Degradation mechanisms of current gain in NPN transistors

An investigation of ionization and displacement damage in silicon NPN bipolar junction transistors (BJTs) is presented. The transistors were irradiated separately with 90-keV electrons, 3-MeV protons and 40-MeV Br ions. Key parameters were measured {\em in-situ} and the change in current gain of the NPN BJTS was obtained at a fixed collector current (I_{\rm c}=1~mA). To characterise the radiation damage of NPN BJTs, the ionizing dose D_{\i} and displacement dose D_{\d} as functions of chip depth in the NPN BJTs were calculated using the SRIM and Geant4 code for protons, electrons and Br ions, respectively. Based on the discussion of the radiation damage equation for current gain, it is clear that the current gain degradation of the NPN BJTs is sensitive to both ionization and displacement damage. The degradation mechanism of the current gain is related to the ratio of D_{\rm d}/(D_{\rm d}+D_{\rm i}) in the sensitive region given by charged particles. The irradiation particles leading to lower D_{\rm d}/(D_{\rm d}+D_{\rm i}) within the same chip depth at a given total dose would mainly produce ionization damage to the NPN BJTs. On the other hand, the charged particles causing larger D_{\rm d}/(D_{\rm d}+D_{\rm i}) at a given total dose would tend to generate displacement damage to the NPN BJTs. The Messenger--Spratt equation could be used to describe the experimental data for the latter case.     

Incident particle range dependence of radiation damage in a power bipolar junction transistor

The characteristic degradations in silicon NPN bipolar junction transistors(BJTs) of type 3DD155 are examined under the irradiations of 25-MeV carbon(C),40-MeV silicon(Si),and 40-MeV chlorine(Cl) ions respectively.Different electrical parameters are measured in-situ during the exposure of heavy ions.The experimental data shows that the changes in the reciprocal of the gain variation((1/β)) of 3DD155 transistors irradiated respectively by 25-MeV C,40-MeV Si,and 40-MeV Cl ions each present a nonlinear behaviour at a low fluence and a linear response at a high fluence.The(1/β) of 3DD155 BJT irradiated by 25-MeV C ions is greatest at a given fluence,a little smaller when the device is irradiated by 40-MeV Si ions,and smallest in the case of the 40-MeV Cl ions irradiation.The measured and calculated results clearly show that the range of heavy ions in the base region of BJT affects the level of radiation damage.     

偏置条件对NPN及PNP双极晶体管电离辐射损伤的影响研究

本文采用低能电子辐照源对NPN及PNP晶体管进行辐照试验. 在辐照试验过程中, 针对NPN及PNP晶体管发射结施加不同的偏置条件, 研究偏置条件对NPN及PNP晶体管辐射损伤的影响. 使用Keithley 4200-SCS半导体特性测试仪在原位条件下测试了双极晶体管电性能参数随低能电子辐照注量的变化关系. 测试结果表明, 在相同的辐照注量条件下, 发射结反向偏置时双极晶体管的辐照损伤程度最大; 发射结正向偏置时双极晶体管的辐照损伤程度最小; 发射结零偏时双极晶体管的辐照损伤程度居于上述情况之间. 关键词： 双极晶体管 低能电子 电离辐射     

电子辐射环境中NPN输入双极运算放大器的辐射效应和退火特性

本文对不同偏置下的NPN输入双极运算放大器LM108分别在1.8 MeV和1 MeV两种电子能量下、不同束流电子辐照环境中的损伤特性及变化规律进行了研究, 分析了不同偏置状态下其辐照敏感参数在辐照后三种温度 (室温, 100 ℃, 125 ℃) 下随时间变化的关系, 讨论了引起电参数失效的机理, 并且分析了器件在室温和高温的退火效应以讨论引起器件电参数失效的机理. 结果表明, 1.8 MeV和1 MeV 电子对运算放大器LM108主要产生电离损伤, 相同束流下1.8 MeV电子造成的损伤比1 MeV 电子更大, 相同能量下0.32 Gy(Si)/s束流电子产生的损伤大于1.53 Gy(Si)/s束流电子. 对于相同能量和束流的电子辐照, 器件零偏时的损伤大于正偏时的损伤. 器件辐照后的退火行为都与温度有较大的依赖关系, 而这种关系与辐照感生的界面态密度增长直接相关.     

Si_3N_4钝化层对横向PNP双极晶体管电离辐射损伤的影响机理

航天器中电子器件在轨服役期间,会遭受到空间带电粒子及各种射线的辐射环境的显著影响,易于造成电离辐射损伤.本文采用60Coγ射线辐照源,针对有/无Si_3N_4钝化层结构的横向PNP型(LPNP)双极晶体管,开展了电离辐射损伤效应及机理研究.利用KEITHLEY 4200-SCS半导体参数测试仪测试了LPNP晶体管电性能参数(包括Gummel特性曲线和电流增益等).采用深能级瞬态谱分析仪(DLTS),对辐照前后有/无Si_3N_4钝化层结构的LPNP晶体管的电离缺陷进行测试.研究结果表明,在相同吸收剂量条件下,与无Si_3N_4钝化层的晶体管相比,具有Si_3N_4钝化层的LPNP晶体管基极电流退化程度大,并且随吸收剂量的增加,电流增益退化更为显著.通过DLTS分析表明,与无Si_3N_4钝化层的晶体管相比,有Si_3N_4钝化层的晶体管辐射诱导的界面态能级位置更接近于禁带中心.这是由于制备Si_3N_4钝化层时引入了大量的氢所导致,而氢的存在会促使辐射诱导的界面态能级位置更接近于禁带中心,复合率增大,从而加剧了晶体管性能的退化.     

Analysis of displacement damage effects on bipolar transistors irradiated by spallation neutrons

Displacement damage induced by neutron irradiation in China Spallation Neutron Source(CSNS) is studied on bipolar transistors with lateral PNP, substrate PNP, and vertical NPN configurations, respectively. Comparison of the effects on different type transistors is conducted based on displacement damage factor, and the differences are analyzed through minority carrier lifetime calculation and structure analysis. The influence of CSNS neutrons irradiation on the lateral PNP transistors is analyzed by the gate-controlled method, including the oxide charge accumulation, surface recombine velocity,and minority carrier lifetime. The results indicate that the total ionizing dose in CSNS neutron radiation environment is negligible in this study. The displacement damage factors based on 1-MeV equivalent neutron flux of different transistors are consistent between Xi'an pulse reactor(XAPR) and CSNS.     

质子辐照硼硅酸盐玻璃盖片的物理效应分析

作为航天器电源系统的重要组成部分,太阳电池需要更高的转换效率和可靠性以及更长的使用寿命。通过在太阳电池表面覆盖抗辐照玻璃盖片,可以增强太阳电池对粒子辐射的防护,延长太阳电池的服役寿命,使航天器获得可靠的能源供应。硼硅酸盐玻璃就是一种理想的太阳电池玻璃盖片材料。采用蒙特卡罗方法,结合SRIM软件模拟研究质子辐照硼硅酸盐玻璃的损伤物理机理。基于粒子与物质相互作用的理论以及基本公式,通过分析不同入射能量的质子在硼硅酸盐玻璃中的阻止本领、电离能损、位移能损、空位的产生情况,对辐照损伤的物理机制进行研究。结果表明：能量为30～120 keV的质子辐照损伤主要发生在硼硅酸盐玻璃表面;质子沉积、空位分布等均为Bragg峰型分布;电离能损是能量损失的主要部分,随入射能量的增加而增大,导致电子的电离和激发;位移能损在玻璃内部随能量降低而增大,导致硼、氧和硅等空位缺陷的产生;电离效应和缺陷的产生是硼硅酸盐玻璃色心形成的重要原因。     

Radiation damage in Si photodiodes by high-temperature irradiation

Results are presented of a detailed study of the effects of high-temperature 4-MeV neutron irradiation on the performance degradation of Si pin photodiodes together with the radiation-induced defects, observed by deep level transient spectroscopy. The degradation of the device performance and the introduction rate of the lattice defects decrease with increasing sample temperature during irradiation. For a 250°C irradiation, the reduction of the reverse current is only 20% of the starting value. This result suggests that the creation and recovery of the radiation damage proceeds simultaneously at high temperatures. Carbon-related complex as hole capture levels is also mainly responsible for the device degradation for high-temperature neutron irradiation.     

Optical spectroscopy study of modifications induced in cerium dioxide by electron and ion irradiations

UV-visible absorption spectroscopy and Raman spectroscopy were used to study damage production in cerium dioxide epitaxial films and polycrystalline sintered samples after irradiation with electrons for three energies to span the threshold displacement energies of cerium and oxygen atoms, and 2.4-MeV Cu ions. Neither amorphization nor specific colour-centre bands were detected. Evolutions of the refractive index were derived from the interference fringes in the optical transmission spectra of epilayers after irradiation. No significant change of the refractive index occurred for the 1.0-MeV electron irradiation, whereas a maximum decrease by 28?±?8% was deduced for the 1.4-MeV and 2.5-MeV energies. These modifications are consistent with ballistic damage on the cerium sublattice for high electron energies producing Ce³⁺ ions. However, no significant change of refractive index was found for the Cu ion irradiation. This likely stems from the high rate of Frenkel pair recombination in the collision cascades induced by more energetic recoils than for the electron irradiations, combined with electronic excitations and hole capture on Ce³⁺ ions. This study reveals modifications of the electronic structure upon irradiation that could take place in other non-amorphizable oxide systems.     

不同粒子辐射条件下CC4013器件辐射损伤研究

本文采用60 MeV Br离子、5 MeV质子和1 MeV电子等三种辐射源, 针对CC4013型互补金属氧化物半导体器件(complementary metal oxide semiconductor, CMOS)进行辐射损伤研究. 通过Geant4程序计算了该器件电离辐射吸收剂量与芯片厚度的关系, 经过计算, 在相同注量下, 60 MeV Br离子的电离吸收剂量最大, 1 MeV电子产生的电离吸收剂量最小. 应用Keithley4200-SCS半导体特性分析仪在原位条件下研究了CC4013器件电性能参数随辐射吸收剂量的变化关系. 测试结果表明, 相同电离辐射吸收剂量下, 1 MeV电子对CC4013器件的阈值电压参数影响最大, 5 MeV质子其次, 60 MeV Br离子的影响最弱. 关键词： CMOS器件 高能带电粒子 电离辐射 辐射损伤     

质子在碳化硅中不同深度的非电离能量损失

利用蒙特卡罗方法,应用Geant4程序,模拟计算了1—500 MeV质子在碳化硅材料中的非电离能量损失,并研究了不同种类的初级反冲原子对非电离能量损失的贡献.模拟结果表明:在相同质子辐照下,碳化硅材料中的非电离能量损失要比硅、镓等半导体材料更小,说明碳化硅器件的稳定性更好,抗位移损伤能力更强;当靶材料足够厚时,在不同能量质子辐照下,材料损伤最严重的区域会随着质子入射能量的增加从质子射程末端逐渐前移到材料表面;不同种类的初级反冲原子对非电离能量损失的贡献表明,在低能质子辐照下,28Si和~(12)C是位移损伤的主要原因,而随着质子能量的增加,通过核反应等过程产生的次级离子迅速增多,并对材料浅层造成严重的位移损伤.     

Radiation effects on MOS and bipolar devices by 8 MeV protons, 60 MeV Br ions and 1 MeV electrons

The radiation effects of the metal-oxide-semiconductor (MOS) and the bipolar devices are characterised using 8~MeV protons, 60~MeV Br ions and 1~MeV electrons. Key parameters are measured {\it in-situ} and compared for the devices. The ionising and nonionising energy losses of incident particles are calculated using the Geant4 and the stopping and range of ions in matter code. The results of the experiment and energy loss calculation for different particles show that different incident particles may give different contribution to MOS and bipolar devices. The irradiation particles, which cause larger displacement dose within the same chip depth of bipolar devices at a given total dose, would generate more severe damage to the voltage parameters of the bipolar devices. On the contrary, the irradiation particles, which cause larger ionising damage in the gate oxide, would generate more severe damage to MOS devices. In this investigation, we attempt to analyse the sensitivity to radiation damage of the different parameter of the MOS and bipolar devices by comparing the irradiation experimental data and the calculated results using Geant4 and SRIM code.     

PNP输入双极运算放大器在不同辐射环境下的辐射效应和退火特性

研究了PNP输入双极运算放大器LM837在1 MeV电子和⁶⁰Coγ源两种不同辐射环境中的响应特性和变化规律. 分析了不同偏置状态下其电离辐照敏感参数在辐照后三种温度 (室温, 100 ℃, 125 ℃)下随时间变化的关系, 讨论了引起电参数失效的机理. 结果表明: 1 MeV 电子辐照LM837引起的损伤主要是电离损伤, 并且在正偏情况下比⁶⁰Coγ源辐照造成的损伤大; 辐照过程中, 不同辐照源正偏条件下的偏置电流变化都比零偏时微大; 在不同的辐照源下, LM837辐照后的退火行为都与温度有较大的依赖关系, 而这种关系与辐照感生的界面态密度增长直接相关. 关键词： PNP 输入双极运算放大器 60Coγ源')" href="#">电子和⁶⁰Coγ源 偏置条件 退火     

In0.53Ga0.47As/InP量子阱与体材料的1 MeV电子束辐照光致发光谱研究

为获得对In_0.53Ga_0.47As/InP材料在电子束辐照下的光致发光谱变化规律, 开展了1 MeV电子束辐照试验, 注量为 5×10¹²-9×10¹⁴ cm^-2. 样品选取量子阱材料和体材料, 在辐照前后, 进行了光致发光谱测试, 得到了不同结构In_0.53Ga_0.47As/InP材料在1 MeV电子束辐照下的不同变化规律; 对比分析了参数退化的物理机理. 结果显示: 试验样品的光致发光峰强度随着辐照剂量增大而显著退化. 体材料最先出现快速退化, 而五层量子阱在注量达到6×10¹⁴ cm^-2时, 就已经退化至辐照前的9%. 经分析认为原因有: 1)电子束进入样品后, 与材料晶格发生能量传递, 破坏晶格完整性, 致使产生的激子数量减少, 光致发光强度降低; 电子束辐照在材料中引入缺陷, 增加了非辐射复合中心密度, 导致载流子迁移率降低. 2)量子阱的二维限制作用使载流子运动受限, 从而能够降低载流子与非辐射复合中心的复合概率; 敏感区域截面积相同条件下, 体材料比量子阱材料辐射损伤更为严重. 3)量子阱的层数越多, 则异质结界面数越多, 相应的产生的界面缺陷数量也随之增多, 辐射损伤越严重.     

质子辐照对国产“一”字型保偏光纤损伤效应研究

航天器在空间环境中运行时,会受到质子的辐照,光纤环作为航天器上光纤陀螺的重要组成部件受辐照影响 最为严重.为了研究国产“一”字型保偏光纤因质子辐照导致辐照诱导损耗的变化规律及其辐照损伤机理, 选择质子能量为5 MeV和10 MeV,光源波长为1310 nm,原位测量了光纤传输功率变化情况,计算出辐照诱导损耗. 利用SRIM软件,模拟能量分别为5 MeV和10 MeV质子辐照在光纤中的电离和位移损伤分布.借助X 射线光电子能谱仪分析辐照前后O 1s和Si 2p解析谱,借助傅里叶变换红外光谱仪观察光纤辐照前后光谱变化情况研究发现,在波长为1310 nm处, 光纤的辐照诱导损耗随着质子注量的增加而增长,主要原因是由于光纤纤芯中Si-OH的浓度增加所导致. 而且能量为5 MeV质子辐照造成光纤的辐照诱导损耗比10 MeV严重,这是因为5 MeV质子在光纤纤芯处造成的 位移和电离损伤均比10 MeV严重,即产生的Si-OH数量多.     

月球表面环境对Mo/Si多层膜光学特性的影响

研究了月球表面高温、强辐射的空间环境下Mo/Si多层膜的热稳定性和辐照稳定性。Mo/Si多层膜采用磁控溅射法镀制,将制备好的多层膜在100℃和200℃高温下加热,利用激光等离子体反射率计和X射线衍射仪(XRD)对加热前后的多层膜进行了测量。结果显示在200℃以内,多层膜反射率和中心波长没有显著变化,表现出良好的热稳定性。利用Monte Carlo方法模拟了质子在多层膜内造成的缺陷的分布和浓度分布。模拟显示,能量大的质子沉积在多层膜内部,造成的缺陷也集中在多层膜内部。用能量为60keV,剂量分别为3×1012 cm-2和3×1014 cm-2的质子对Mo/Si多层膜进行辐照实验。发现多层膜内部出现了烧蚀损伤缺陷及节瘤缺陷。结果表明能量相同时,辐照剂量越大对多层膜反射率影响越大。     

质子与中子辐照对电荷耦合器件暗信号参数的影响及其效应分析

对科学级电荷耦合器件(charge-coupled device, CCD)进行了质子和中子辐照试验及退火试验, 应用蒙特卡洛方法计算了质子和中子在CCD中的能量沉积, 分析了器件的辐射损伤机理. 仿真计算了N⁺埋层内沉积的位移损伤剂量, 辐照与退火试验过程中主要考察暗信号的变化规律. 研究结果显示, 质子与中子辐照均会引发暗信号退化, 其退化的规律与位移损伤剂量变化一致; 退火后, 质子辐照所致CCD暗信号大幅度恢复, 其体暗信号增加量占总暗信号增加量的比例最多为22%; 中子辐照引发的暗信号增长主要为体暗信号. 质子和中子在N⁺埋层产生相同位移损伤剂量的情况下, 两者导致的体暗信号增长量相同, 质子与中子辐照产生的体缺陷对体暗信号增长的贡献是同质的.     

Radiation Damage Analysis of Individual Subcells for GaInP/GaAs/Ge Solar Cells Using Photoluminescence Measurements

The radiation damage of three individual subcells for GaInP/GaAs/Ge triple-junction solar cells irradiated with electrons and protons is investigated using photoluminescence(PL) measurements. The PL spectra of each subcell are obtained using different excitation lasers. The PL intensity has a fast degradation after irradiation,and decreases as the displacement damage dose increases. Furthermore, the normalized PL intensity varying with the displacement damage dose is analyzed in detail, and then the lifetime damage coefficients of the recombination centers for GaInP top-cell, GaAs mid-cell and Ge bottom-cell of the triple-junction solar cells are determined from the PL radiative efficiency.     

低能质子辐照ZnO/silicone白漆产生微观损伤的红外光谱研究

 通过空间综合辐照模拟设备对能量小于200 keV质子辐照下ZnO/silicone白漆光学性能变化及损伤机理进行研究。结果表明,ZnO/silicone白漆的光学性能退化主要发生在可见光区,太阳吸收比随质子辐照能量、注量的增加而增大。借助傅里叶变换红外光谱分析技术研究了质子辐照ZnO/silicone白漆时有机硅树脂的光学性能退化机理。质子辐照使ZnO/silicone白漆中游离氧含量增加,氧化硅原子上的有机取代基使Si—C链断裂,并生成活性羟基,而这种活性羟基能促使有机硅树脂内Si—O—Si键的裂解。同时Si—O—Si链内氧原子未成键的孤对电子与邻近硅原子的3d空轨道配位,降低了π*轨道的能量,提高了对光吸收的几率,增强了n→π*电子跃迁,使吸收带红移,从而导致ZnO/silicone白漆光学性能退化。     

Correlation between Displacement Damage Dose and Proton Irradiation Effects on GaInP/GaAs/Ge Space Solar Cells

The irradiation effects of 0.28-2.80 MeV protons on GalnP/GaAs/Ge solar cells have been analysed, and then correlated with the displacement damage dose. The results of I-V and spectral response measurements, combined with the SRIM-derived vacancies produced rates, show that the degradation of the solar cells is largely determined by the displacement damage of the GaAs sub-cell. Thus the SRIM-derived NIEL values for protons in the GaAs sub-cell are used to calculate the displacement damage dose. It is shown that the irradiation effects of the solar cells caused by protons at different energies are correlated well with the aid of displacement damage dose.