| 乙醛酸化学镀铜的电化学研究 |
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| 引用本文： | 吴丽琼,杨防祖,黄令,孙世刚,周绍民.乙醛酸化学镀铜的电化学研究[J].电化学,2005,11(4):402-406. |
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| 作者姓名： | 吴丽琼 杨防祖 黄令 孙世刚 周绍民 |
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| 作者单位： | 厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室,厦门大学化学化工学院固体表面物理化学国家重点实验室 福建厦门361005,福建厦门361005,福建厦门361005,福建厦门361005,福建厦门361005 |
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| 基金项目： | 国家"火炬计划";国家科技攻关项目 |
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| 摘 要： | 以乙醛酸作还原剂,Na2EDTA.2H2O为络合剂,亚铁氰化钾和2,2'-联吡啶为添加剂组成化学镀铜液体系,应用线性扫描伏安法研究分析了络合剂、添加剂对该镀铜体系电化学性能的影响.结果表明,络合剂Na2EDTA对乙醛酸的氧化和铜的还原有阻碍作用.亚铁氰化钾和过量(20 mg/L)的2,2'-联吡啶对乙醛酸的氧化起较明显的抑制作用.
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| 关 键 词： | 化学镀铜 乙醛酸 络合剂 添加剂 |
| 文章编号： | 1006-3471（2005）04-0402-05 |
| 收稿时间： | 2005-04-06 |
| 修稿时间： | 2005-06-02 |
An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent |
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| WU Li-Qiong,YANG Fang-Zu,HANG Ling,SUN Shi-Gang,ZHOU Shao-Min.An Electrochemical Study of Electroless Copper Plating Using Glyoxylic Acid as Reducing Agent[J].Electrochemistry,2005,11(4):402-406. |
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| Authors: | WU Li-Qiong YANG Fang-Zu HANG Ling SUN Shi-Gang ZHOU Shao-Min |
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| Institution: | College of Chemistry and Chemical Engineering, State Key Laboratory of Physical Chemistry of the Solid Surfaces, Xiamen University, Xiamen 361005 , China |
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| Abstract: | The electroless copper plating using glyoxylic acid as a reducing agent,Na_(2)EDTA as a chelating agent and K_(4)Fe(CN)_(6) and 2,2'-dipyridyl as additives was studied.The effect of chelating agent and addtives on the polangation behaviovs of copper reduction and glyoxylie acid oxidation were analyzed by linear sweep voltammetry.The results mainly demonstrated that the chelating agent hindered both the oxidation of glyoxylic acid and the reduction of copper complexing ions.It has revealed that K_(4)Fe(CN)_(6)and 2,2'-dipyridyl(with the content over than 20 mg/L)both played negative actions on the oxidation of glyoxylic acid. |
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| Keywords: | Electroless copper plating glyoxylic acid Chelating agent Additives Polarization |
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