Low frequency noise in bipolar transistors

Ural Polytechnic Institute. Translated from Izvestiya Vysshikh Uchebnykh Zavedenii, Radiofizika, Vol. 33, No. 5, pp. 624–631, May, 1990.     

双极型晶体管高功率微波的损伤机理

在模拟集成电路的抗高功率微波加固研究中,对电路中的单个晶体管进行高功率微波损伤机理研究。对晶体管进行洲入微波损伤效应实验和失效分析,得到了双极型晶体管损伤的基本规律。损伤效应实验采用注入法,分别从晶体管的三极注入微波,得到了损伤结果。对样品进行的失效分析探明了器件的损伤部位和失效机理。结果表明,高功率微波注入主要造成B-E结的退化和损伤;从基极注入微波最易损伤晶体管,而从集电极注入则相反。     

双极型晶体管高功率微波的损伤机理

在模拟集成电路的抗高功率微波加固研究中,对电路中的单个晶体管进行高功率微波损伤机理研究。对晶体管进行洲入微波损伤效应实验和失效分析,得到了双极型晶体管损伤的基本规律。损伤效应实验采用注入法,分别从晶体管的三极注入微波,得到了损伤结果。对样品进行的失效分析探明了器件的损伤部位和失效机理。结果表明,高功率微波注入主要造成B-E结的退化和损伤;从基极注入微波最易损伤晶体管,而从集电极注入则相反。     

A review of radiation effects in heterojunction bipolar transistors

We present a review of radiation effects studies on heterojunction bipolar transistors (HBTs) in order to develop a framework for qualifying devices for application in the harsh radiation environment of space. Radiation effects in different HBT material systems are considered here, including Si/SiGe, GaAs/AlGaAs, and InP/InGaAs. We discuss the different effects of ionizing and nonionizing radiation on device performance and review the strong role that device geometry plays in determining the overall radiation tolerance. We present a new comparison of radiation tolerance in conventional transistors, HBTs, and high electron mobility transistors. Finally, we conclude that with proper design, HBTs are excellent candidates for application in space.     

Low-noise fiber optics receiver with super-beta bipolar transistors

Abstract

A low-noise wideband optical fiber receiver has been successfully designed using super-beta bipolar transistors (BJTs) at the front end. Even with commercially available super-beta devices, which are not optimized for our application, the obtainable input sensitivity for medium- and high-bandwidth optical receivers is comparable or superior to the best FET design. To demonstrate this concept, a 10-MHz analog receiver was built with a super-beta BJT at the input stage. This receiver achieved an expected average input noise current density of less than 0.4 PA/√Hz over the full bandwidth for a transresistance of 500 kΩ. Detailed design procedures are given in this paper. The noise characteristics of a 50-MHz receiver using super-beta BJTs are also obtained.     

Low-noise fiber optics receiver with super-beta bipolar transistors

A low-noise wideband optical fiber receiver has been successfully designed using super-beta bipolar transistors (BJTs) at the front end. Even with commercially available super-beta devices, which are not optimized for our application, the obtainable input sensitivity for medium- and high-bandwidth optical receivers is comparable or superior to the best FET design. To demonstrate this concept, a 10-MHz analog receiver was built with a super-beta BJT at the input stage. This receiver achieved an expected average input noise current density of less than 0.4 PA/√Hz over the full bandwidth for a transresistance of 500 kΩ. Detailed design procedures are given in this paper. The noise characteristics of a 50-MHz receiver using super-beta BJTs are also obtained.     

Hardening measures for bipolar transistors against microwave-induced damage

In the present paper we study the influences of the bias voltage and the external components on the damage progress of a bipolar transistor induced by high-power microwaves. The mechanism is presented by analyzing the variation in the internal distribution of the temperature in the device. The findings show that the device becomes less vulnerable to damage with an increase in bias voltage. Both the series diode at the base and the relatively low series resistance at the emitter, Re, can obviously prolong the burnout time of the device. However, Re will aid damage to the device when the value is sufficiently high due to the fact that the highest hot spot shifts from the base-emitter junction to the base region. Moreover, the series resistance at the base Rb will weaken the capability of the device to withstand microwave damage.     

Physical processes of current gain in InAs bipolar junction transistors

InAs bipolar junction transistors (BJTs), grown by molecular beam epitaxy, are reported with common emitter current gains (β's) as large as 400. The factors affecting the common emitter current gain have been studied by estimating the magnitudes of the base transport factor (α_T) and emitter injection efficiency (γ). This has been accomplished by studying a sequence of InAs BJTs with varying emitter doping densities, N_E. Minority carrier diffusion length in the base (L_B), α_T, and γ have been extracted from measured electrical characteristics. The results of the study of these InAs BJTs are as follows: L_B≈0.4 μm, α_T≈98% and γ ranges from 92% to nearly 100% depending on N_E. This knowledge of the magnitudes of the injection efficiencies suggests when it would be useful to move from the simple BJT structure to the more advanced heterojunction bipolar transistor (HBT) structure. Lower γ BJTs would be improved, however high-γ BJTs would benefit little, by the use of the widegap emitters of HBTs. The method developed here to estimate γ, α_T and L_B is not specific to InAs BJTs, but should be useful for study of BJTs and HBTs in any material system.     

Early effect modeling of silicon-on-insulator SiGe heterojunction bipolar transistors

Silicon germanium(SiGe) heterojunction bipolar transistor(HBT) on thin silicon-on-insulator(SOI) has recently been demonstrated and integrated into the latest SOI BiCMOS technology.The Early effect of the SOI SiGe HBT is analysed considering vertical and horizontal collector depletion,which is different from that of a bulk counterpart.A new compact formula of the Early voltage is presented and validated by an ISE TCAD simulation.The Early voltage shows a kink with the increase of the reverse base-collector bias.Large differences are observed between SOI devices and their bulk counterparts.The presented Early effect model can be employed for a fast evaluation of the Early voltage and is useful to the design,the simulation and the fabrication of high performance SOI SiGe devices and circuits.     

双极结型晶体管的集电结反向雪崩击穿特性

通过气体放电产生更高浓度的低温等离子体要求具有纳秒上升沿和纳秒脉宽的高重频快脉冲,而目前被广泛使用的MOSFET和IGBT都无法满足这些参数要求,而双极结型晶体管(BJT）的集电极与发射极之间的雪崩击穿过程具有快导通、快恢复、高稳定性等优点,适合作为小型Marx发生器的自击穿开关。文中对用多种型号的BJT进行击穿特性比较测试实验,发现可以通过改变BJT的门极和发射极的并联电阻来调节其雪崩击穿电压,实现一定范围的工作电压。雪崩击穿恢复特性实验表明,当击穿电流衰减到低于维持电流时,BJT就会开始恢复绝缘而关断,通过改变电路中的参数以控制击穿电流的变化就可以控制BJT的雪崩击穿导通时间（即导通脉宽）。将这些结论应用到实际电路中,可获得上升沿5 ns、脉宽为10 ns、幅值2 kV、重复频率高达100 kHz的纳秒快脉冲,可用于激发高浓度低温等离子体。     

Field-effect transistors based on two-dimensional materials for logic applications

Field-effect transistors （FETs） for logic applications, graphene and MoS2, are discussed. These materials have based on two representative two-dimensional （2D） materials, drastically different properties and require different consider- ations. The unique band structure of graphene necessitates engineering of the Dirac point, including the opening of the bandgap, the doping and the interface, before the graphene can be used in logic applications. On the other hand, MoS2 is a semiconductor, and its electron transport depends heavily on the surface properties, the number of layers, and the carrier density. Finally, we discuss the prospects for the future developments in 2D material transistors.     

绝缘栅双极晶体管串联关键技术

为实现绝缘栅双极晶体管（IGBT）的多级串联,以电阻/电容/二极管（RCD）缓冲电路为动态均压电路,通过数学分析及PSpice仿真验证,建立了RCD缓冲电路参数选择模型;设计了基于数字信号处理器（DSP）控制、光纤隔离传输,以M57962L为IGBT驱动器的驱动电路及故障反馈电路,能驱动32只串联IGBT并对其进行过流和短路保护,32只IGBT的最大导通时间不超过90 ns,短路保护响应时间约为6 s;设计了8路独立输出的50 kV隔离的高压隔离电源,实现IGBT串联电路各部分的供电及电隔离。基于以上IGBT串联方法,实现了32只1200 V IGBT的串联,串联电路可稳定工作在20 kV电压下。     

绝缘栅双极晶体管串联关键技术

为实现绝缘栅双极晶体管（IGBT）的多级串联,以电阻/电容/二极管（RCD）缓冲电路为动态均压电路,通过数学分析及PSpice仿真验证,建立了RCD缓冲电路参数选择模型;设计了基于数字信号处理器（DSP）控制、光纤隔离传输,以M57962L为IGBT驱动器的驱动电路及故障反馈电路,能驱动32只串联IGBT并对其进行过流和短路保护,32只IGBT的最大导通时间不超过90 ns,短路保护响应时间约为6 s;设计了8路独立输出的50 kV隔离的高压隔离电源,实现IGBT串联电路各部分的供电及电隔离。基于以上IGBT串联方法,实现了32只1200 V IGBT的串联,串联电路可稳定工作在20 kV电压下。     

Weak avalanche multiplication in SiGe heterojunction bipolar transistors on thin film silicon-on-insulator

In this paper, we propose an analytical avalanche multiplication model for the next generation of SiGe silicon-on-insulator (SOI) heterojunction bipolar transistors (HBTs) and consider their vertical and lateral impact ionizations for the first time. Supported by experimental data, the analytical model predicts that the avalanche multiplication governed by impact ionization shows kinks and the impact ionization effect is small compared with that of the bulk HBT, resulting in a larger base-collector breakdown voltage. The model presented in the paper is significant and has useful applications in the design and simulation of the next generation of SiGe SOI BiCMOS technology.     

Angular dependence of proton-induced single event transient in silicon-germanium heterojunction bipolar transistors

We investigate the angular dependence of proton-induced single event transient (SET) in silicon-germanium heterojunction bipolar transistors. Experimental results show that the overall SET cross section is almost independent of proton incident angle. However, the proportion of SET events with long duration and high integral charge collection grows significantly with the increasing angle. Monte Carlo simulations demonstrate that the integral cross section of proton incident events with high ionizing energy deposition in the sensitive volume tends to be higher at larger incident angles, which is associated with the angular distribution of proton-induced secondary particles and the geometry of sensitive volume.     

Effect of bias condition on heavy ion radiation in bipolar junction transistors

The characteristic degradations in a silicon NPN bipolar junction transistor(BJT) of 3DG142 type are examined under irradiation with 40-MeV chlorine(Cl) ions under forward,grounded,and reverse bias conditions,respectively.Different electrical parameters are in-situ measured during the exposure under each bias condition.From the experimental data,a larger variation of base current(I B) is observed after irradiation at a given value of base-emitter voltage(V BE),while the collector current is slightly affected by irradiation at a given V BE.The gain degradation is affected mostly by the behaviour of the base current.From the experimental data,the variation of current gain in the case of forward bias is much smaller than that in the other conditions.Moreover,for 3DG142 BJT,the current gain degradation in the case of reverse bias is more severe than that in the grounded case at low fluence,while at high fluence,the gain degradation in the reverse bias case becomes smaller than that in the grounded case.     

The use of amorphous and microcrystalline silicon for silicon heterojunction bipolar transistors

The modification of the emitter structure of silicon bipolar transistors results in more freedom in the choice between sometimes conflicting device parameters. The approach followed in this work is the use of an amorphous silicon (a-Si:H) or microcrystalline silicon (c-Si) emitter, creating a real heterojunction with the crystalline silicon base. Due to the larger bandgap of these emitter materials, the back injection of minority carriers is strongly suppressed in comparison with conventional bipolar transistors. Furthermore, the small temperature coefficient of the current gain allows the use of these heterojunction bipolar transistors (HBT) over a wide temperature range. Most likely, the biggest advantage of such HBTs is that a better high-frequency behaviour could be obtained. However, some problems still need to be solved such as the recombination at the emitter-base interface and the high resistivity of the emitter material.On leave from University of Florida, Gainesville, Florida, USA