Picosecond laser ablation of thin copper films |
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Authors: | J Jandeleit G Urbasch H D Hoffmann H -G Treusch E W Kreutz |
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Institution: | (1) Lehrstuhl für Lasertechnik, RWTH Aachen, Steinbachstrasse 15, D-52074 Aachen, Germany;(2) Fraunhofer-Institut für Lasertechnik, Steinbach strasse 15, D-52074 Aachen, Germany |
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Abstract: | The ablation process of thin copper films on fused silica by picosecond laser pulses is investigated. The ablation area is characterized using optical and scanning electron microscopy. The single-shot ablation threshold fluence for 40 ps laser pulses at 1053 nm has been determinated toF
thres = 172 mJ/cm2. The ablation rate per pulse is measured as a function of intensity in the range of 5 × 109 to 2 × 1011 W/cm2 and changes from 80 to 250 nm with increasing intensity. The experimental ablation rate per pulse is compared to heat-flow calculations based on the two-temperature model for ultrafast laser heating. Possible applications of picosecond laser radiation for microstructuring of different materials are discussed. |
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Keywords: | 81 60 B 79 20D |
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