| 温度循环应力剖面对QFP焊点热疲劳寿命的影响 |
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| 引用本文： | 王考,陈循,褚卫华.温度循环应力剖面对QFP焊点热疲劳寿命的影响[J].计算力学学报,2005,22(2):170-175. |
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| 作者姓名： | 王考 陈循 褚卫华 |
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| 作者单位： | 国防科技大学,机电工程与自动化学院,机电工程研究所,湖南,长沙,410073;国防科技大学,机电工程与自动化学院,机电工程研究所,湖南,长沙,410073;国防科技大学,机电工程与自动化学院,机电工程研究所,湖南,长沙,410073 |
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| 基金项目： | 国家自然科学基金(10102024)资助项目. |
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| 摘 要： | 采用统一型粘塑性Anand本构方程描述了QFP(四方扁平封装)焊点的粘塑性力学行为，利用有限元分析软件建立组装在印制电路板上QFP的有限元模型，通过研究焊点内部总应变范围的变化进而研究温度循环应力剖面各个参数对焊点热疲劳寿命的影响，为设计合理的温度循环应力剖面提供了理论依据。
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| 关 键 词： | 温度循环应力剖面 焊点 粘塑性 有限元模型 热疲劳寿命 |
| 文章编号： | 1007-4708(2005)02-0170-06 |
| 修稿时间： | 2003年5月19日 |
Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP |
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| WANG Kao,CHEN Xun,CHU Wei-hua.Effect of temperature cycling stress profile on the thermal fatigue life of solder joints of QFP[J].Chinese Journal of Computational Mechanics,2005,22(2):170-175. |
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| Authors: | WANG Kao CHEN Xun CHU Wei-hua |
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| Abstract: | This paper introduces the unified visco-plastic Anand constitutive equation to depict the visco-plastic deformation behavior of solder joints of QFP (Quad Flat Package). The finite element model of QFP mounted on printed circuit board is built by the finite element analysis software to study the influence of the temperature range, the ramp rate and the length of dwell time on stress distribution and plastic strain in 60Sn40Pb solder joint. The plastic-strainbased Coffin-Manson equation is used to predict the fatigue life of solder joints of QFP. Subsequently the effect of temperature cycling stress profile on the thermal fatigue life of solder joints is studied. The results of this study will provide valuable guidance to determine the most efficient temperature profile of the thermal cycling which is very important to thermal cycling tests. |
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| Keywords: | temperature cycling stress profile solder joint visco-plastic finite element model thermal fatigue life |
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