

SiGe电荷注入晶体管的直流特性模型

为了能直观地体现SiGe/Si电荷注入晶体管的收集极电流与漏源电压的关系，利用输入端SiGe/Si量子阱中二维空穴气的隧道模型，建立起此类器件的输入输出数学模型，并利用MATLAB软件对所建模型进行了模拟，结果显示在漏源电压约为1.5 V时，漏电流出现较强的负微分电阻效应，与文献报道结果符合. 关键词： SiGe/Si异质结 电荷注入晶体管 二维空穴气 隧道效应     

On the various impact of chemical composition and elastic strain in SiGe nanoscale islands to the diffuse X-ray scattering

High-resolution X-ray diffraction in combination with kinematical scattering simulations based on finite element calculations for the elastic strain field has been utilized to investigate the chemical composition of SiGe/Si(0 0 1) Stranski–Krastanov islands. Therefore, the intensity distribution in the vicinity of the symmetric (0 0 4) reflection has been three dimensionally measured and compared with respective simulations. Around an asymmetrical reflection, e.g. Si(1 1 3), the impact of lateral and vertical strain tensor components on the diffraction pattern decouples. This allows to distinguish between tetragonally distorted regions at the island bottom and elastically relaxed unit cells of cubic shape at the island apex in accordance with finite element calculations. Artificially switching off and on the various scattering abilities of silicon and germanium in otherwise equivalent simulations yields practically no difference in the resulting scattering. Thus, at X-ray energies far from absorption edges, the diffuse scattering is dominated by elastic strain which is caused by the chemical profile.