SET-MOS混合结构的细胞神经网络及其应用

基于细胞神经网络（CNN）细胞单元的等效电路及其电学特性模型,利用SET-MOS混合结构反相器实现了模型中的激活函数电路,用耦合电容单元实现CNN细胞的系统模板,构建了SET-MOS CNN细胞硬件电路,并将其应用在图像处理中.仿真结果表明,所设计的CNN硬件电路具有结构简单、功耗低、响应速度快等特点,可用于构成各种规模的CNN电路,进一步满足大规模信号处理的需求及提高集成电路的集成度. 关键词： 单电子晶体管 MOS管 细胞神经网络 图像处理     

基于金属氧化物半导体晶体管Colpitts混沌振荡电路及其同步研究

用金属氧化物半导体(MOS)晶体管模型取代传统Colpitts混沌振荡电路中的三极管模型, 提出了一种基于MOS管的Colpitts混沌振荡电路. 通过合适的归一化方法, 得到了与基于三极管电路类似的状态模型. 平衡点的指标说明两种结构产生混沌的机理并不相同. 然后, 通过参数反演, 得到了详细的电路参数, 并用Pspice软件仿真得到了混沌吸引子和混沌信号的频谱图, 说明了此结构可在低电压下工作并且能产生高频率的混沌信号. 最后, 用误差反馈的方法实现了这种结构的同步. 关键词： Colpitts混沌 金属氧化物半导体晶体管 低电压 误差反馈同步     

半导体器件总剂量辐射效应的热力学影响

对商用三极管和MOS场效应晶体管进行了不同环境温度下的总剂量辐照实验,对比了不同辐照温度对这两种器件辐射效应特性的影响。实验结果表明,对于同一辐照总剂量,三极管的基极电流、电流增益和MOS场效应晶体管的阈值电压漂移值都随着辐照温度的不同而存在较大的差异。总剂量为100 krad,辐照温度分别为25,70,100 ℃时,NPN三极管的电流增益倍数分别衰减了71,89和113,而NMOS晶体管的阈值电压V_T分别减少了3.53,2.8,2.82 V。     

非晶硅薄膜晶体管沟道中阈值电压及温度的分布

基于氢化非晶硅薄膜晶体管(a-Si:H TFT)沟道中陷阱态的双指数分布, 区分了带尾陷阱态和深能级陷阱态的特征温度.利用源端、漏端串联电阻及沟道电阻, 将源端和漏端特征长度与有源层接触长度、SiO₂/氢化非晶硅 (a-Si:H)界面陷阱态及a-Si:H薄膜内陷阱态联系起来. 由串联电阻上电流密度相等解出沟道势. 通过泊松方程和高斯定理 得出a-Si:H TFT沟道各点的阈值电压表达式, 结果表明 沟道中某一点的阈值电压随着该点与源端距离的增大而减小. 在此基础上, 研究了自加热效应引起沟道各点温度的变化, 结果显示a-Si:H TFT在自加热效应下, 从源端到漏端各点温度变化先增大后减小, 沟道中心的温度变化最大.     

$lt;i$gt;γ$lt;/i$gt;射线总剂量辐照效应对应变Sip型金属氧化物半导体场效应晶体管阈值电压与跨导的影响研究

分析了双轴应变Si p型金属氧化物半导体场效应晶体管(PMOSFET)在γ射线辐照下载流子的微观输运过程, 揭示了γ射线的作用机理及器件电学特性随辐照总剂量的演化规律, 建立了总剂量辐照条件下的双轴应变Si PMOSFET 阈值电压与跨导等电学特性模型, 并对其进行了模拟仿真. 由仿真结果可知, 阈值电压的绝对值会随着辐照总剂量的积累而增加, 辐照总剂量较低时阈值电压的变化与总剂量基本呈线性关系, 高剂量时趋于饱和; 辐照产生的陷阱电荷增加了沟道区载流子之间的碰撞概率, 导致了沟道载流子迁移率的退化以及跨导的降低. 在此基础上, 进行实验验证, 测试结果表明实验数据与仿真结果基本相符, 为双轴应变Si PMOSFET辐照可靠性的研究和应变集成电路的应用与推广提供了理论依据和实践基础. 关键词： 应变Sip型金属氧化物半导体场效应晶体管 总剂量辐照 阈值电压 跨导     

A novel technique for predicting ionizing radiation effects of commercial MOS devices

A nondestructive selection technique for predicting ionizing radiation effects of commercial metal-oxide-semiconductor (MOS) devices has been put forward. The basic principle and application details of this technique have been discussed. Practical application for the 54HC04 and 54HC08 circuits has shown that the predicted radiation-sensitive parameters such as threshold voltage, static power supply current and radiation failure total dose are consistent with the experimental results obtained only by measuring original electrical parameters. It is important and necessary to choose suitable information parameters. This novel technique can be used for initial radiation selection of some commercial MOS devices.     

Synthesis,characterization and radiation damage studies of high-k dielectric (HfO2) films for MOS device applications

The current trend in miniaturization of metal oxide semiconductor devices needs high-k dielectric materials as gate dielectrics. Among all the high-k dielectric materials, HfO₂ enticed the most attention, and it has already been introduced as a new gate dielectric by the semiconductor industry. High dielectric constant (HfO₂) films (10?nm) were deposited on Si substrates using the e-beam evaporation technique. These samples were characterized by various structural and electrical characterization techniques. Rutherford backscattering spectrometry, X-ray reflectivity, and energy-dispersive X-ray analysis measurements were performed to determine the thickness and stoichiometry of these films. The results obtained from various measurements are found to be consistent with each other. These samples were further characterized by I–V (leakage current) and C–V measurements after depositing suitable metal contacts. A significant decrease in the leakage current and the corresponding increase in device capacitance are observed when these samples were annealed in oxygen atmosphere. Furthermore, we have studied the influence of gamma irradiation on the electrical properties of these films as a function of the irradiation dose. The observed increase in the leakage current accompanied by changes in various other parameters, such as accumulation capacitance, inversion capacitance, flat band voltage, mid-gap voltage, etc., indicates the presence of various types of defects in irradiated samples.     

不同剂量率下锗硅异质结双极晶体管电离损伤效应研究

对于相同制作工艺的NPN锗硅异质结双极晶体管(SiGe HBT), 在不同辐照剂量率下进行⁶⁰Co γ射线的辐照效应与退火特性的研究. 测量结果表明, 两种辐照剂量率下, 随着辐照总剂量增加, 晶体管基极电流增大, 共发射极电流放大倍数降低, 且器件的辐照损伤、性能退化与辐照剂量率相关, 低剂量率下辐照损伤较高剂量率严重. 在经过与低剂量率辐照等时的退火后, 高剂量率下的辐照损伤仍较低剂量率下的损伤低, 即待测SiGeHBT具有明显的低剂量率损伤增强效应(ELDRS). 本文对相关的物理机理进行了探讨分析. 关键词： 锗硅异质结双极晶体管 低剂量率辐照损伤增强 辐照效应     

Comparison of total dose effects on SiGe heterojunction bipolar transistors induced by different swift heavy ion irradiation

The degradations in NPN silicon-germanium （SiGe） heterojunction bipolar transistors （HBTs） were fully studied in this work, by means of 25-MeV Si, 10-MeV C1, 20-MeV Br, and 10-MeV Br ion irradiation, respectively. Electrical parameters such as the base current （IB）, current gain （β）, neutral base recombination （NBR）, and Early voltage （VA） were investigated and used to evaluate the tolerance to heavy ion irradiation. Experimental results demonstrate that device degradations are indeed radiation-source-dependent, and the larger the ion nuclear energy loss is, the more the displacement damages are, and thereby the more serious the performance degradation is. The maximum degradation was observed in the transistors irradiated by 10-MeV Br. For 20-MeV and 10-MeV Br ion irradiation, an unexpected degradation in Ic was observed and Early voltage decreased with increasing ion fluence, and NBR appeared to slow down at high ion fluence. The degradations in SiGe HBTs were mainly attributed to the displacement damages created by heavy ion irradiation in the transistors. The underlying physical mechanisms are analyzed and investigated in detail.     

偏置条件对NPN及PNP双极晶体管电离辐射损伤的影响研究

本文采用低能电子辐照源对NPN及PNP晶体管进行辐照试验. 在辐照试验过程中, 针对NPN及PNP晶体管发射结施加不同的偏置条件, 研究偏置条件对NPN及PNP晶体管辐射损伤的影响. 使用Keithley 4200-SCS半导体特性测试仪在原位条件下测试了双极晶体管电性能参数随低能电子辐照注量的变化关系. 测试结果表明, 在相同的辐照注量条件下, 发射结反向偏置时双极晶体管的辐照损伤程度最大; 发射结正向偏置时双极晶体管的辐照损伤程度最小; 发射结零偏时双极晶体管的辐照损伤程度居于上述情况之间. 关键词： 双极晶体管 低能电子 电离辐射     

有机场效应晶体管的非线性注入模型

有机场效应晶体管(Organic field effect transistor,OFET)的非线性特性是指其输出特性曲线在较低的漏极电压下出现类似于二极管的电压电流特性曲线,这种现象在有机场效应晶体管的实验研究中极为常见。Simonetti等通过引入随栅极电压变化的迁移率提出了模型并成功解释了这一现象,但实验中从器件转移特性得出的迁移率通常与栅极电压无关。本文通过引入常数迁移率对该模型进行改进,运用改进的模型研究了影响OFET非线性特性的主要因素,并对如何更加准确地获得器件参数进行了探究。     

Characterization of ZnO nanowire field-effect transistors and exposed to ultraviolet radiation

A ZnO nanowire (NW) field-effect transistor (FET) is fabricated and characterized, and its characterization of ultraviolet radiation is also investigated. On the one hand, when the radiation time is 5~min, the radiation intensity increases to 5.1~μ W/cm², while the saturation drain current (I_\rm dss) of the nanowire FET decreases sharply from 560 to 320~nA. The field effect mobility (μ ) of the ZnO nanowire FET drops from 50.17 to 23.82~cm²/(V.s) at V_\rm DS=2.5~V, and the channel resistivity of the FET increases by a factor of 2. On the other hand, when the radiation intensity is 2.5~μ W/cm^2 , the DC performance of the FET does not change significantly with irradiation time (its performances at irradiation times of 5 and 20~min are almost the same); in particular, the I_\rm dss of NW FET only reduces by about 50~nA. Research is underway to reveal the intrinsic properties of suspended ZnO nanowires and to explore their device applications.     

Study of total ionizing dose radiation effects on enclosed gate transistors in a commercial CMOS technology

This paper studies the total ionizing dose radiation effects on MOS (metal-oxide-semiconductor) transistors with normal and enclosed gate layout in a standard commercial CMOS (compensate MOS) bulk process. The leakage current, threshold voltage shift, and transconductance of the devices were monitored before and after $\gamma $-ray irradiation. The parameters of the devices with different layout under different bias condition during irradiation at different total dose are investigated. The results show that the enclosed layout not only effectively eliminates the leakage but also improves the performance of threshold voltage and transconductance for NMOS (n-type channel MOS) transistors. The experimental results also indicate that analogue bias during irradiation is the worst case for enclosed gate NMOS. There is no evident different behaviour observed between normal PMOS (p-type channel MOS) transistors and enclosed gate PMOS transistors.     

微波低噪声晶体管电磁脉冲敏感端对研究

在研究电磁脉冲对微电子器件作用效应的过程中,针对三种不同型号的微波低噪声硅半导体器件进行了电磁脉冲（静电放电和方波电磁脉冲）直接注入的试验,结果发现该类器件对电磁脉冲最敏感的端对并不是EB结（发射极-基极）,而是CB结（集电极-基极）。通过对器件结构与放电过程的分析,分别得出了CB结、EB结的损伤机理：随放电电压的增大,热载流子撞击界面,使流经界面处的少数载流子复合速度增加,少数载流子在界面处及界面附近被复合,从而降低了器件的电流放大系数。而无论从哪个结注入,器件完全失效均是由热二次击穿造成。从而更进一步地证明了CB结比EB结更敏感。     

Angular dependence of proton-induced single event transient in silicon-germanium heterojunction bipolar transistors

We investigate the angular dependence of proton-induced single event transient (SET) in silicon-germanium heterojunction bipolar transistors. Experimental results show that the overall SET cross section is almost independent of proton incident angle. However, the proportion of SET events with long duration and high integral charge collection grows significantly with the increasing angle. Monte Carlo simulations demonstrate that the integral cross section of proton incident events with high ionizing energy deposition in the sensitive volume tends to be higher at larger incident angles, which is associated with the angular distribution of proton-induced secondary particles and the geometry of sensitive volume.     

Effects of gate-buffer combined with a p-type spacer structure on silicon carbide metal-semiconductor field-effect transistors

An improved structure of silicon carbide metal-semiconductor field-effect transistors (MESFET) is proposed for high power microwave applications. Numerical models for the physical and electrical mechanisms of the device are presented, and the static and dynamic electrical performances are analysed. By comparison with the conventional structure, the proposed structure exhibits a superior frequency response while possessing better DC characteristics. A p-type spacer layer, inserted between the oxide and the channel, is shown to suppress the surface trap effect and improve the distribution of the electric field at the gate edge. Meanwhile, a lightly doped n-type buffer layer under the gate reduces depletion in the channel, resulting in an increase in the output current and a reduction in the gate-capacitance. The structural parameter dependences of the device performance are discussed, and an optimized design is obtained. The results show that the maximum saturation current density of 325 mA/mm is yielded, compared with 182 mA/mm for conventional MESFETs under the condition that the breakdown voltage of the proposed MESFET is larger than that of the conventional MESFET, leading to an increase of 79% in the output power density. In addition, improvements of 27% cut-off frequency and 28% maximum oscillation frequency are achieved compared with a conventional MESFET, respectively.     

Characteristics of pentacene organic thin film transistor with top gate and bottom contact

High performance pentacene organic thin film transistors (OTFT) were designed and fabricated using SiO₂ deposited by electron beam evaporation as gate dielectric material. Pentacene thin films were prepared on glass substrate with S--D electrode pattern made from ITO by means of thermal evaporation through self-organized process. The threshold voltage V_TH was --2.75± 0.1V in 0---50V range, and that subthreshold slopes were 0.42± 0.05V/dec. The field-effect mobility (μ_EF) of OTFT device increased with the increase of V_DS, but the μ_EF of OTFT device increased and then decreased with increased V_GS when V_DS was kept constant. When V_DS was --50V, on/off current ratio was 0.48× 10⁵ and subthreshold slope was 0.44V/dec. The μ_EF was 1.10cm²/(V.s), threshold voltage was --2.71V for the OTFT device.     

Effects of gate-buffer combined with a p-type spacer structure on silicon carbide metalben semiconductor field-effect transistors

An improved structure of silicon carbide metal-semiconductor field-effect transistors (MESFET) is proposed for high power microwave applications. Numerical models for the physical and electrical mechanisms of the device are presented, and the static and dynamic electrical performances are analysed. By comparison with the conventional structure, the proposed structure exhibits a superior frequency response while possessing better DC characteristics. A p-type spacer layer, inserted between the oxide and the channel, is shown to suppress the surface trap effect and improve the distribution of the electric field at the gate edge. Meanwhile, a lightly doped n-type buffer layer under the gate reduces depletion in the channel, resulting in an increase in the output current and a reduction in the gate-capacitance. The structural parameter dependences of the device performance are discussed, and an optimized design is obtained. The results show that the maximum saturation current density of 325 mA/mm is yielded, compared with 182 mA/mm for conventional MESFETs under the condition that the breakdown voltage of the proposed MESFET is larger than that of the conventional MESFET, leading to an increase of 79% in the output power density. In addition, improvements of 27% cut-off frequency and 28% maximum oscillation frequency are achieved compared with a conventional MESFET, respectively.     

氧对IZO低压无结薄膜晶体管稳定性的影响

本文在室温下制备了无结结构的低压氧化铟锌薄膜晶体管, 并研究了氧分压对其稳定性的影响. 氧化铟锌无结薄膜晶体管具有迁移率高、结构新颖等优点, 然而氧化物沟道层易受氧、水分子等影响, 造成稳定性下降. 在室温下, 本文通过改变高纯氧流量制备氧化铟锌透明导电薄膜作为沟道层、源漏电极, 分析了氧压对于氧化物无结薄膜晶体管稳定性的影响. 为使晶体管在低电压(<2 V)下工作, 达到低压驱动效果, 本文采用具有双电层效应和栅电容大的二氧化硅纳米颗粒膜作为栅介质; 通过电学性能测试, 制备的晶体管工作电压仅为1 V、 开关电流比大于10⁶、亚阈值斜率小于100 mV/decade以及场效 应迁移率大于20 cm²/V·s. 实验研究表明, 通氧制备的氧化铟锌薄膜的电阻率会上升, 导致晶体管的阈值电压向正向漂移, 最终使晶体管的工作模式由耗尽型转变为增强型. 关键词： 薄膜晶体管 无结 氧化铟锌 氧分子     

A comparative study on radiation reliability of composite channel InP high electron mobility transistors

This paper proposes a reasonable radiation-resistant composite channel structure for In P HEMTs. The simulation results show that the composite channel structure has excellent electrical properties due to increased modulation doping efficiency and carrier confinement. Moreover, the direct current(DC) and radio frequency(RF) characteristics and their reliability between the single channel structure and the composite channel structure after 75-ke V proton irradiation are compared in detail. The results show that the composite channel structure has excellent radiation tolerance. Mechanism analysis demonstrates that the composite channel structure weakens the carrier removal effect. This phenomenon can account for the increase of native carrier and the decrease of defect capture rate.