Spontaneous polarization and piezoelectric effects on intraband relaxation time in a wurtzite GaN/AlGaN quantum well

Spontaneous (SP) and piezoelectric (PZ) polarization effects on the intraband relaxation time for a wurtzite (WZ) GaN/AlGaN quantum well (QW) are investigated theoretically as functions of the sheet carrier density and well thickness. The self-consistent (SC) model with the SP and PZ polarizations shows that linewidths for carrier–carrier and carrier–phonon scatterings are significantly reduced compared to those for the flat-band (FB) model without SP and PZ polarization. In particular, line-widths for the e–h and h–e scatterings are reduced by about two orders of magnitude at a sheet carrier density as low as 2×10¹² cm^-2 compared to the case of the FB model. This is attributed to the decrease of the matrix element due to the spatial separation between electron and hole wave functions. In the case of the e–e and h–h scatterings, the reduction of linewidths is mainly attributed to the decrease of the scattering matrix element due to the increase of the inverse screening length. Linewidths for e–h and h–e scatterings gradually increase with the sheet carrier density since the screening field increases, while linewidths for the other scatterings are almost independent of the sheet carrier density. The SC model also shows that linewidths for the carrier–carrier and carrier–phonon scatterings are nearly, constant irrespective of well thickness except for e–h and h–e scatterings. In the case of e–h and h–e scatterings, linewidths greatly decrease with the well width because of the increase of the spatial separation of wave functions. Received in final version: 13 July 2000 / Accepted: 13 July 2000 / Published online: 16 August 2000     

Linewidth enhancement factor of quantumdot lasers

The linewidth enhancement factor (α) of inhomogenously broadened InAs/GaAs quantum dot (QD) lasers is studied taking into account the effect of the multi-discrete QD energy levels for both electrons and holes. The effect of size-fluctuation and the separation between the energy states on α for different applied bias is studied. Very small value of α (∼0.3) is obtained at high-applied bias. This value is smaller than the linewidth enhancement factor in quantum well lasers. An empirical formula for the linewidth enhancement factor is also derived.     

Simulation of polarization effects in AlGaN/GaN heterojunction

Because of their large band-gap, large high-field electron velocity, large breakdownfield, and large thermal conductivity, GaN and its heterojunction with AlGaN and InGaNhave foreseeable potential in the applications of high-power/temperature electronics, andoptoelectronic devices operative in UV and visible wavelength. Polarization inducedelectric field can reach the magnitude of ~MV/cm[1,2]. For AlGaN/GaN based FETs theconcentration of sheet carrier induced by polarization in the cha…     

Hydrogenic impurity states in wurtzite GaN/AlGaN coupled quantum dots

The ground-state binding energy of a hydrogenic donor impurity in wurtzite (WZ) GaN/AlGaN coupled quantum dots (QDs) is calculated by means of a variational method, considering the strong built-in electric fields caused by the piezoelectricity and spontaneous polarizations. The strong built-in electric fields induce an asymmetrical distribution of the ground-state binding energy with respect to the center of the coupled QDs. If the impurity is located at the low dot, the ground-state binding energy is insensitive to the interdot barrier width of WZ GaN/AlGaN coupled QDs.     

外加电场和Al组分对纤锌矿AlGaN/GaN量子阱中的电子g因子的影响

研究了外加电场和垒层的Al组分对AlGaN/GaN量子阱中的横向和纵向g因子(g⊥和g//)及其各向异性(δg)的影响.纤锌矿体结构的贡献(S_//~(bulk)和g⊥)是构成g⊥=(g//-g_0)=g_//~(bulk)的主要部分,但g_//~(bulk)和g⊥的差值很小且几乎不随外加电场和Al组分改变.当外加电场的方向同极化电场的方向相同(相反)且增加时,g_//~(bulk)和g_⊥~(bulk)的强度同时增加(减小).当外加电场从-1.5×10~8 V·m~(-1)到1.5×10~8 V·m~(-1)变化时,异质结界面对g⊥的贡献(Γ_(Inter))大于0且强度缓慢增加,阱层对g⊥的贡献(Γ_W)小于0且强度也缓慢增加.然而Γ_(Inter)的强度比Γ_w大,且后者的强度随着外加电场的改变增加较快,所以δg0且强度随着外加电场的变化而减小.当垒层的Al组分增加时,如果不考虑应变效应(S_(1,2)=0),g_//~(bulk)和g⊥的强度同时减小,然而考虑应变效应后(S_(1,2)≠0),β_1g⊥和γ1(g_//~(bulk))的强度随着Al组分的增加而增加.随着垒层Al组分的增加,Γ_(Inter)和Γ_w的强度都增加,但Γ_(Inter)的强度较大且增加得较快,所以的的强度缓慢增加.g⊥的强度先随着Al组分的增加而减小,然后又随着Al组分的增加而增加,因为g⊥小于0且强度随着Al组分增加得很快.结果表明,AlGaN/GaN量子阱结构中的电子g因子及其各向异性可以被外加电场、垒层的Al组分、应变效应和量子限制效应共同调制.     

用逆压电极化模型对AlGaN/GaN 高电子迁移率晶体管电流崩塌现象的研究

通过自洽求解一维Poisson-Schrdinger方程,模拟了AlGaN/GaN高电子迁移率晶体管在工作时等效外电场对AlGaN/GaN异质结沟道处二维电子气(2DEG)浓度的影响.分析了逆压电极化效应的作用,从正-逆压电极化现象出发,提出了逆压电极化模型.计算结果显示：逆压电极化明显影响2DEG性质,当Al组分x=0.3,AlGaN层厚度为20 nm时,不考虑逆压电极化,2DEG浓度为1.53×10¹³cm^-2;当等效外电压分别为10和15V 关键词： AlGaN/GaN高电子迁移率晶体管 Poisson-Schrdinger方程 逆压电极化模型 电流崩塌     

极化效应对AlGaN/GaN异质结p-i-n光探测器的影响

基于等效薄层电荷近似模拟表征极化电荷的作用, 通过自洽求解Poisson-Schrödinger方程以及求解载流子连续性方程, 计算并且讨论了p-AlGaN层掺杂浓度和界面极化电荷对AlGaN/GaN异质结p-i-n紫外探测器能带结构和电场分布以及光电响应的影响. 结果表明, 极化效应与p-AlGaN层掺杂浓度相互作用对探测器性能有较大影响. 其中, 在完全极化条件下, p-AlGaN层掺杂浓度越大, p-AlGaN层的耗尽区越窄, i-GaN层越容易被耗尽, 器件光电流越小. 在一定掺杂浓度条件下, 极化效应越强, p-AlGaN层的耗尽区越宽, 器件的光电流越大. 最后还分析了该结构在不同温度下的探测性能, 证明了该结构可以在高温下正常工作.     

Photoluminescence enhancement by localized surface plasmons in AlGaN/GaN/AlGaN double heterostructures

Double heterostructures AlGaN/GaN/AlGaN grown by hydride vapor phase epitaxy and designed for use as light emitting diodes for 360 nm wavelength were patterned by shallow nanoholes and injected with Ag/SiO₂ or Al nanoparticles. A 1.8 times increase in the photoluminescence and microcathodoluminescence signal from the GaN active region was observed for 100 nm diameter Al nanoparticles, the efficiency decreased compared to the reference planar samples for small Al nanoparticles of 30–40 nm diameter, and a moderate increase of 1.2 times was detected for Ag/SiO₂ nanoparticles. The observed phenomena are explained by the GaN emitter coupling with localized surface plasmons produced by metallic nanoparticles. (© 2015 WILEY‐VCH Verlag GmbH &Co. KGaA, Weinheim)     

纤锌矿AlGaN/AlN/GaN异质结构中光学声子散射影响的电子迁移率

对含有AlN插入层纤锌矿Al_xGa_1-xN/AlN/GaN异质结构,考虑有限厚势垒和导带弯曲的实际 异质结势,同时计入自发极化和压电极化效应产生的内建电场作用,采用数值自洽求解薛定谔方程和泊松方程, 获得二维电子气(2DEG)中电子的本征态和本征能级.依据介电连续模型和Loudon单轴晶体模型, 用转移矩阵法分析该体系中可能存在的光学声子模及三元混晶效应.进一步, 在室温下计及各种可能存在的光学声子散射,推广雷-丁平衡方程方法,讨论2DEG分布及二维电子迁移率的 尺寸效应和三元混晶效应.结果显示: AlN插入层厚度和Al_xGa_1-xN势垒层中Al组分的增加均会 增强GaN层中的内建电场强度,致使2DEG的分布更靠近异质结界面,使界面光学声子强于其他类型的 光学声子对电子的散射作用而成为影响电子迁移率的主导因素.适当调整AlN插入层的厚度和Al组分, 可获得较高的电子迁移率.     

Built-in electric field effect on hydrogenic impurity in wurtzite GaN/AlGaN quantum dot

The binding energy of a hydrogenic donor impurity in a wurtzite (WZ) GaN/AlGaN quantum dot (QD) is investigated, including the strong built-in electric field effect due to the spontaneous and piezoelectric polarizations. Numerical results show that the strong built-in electric field induces an asymmetrical distribution of the donor binding energy with respect to the center of the QD. The donor binding energy is insensitive to dot height when the impurity is located at the right boundary of the QD with large dot height.     

Piezoelectric polarization and quantum size effects on the vertical transport in AlGaN/GaN resonant tunneling diodes

In this work,the electronic properties of resonant tunneling diodes(RTDs) based on GaN-AlxGa(1-x)N double barriers are investigated by using the non-equilibrium Green functions formalism(NEG).These materials each present a wide conduction band discontinuity and a strong internal piezoelectric field,which greatly affect the electronic transport properties.The electronic density,the transmission coefficient,and the current–voltage characteristics are computed with considering the spontaneous and piezoelectric polarizations.The influence of the quantum size on the transmission coefficient is analyzed by varying GaN quantum well thickness,Al_xGa_(1-x)N width,and the aluminum concentration x_(Al).The results show that the transmission coefficient more strongly depends on the thickness of the quantum well than the barrier;it exhibits a series of resonant peaks and valleys as the quantum well width increases.In addition,it is found that the negative differential resistance(NDR) in the current–voltage(I–V) characteristic strongly depends on aluminum concentration xAl.It is shown that the peak-to-valley ratio(PVR) increases with xAlvalue decreasing.These findings open the door for developing vertical transport nitrides-based ISB devices such as THz lasers and detectors.     

Magneto-gyrotropic photogalvanic effects in GaN/AlGaN two-dimensional systems

Magneto-gyrotropic photogalvanic and spin-galvanic effects are observed in (0001)-oriented GaN/AlGaN heterojunctions excited by terahertz radiation. We show that free-carrier absorption of linearly or circularly polarized terahertz radiation in low-dimensional structures causes an electric photocurrent in the presence of an in-plane magnetic field. Microscopic mechanisms of these photocurrents based on spin-related phenomena are discussed. Properties of the magneto-gyrotropic and spin-galvanic effects specific for hexagonal heterostructures are analyzed.     

The effects of GaN capping layer thickness on two-dimensional electron mobility in GaN/AlGaN/GaN heterostructures

In this paper we present a study of the effect of GaN capping layer thickness on the two-dimensional (2D)-electron mobility and the two-dimensional electron gas (2DEG) sheet density which is formed near the AlGaN barrier/buffer GaN layer. This study is undertaken using a fully numerical calculation for GaN/Al_xGa_1−xN/GaN heterostructures with different Al mole fraction in the Al_xGa_1−xN barrier, and for various values of barrier layer thickness. The results of our analysis clearly indicate that increasing the GaN capping layer thickness leads to a decrease in the 2DEG density. Furthermore, it is found that the room-temperature 2D-electron mobility reaches a maximum value of approximately 1.8×10³ cm² /Vs⁻¹ for GaN capping layer thickness grater than 100 Å with an Al_0.32Ga_0.68N barrier layer of 200 Å thick. In contrast, for same structure, the 2DEG density decreases monotonically with GaN capping layer thickness, and eventually saturates at approximately 6×10¹² cm⁻² for capping layer thickness greater than 500 Å. A comparison between our calculated results with published experimental data is shown to be in good agreement for GaN capping layers up to 500 Å thickness.     

A novel enhancement mode AlGaN/GaN high electron mobility transistor with split floating gates

A novel enhancement-mode AlGaN/GaN high electron mobility transistor(HEMT) is proposed and studied.Specifically,several split floating gates(FGs) with negative charges are inserted to the conventional MIS structure.The simulation results revealed that the V_(th) decreases with the increase of polarization sheet charge density and the tunnel dielectric(between FGs and AlGaN) thickness,while it increases with the increase of FGs sheet charge density and blocking dielectric(between FGs and control gate) thickness.In the case of the same gate length,the V_(th) will left shift with decreasing FG length.More interestingly,the split FGs could significantly reduce the device failure probability in comparison with the single large area FG structure.     

Growth condition optimization and mobility enhancement through prolonging the GaN nuclei coalescence process of AlGaN/AlN/GaN structure

AlGaN/AlN/GaN structures are grown by metalorganic vapor phase epitaxy on sapphire substrates. Influences of AlN interlayer thickness, AlGaN barrier thickness, and Al composition on the two-dimensional electron gas(2DEG) performance are investigated. Lowering the V/III ratio and enhancing the reactor pressure at the initial stage of the hightemperature GaN layer growth will prolong the GaN nuclei coalescence process and effectively improve the crystalline quality and the interface morphology, diminishing the interface roughness scattering and improving 2DEG mobility. AlGaN/AlN/GaN structure with 2DEG sheet density of 1.19 × 1013cm-2, electron mobility of 2101 cm2·V-1·s-1, and square resistance of 249 ? is obtained.     

Polarization effects and energy band diagram in AlGaN/GaN heterostructure

We report on a classical approach used to calculate energy band diagrams of AlGaN/GaN heterostructures. We were able to calculate the band diagram and carrier concentrations by this method also when the external bias was applied on the structure. The potential on the Schottky barrier side of the structure is defined more exactly than in a self-consistent solution of Poisson and Schrödinger equations. Dependence of the band profile and the carrier concentration of the two-dimensional gas on the piezoelectric charge can also be calculated by this approach.     

Influence of the AlGaN barrier thickness on polarization Coulomb field scattering in an AlGaN/AlN/GaN heterostructure field-effect transistor

In this study rectangular AlGaN/AlN/GaN heterostructure field-effect transistors(HFETs) with 22-nm and 12-nm AlGaN barrier layers are fabricated, respectively. Using the measured capacitance–voltage and current–voltage characteristics of the prepared devices with different Schottky areas, it is found that after processing the device, the polarization Coulomb field(PCF) scattering is induced and has an important influence on the two-dimensional electron gas electron mobility.Moreover, the influence of PCF scattering on the electron mobility is enhanced by reducing the AlGaN barrier thickness.This leads to the quite different variation of the electron mobility with gate bias when compared with the AlGaN barrier thickness. This mainly happens because the thinner AlGaN barrier layer suffers from a much stronger electrical field when applying a gate bias, which gives rise to a stronger converse piezoelectric effect.     

Effects of donor density and temperature on electron systems in AlGaN/AlN/GaN and AlGaN/GaN structures

It was reported by Shen et al that the two-dimensional electron gas (2DEG) in an AlGaN/AlN/GaN structure showed high density and improved mobility compared with an AlGaN/GaN structure, but the potential of the AlGaN/AlN/GaN structure needs further exploration. By the self-consistent solving of one-dimensional Schr\"{o}dinger--Poisson equations, theoretical investigation is carried out about the effects of donor density (0--1\times 10¹⁹cm^-3 and temperature (50--500K) on the electron systems in the AlGaN/AlN/GaN and AlGaN/GaN structures. It is found that in the former structure, since the effective \Delta E_c is larger, the efficiency with which the 2DEG absorbs the electrons originating from donor ionization is higher, the resistance to parallel conduction is stronger, and the deterioration of 2DEG mobility is slower as the donor density rises. When temperature rises, the three-dimensional properties of the whole electron system become prominent for both of the structures, but the stability of 2DEG is higher in the former structure, which is also ascribed to the larger effective \Delta E_c. The Capacitance--Voltage (C-V) carrier density profiles at different temperatures are measured for two Schottky diodes on the considered heterostructure samples separately, showing obviously different 2DEG densities. And the temperature-dependent tendency of the experimental curves agrees well with our calculations.     

Neutron irradiation effects on AlGaN/GaN high electron mobility transistors

AlGaN/GaN high electron mobility transistors (HEMTs) were exposed to 1 MeV neutron irradiation at a neutron fluence of 1 × 10¹⁵ cm^-2. The dc characteristics of the devices, such as the drain saturation current and the maximum transconductance, decreased after neutron irradiation. The gate leakage currents increased obviously after neutron irradiation. However, the rf characteristics, such as the cut-off frequency and the maximum frequency, were hardly affected by neutron irradiation. The AlGaN/GaN heterojunctions have been employed for the better understanding of the degradation mechanism. It is shown in the Hall measurements and capacitance-voltage tests that the mobility and concentration of two-dimensional electron gas (2DEG) decreased after neutron irradiation. There was no evidence of the full-width at half-maximum of X-ray diffraction (XRD) rocking curve changing after irradiation, so the dislocation was not influenced by neutron irradiation. It is concluded that the point defects induced in AlGaN and GaN by neutron irradiation are the dominant mechanisms responsible for performance degradations of AlGaN/GaN HEMT devices.