半导体激光器同轴封装的高频影响:分析与实验

存高频调制下，封装对半导体激光器的影响非常显著。通过分析封装前后激光器散射参量之间的火系，推导出可用于分析半导体激光器封装高频影响的两种方法：预测法和评价法，从而提供了分析激光器封装的另外两种等价方法。实验中，对同轴（TO）封装的高频特性进行了测试和分析，分析结果与传统比较法的测试结果吻合表明新方法有效。实验表明在10．2GHz以内同轴封装不会降低半导体激光器的频响带宽，即同轴封装的带宽可达10GHz，且发现同轴封装巾电感和电容元件之间的谐振效应对器件的顿响具有补偿作用。两方法可为筛选光电子器件封装提供依据，并为优化封装的设计提供参考。

Influence of TO Packaging on the High-Frequency Response of Semiconductor Laser: Analysis and Experiment

The parasitics from packages can obviously degrade the overall performance of the packaged laser diode at high frequencies.Two novel equivalent methods,namely predication method and evaluation method,which can be used to analyze the influence of through-hole(TO) packaging on the high frequency response of laser diode,are deduced from the relation between the scattering parameters of laser diode before and after packaging.In the experiment,TO packaged laser module is taken as an example to investigate the high-frequency influence of the TO packaging.The coherence between the experimental results from the novel method and that from traditional comparison method show the effectivity of the methods.It also can be seen that the TO packaging does not reduce the bandwidth of the packaged laser diode,which means that TO packaging can achieve a frequency bandwidth of 10 GHz,furthermore,the resonance among the circuit elements of TO packaging provides compensation for the frequency response of the devices.The two methods are useful for screening and optimizing the packaging of high-speed optoelectronics devices.