UHV/CVD硅锗膜的Raman光谱分析

本文提出一种用Raman光谱测量SiGe合金膜中的锗组分及应变的方法,方法是非破坏的。并用这一方法测量了几种不同锗组分和膜厚度的SiGe合金样品,它们都是用UHV／CVD设备生长的,其中两个样品还与X－射线双晶衍射的结果作了比较,两种方法的结果十分一致,这说明本文提出的方法是准确可靠的,这些样品用于制作SiGe/Si异质结PMOSFET,对0．5um 沟长器件,跨导达112ms.mm^-1。     

硅基锗薄膜选区外延生长研究

利用超高真空化学气相沉积系统, 基于低温Ge缓冲层和选区外延技术, 在Si/SiO₂图形衬底上选择性外延生长Ge薄膜. 采用X射线衍射、扫描电镜、原子力显微镜、拉曼散射光谱等表征了其晶体质量和应变等参数随图形尺寸的变化规律. 测试结果显示, 位错密度随着图形衬底外延窗口的尺寸减小而减少, Ge层中的张应变随窗口尺寸的增大先增大而后趋于稳定. 其原因是选区外延Ge在图形边界形成了(113)面, 减小了材料系统的应变能, 而单位体积应变能随窗口尺寸的增加而减少; 选区外延厚度为380 nm的Ge薄膜X射线衍射曲线半高宽为678", 表面粗糙度为0.2 nm, 表明选区生长的Ge材料具有良好的晶体质量, 有望应用于Si基光电集成.     

Si(001)衬底上分子束外延生长Ge0.975Sn0.025合金薄膜

使用低、高温两步法生长的高质量Ge薄膜作为缓冲层,在Si(001)衬底上采用分子束外延法生长出Ge_0.975Sn_0.025合金薄膜.X射线双晶衍射和卢瑟福背散射谱等测试结果表明,Ge_0.975Sn_0.025合金薄膜具有很好的晶体质量,并且没有发生Sn表面分凝.另外,Ge_0.975Sn_0.025合金薄膜在500 ℃下具有很好的热稳定性,有望在Si基光电器件中得到应用. 关键词： GeSn Ge 分子束外延 外延生长     

锗硅异质结构的分子束外延生长和特性研究

 如果你有机会到复旦大学应用表面物理国家重点实验室来参观,走进分子束外延组,隔着宽敞的玻璃窗,你将看到一台大型实验设备.中间是三个大小不等、银光闪闪的超高真空腔体,上边接满了一根根电缆线,还有液氮管道、冷却水管、压缩空气管,一眼望去真有点叫人眼花缭乱;四周是几只高大的机柜,安装着一台台精密电子仪器.这就是我国第一台锗硅分子束外延设备,已经在这里服役六年多,状态良好,至今仍是国内唯一投入运行的IV族半导体材料的分子束外延系统,为我国在IV族半导体超晶格量子阱的某些研究领域保持世界先进水平立下汗马功劳.     

REBCO厚膜的液相外延生长研究

本文从基片和种膜、LPE的初始阶段研究和超导性能的控制这三个方面回顾总结了液相外延生长REBCO(RE=稀土元素)厚膜的研究进展.我课题组发现的高温超导体氧化物YBCO的过热现象直接证实了采用低包晶熔点的YBCO种膜可以生长包晶温度较高的REB-CO,丰富了种膜的选择范围,此现象尤为值得关注.在LPE生长的初始阶段存在种膜的部分溶解、夹杂的形成和与稀土元素种类有关的择优生长等现象,用包括曲率效应和界面能影响的粗化机制可以解释以上现象.因而生长高结晶性的LPE厚膜时选用高品质的种膜甚为重要.为优化生长工艺,须考虑种膜的品质、熔剂中的Ba/Cu比和气氛对Mg的污染和结晶取向,RE离子对Ba的替代等方面问题,以达到获得高质量的REBCO LPE厚膜的目的.     

GaAs/Ge的MOCVD生长研究

用常压MOCVD在Ge衬底上外延生长了GaAs单晶层,研究了GaAs和6e的极性与非极性材料异质外延生长,获得了质量优良的GaAs/Ge外延片,GaAs外延层X射线双晶衍射回摆曲线半高宽达16弧秒.10K下PL谱半峰宽为7meV.讨论了极性与非极性外延的界面反相畴问题和GaAs-Ge界面的Ga、Ge原子互扩散问题.     

700℃退火下铝调制镍硅锗薄膜的外延生长机理

文章研究了在700℃退火下,铝插入层调制镍和硅锗合金反应形成单相镍硅锗化物的生长机理.透射电镜测试结果表明,镍硅锗薄膜和硅锗衬底基本达到赝晶生长;二次质谱仪和卢瑟福沟道背散射测试结果表明,在镍硅锗薄膜形成的过程中,铝原子大部分移动到镍硅锗薄膜的表面.研究结果表明,铝原子的存在延迟了镍和硅锗合金的反应,镍硅锗薄膜的热稳定性和均匀性都得到了提高.最后,基于上述实验结果给出了铝原子调制形成外延镍硅锗薄膜的生长机理.     

硅基锗薄膜的异质外延生长及其在光电子器件中的应用

准直接带隙的锗,其禁带宽度小,吸收系数大,迁移率高,更重要的是,它能与硅微电子工艺兼容,在硅基光电集成中得到了广泛的研究和应用.文章综述了硅基锗薄膜的异质外延生长及其在光电子器件（特别是长波长光电探测器和激光器）应用上的进展;介绍了在硅衬底上异质外延生长锗薄膜的缓冲层技术,如组分变化的SiGe缓冲层技术、选区外延技术和低温技术;讨论了硅基锗薄膜光电探测器的性能与结构的关系以及发展趋势;分析了张应变和n型掺杂对锗光电性质的影响;展望了硅基锗薄膜单片集成和电抽运激光器的前景.     

锗/多孔硅和锗/氧化硅薄膜光致发光的比较研究

采用磁控溅射技术,以锗为溅射靶,在多孔硅上沉积锗薄膜,沉积时间分别为4,8和12 min,及以锗-二氧化硅复合靶为溅射靶,在n型硅衬底上沉积了含纳米锗颗粒的氧化硅薄膜,锗与总靶的面积比分别为5%,15%,30%.各样品在氮气氛中分别经过300,600及900℃退火30 min.对锗/多孔硅和锗/氧化硅薄膜进行了光致发光谱的对比研究,用红外吸收谱分析了锗/多孔硅的薄膜结构.实验结果显示,锗/多孔硅薄膜的发光峰位于517 nm附近,沉积时间对发光峰的强度有显著影响,锗层越厚峰强越弱.锗/氧化硅薄膜的发光峰位于580 nm附近,锗与总靶的面积比对发光峰的强度影响较大,锗/氧化硅薄膜中的锗含量越高峰强越弱.不同的退火温度对样品的发光峰强及峰位均没有明显影响.可以认为锗/多孔硅的发光峰是由多孔硅与孔间隙中的锗纳米晶粒两者界面的锗相关缺陷引起的,而锗/氧化硅的发光峰来自于二氧化硅的发光中心.     

侧向外延法生长的高质量GaN及其外延缺陷的观察

在有条状SiO2图形的GaN“模板”上,侧向外延方法生长了高质量的GaN。荧光显微镜的结果表明在SiO2掩膜区有成核过程发生。原因可能是SiO2的质量不高,为GaN的生长提供了一些成核中心。在GaN层的厚度达到4．5μm后,侧向的融合开始发生。侧向生长的速度与垂直生长速度几乎相同。在所有的SiO：掩膜上方都形成了空洞。样品在240℃熔融的KOH中腐蚀13min。在SiO2掩膜区生长的GaN,其腐蚀坑密度(相当于穿透位错密度)减少到几乎为零。而在窗口区生长的GaN,腐蚀坑密度仍然很高,达到10^8cm^-2量级。同时,我们发现具有不同窗口尺寸的样品在SiO2掩膜区上侧向生长的CaN的晶体质量基本相同,与窗口区的宽度几乎无关。室温光荧光结果表明侧向外延法生长的CaN中的晶格失配应力已被部分释放。     

Role of Ge interlayer in the growth of high-quality strain relaxed SiGe layer with low dislocation density

High-quality strain relaxed SiGe layer has been fabricated on Si using a thin Ge interlayer grown at 330 °C. The properties of SiGe layers with and without the low-temperature Ge interlayer are compared. The results indicate that the Ge interlayer plays an important role in the preparation of SiGe layer. The strain relaxed low-temperature Ge interlayer with coalesced island surface, acting as a stable and compliant template, could remove the cross-hatch misfit dislocation lines on surface and promote the strain relaxation in the SiGe layer homogeneously.     

Fabrication of high Ge content SiGe-on-insulator with low dislocation density by modified Ge condensation

A SiGe-on-insulator (SGOI) structure with high Ge content and low density of dislocations is fabricated by a modified Ge condensation technique. The formation and elimination of stacking faults during condensation process are analyzed by transmission electron microscopy. A Si_0.19Ge_0.81OI substrate is fabricated utilizing two steps of oxidation and intermittent annealing. The time of oxidation or annealing at 900 °C is essential for the elimination of stacking faults in high Ge content SGOI substrate. The surface morphology of SGOI is investigated by atomic force microscopy and the defect density is evaluated from wet etching method. After the final condensation, the surface root-mean-square roughness (rms) of SiGe layer is kept below 1 nm and the threading defect density is controlled around 10⁴ cm⁻². The smooth surface and integrated lattice structure of SiGe layer indicate that the SGOI is suitable for heteroepitaxial growth of strained Ge, GaAs and III-V compounds.     

掺杂对多层Ge/Si(001)量子点光致发光的影响

利用超高真空化学气相沉积设备, 在Si (001) 衬底上外延生长了多个四层Ge/Si量子点样品. 通过原位掺杂的方法, 对不同样品中的Ge/Si量子点分别进行了未掺杂、磷掺杂和硼掺杂. 相比未掺杂的样品, 磷掺杂不影响Ge/Si量子点的表面形貌, 但可以有效增强其室温光致发光; 而硼掺杂会增强Ge/Si量子点的合并, 降低小尺寸Ge/Si量子点的密度, 但其光致发光会减弱. 磷掺杂增强Ge/Si量子点光致发光的原因是, 磷掺杂为Ge/Si量子点提供了更多参与辐射复合的电子. 关键词： Ge/Si量子点 磷掺杂 光致发光     

Molecular beam epitaxy growth of GaAs on an offcut Ge substrate

Molecular beam epitaxy growth of GaAs on an offcut Ge (100) substrate has been systemically investigated. A high quality GaAs/Ge interface and GaAs film on Ge have been achieved. High temperature annealing before GaAs deposition is found to be indispensable to avoid anti-phase domains. The quality of the GaAs film is found to strongly depend on the GaAs/Ge interface and the beginning of GaAs deposition. The reason why both high temperature annealing and GaAs growth temperature can affect epitaxial GaAs film quality is discussed. High quality In_0.17Ga_0.83As/GaAs strained quantum wells have also been achieved on a Ge substrate. Samples show flat surface morphology and narrow photoluminescence line width compared with the same structure sample grown on a GaAs substrate. These results indicate a large application potential for III--V compound semiconductor optoelectronic devices on Ge substrates.     

Formation of Ge islands from a Ge layer on Si substrate during post-growth annealing

We have deposited a 12 nm thick Ge layer on Si(1 0 0) held at 200 °C by thermal evaporation under high vacuum conditions. Upon subsequent thermal annealing in vacuum, self-assembled growth of nanostructural Ge islands on the Ge layer occurred. Atomic force microscopy (AFM) and grazing incidence small-angle X-ray scattering (GISAXS) were used to characterize such layers. GISAXS measurements evidenced the formation of cylinder shaped structures upon annealing at 700 °C, which was confirmed by AFM measurements with a very sharp tip. A Ge mass transport from the layer to the islands was inferred by X-ray reflectivity and an activation energy of 0.40 ± 0.10 eV for such a process was calculated.     

Al3+对Ge/Al-SiO2薄膜光致发光的影响

采用磁控溅射及后退火技术制备了不同组份和不同退火温度的Ge、Al共掺SiO₂薄膜。通过对样品的X射线光电子能谱(XPS)测试,确定了薄膜的成分和结构特征;同时还测试了样品的光致发光谱(PL谱),得到了峰值位于420 nm附近的紫光发射峰和峰值位于470 nm的蓝光发射峰。实验结果表明, Al的掺杂不仅可以显著地提高GeNOV中心和SiNOV中心的光发射效率,还可以促进GeNOV缺陷和SiNOV缺陷中心的形成,进而有利于薄膜的光致发光。     

Room-temperature direct-bandgap photoluminescence from strain-compensated Ge/SiGe multiple quantum wells on silicon

Strain-compensated Ge/Si_0.15Ge_0.85 multiple quantum wells were grown on an Si_0.1Ge_0.9 virtual substrate using ultrahigh vacuum chemical vapor deposition technology on an n +-Si（001） substrate.Photoluminescence measurements were performed at room temperature,and the quantum confinement effect of the direct-bandgap transitions of a Ge quantum well was observed,which is in good agreement with the calculated results.The luminescence mechanism was discussed by recombination rate analysis and the temperature dependence of the luminescence spectrum.     

Room-temperature direct-bandgap photoluminescence from strain-compensated Ge/SiGe multiple quantum wells on silicon

Strain-compensated Ge/Si_0.15Ge_0.85 multiple quantum wells were grown on an Si_0.1>Ge_0.9 virtual substrate using ultrahigh vacuum chemical vapor deposition technology on an n⁺-Si(001) substrate. Photoluminescence measurements were performed at room temperature, and the quantum confinement effect of the direct-bandgap transitions of a Ge quantum well was observed, which is in good agreement with the calculated results. The luminescence mechanism was discussed by recombination rate analysis and the temperature dependence of the luminescence spectrum.     

用激光分子束外延在Si衬底上外延生长高质量的TiN薄膜

采用激光分子束外延技术,利用两步法,在Si单晶衬底上成功地外延生长出TiN薄膜材料.原子力显微镜分析结果显示, TiN薄膜材料表面光滑,在10 μm×10 μm范围内,均方根粗糙度为0842nm.霍耳效应测量结果显示,TiN薄膜在室温条件下的电阻率为36×10^-5Ω·cm,迁移率达到5830 cm²/V·S,表明TiN薄膜材料是一种优良的电极材料.X射线θ—2θ扫描结果和很高的迁移率均表明,高质量的TiN薄膜材料被外延在Si衬底 关键词： 激光分子束外延 TiN单晶薄膜 外延生长