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On ultra-thin oxide/Si and very-thin oxide/Si structures prepared by wet chemical process
Authors:E Pincik  H Kobayashi  WB Kim  L Malinovsky  K Imamura  M Takahashi  M Kucera
Institution:a Institute of Physics of SAS, 845 11 Bratislava, Slovak Republic
b ISIR of Osaka University and CREST, Ibaraki, Osaka 567-0047, Japan
c Institute of Electrical Engineering of SAS, 841 04 Bratislava, Slovak Republic
d Faculty of Chemical and Food Technology of SUT, 812 37 Bratislava, Slovak Republic
Abstract:The properties of ultra-thin oxide/Si and very-thin oxide/Si structures prepared by wet chemical oxidation in nitric acid aqueous solutions (NAOS) and passivated in HCN aqueous solutions were investigated by electrical, optical and structural methods. n- and p-doped (1 0 0) crystalline Si substrates were used. There were identified more types of interface defect states in dependence on both post-oxidation treatment and passivation procedure. On samples prepared on n-type Si, continuous spectrum of defect states of 0.05-0.2 eV range and discrete defect traps, ∼ECB − 0.26 eV and ∼ECB − 0.39 eV, were found. All mentioned defects are related with various types of Si dangling bonds and/or with SiOx precipitates. Post-metallization annealing of investigated MOS structures reduced the interface defect density and suppressed the leakage currents. It did not change spectral profile of interface defect states in the Si band gap. In addition, there are presented following two optical phenomena: relation between amplitude of photoluminescence signal of NAOS samples and parameters of chemical oxidation process and quantum confinement effect observed on samples containing Si grains of size less as ∼2 nm.
Keywords:81  65  82  30  78  66  81  60
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