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Novel hydrophobic/hydrophilic patterning process by photocatalytic Ag nucleation on TiO2 thin film and electroless Cu deposition
Authors:Shunsuke Nishimoto  Xintong Zhang  Noriaki Taneichi  Taketoshi Murakami  Akira Fujishima
Institution:a Kanagawa Academy of Science and Technology, KSP Building West 614, 3-2-1 Sakado, Takatsu-ku, Kawasaki, Kanagawa 213-0012, Japan
b Tokyo Ohka Kogyo Co., Ltd., 1590 Tabata, Samukawa-machi, Koza-gun, Kanagawa 253-0114, Japan
Abstract:A hydrophobic/super-hydrophilic pattern was prepared on a TiO2 thin film by a new fabrication process. The process consists of five key steps: (1) photocatalytic reduction of Ag+ to Ag (nucleation), (2) electroless Cu deposition, (3) oxidation of Cu to CuO, (4) deposition of a self-assembled monolayer (SAM), and (5) photocatalytic decomposition of selected areas of the SAM. A hydrophobic/super-hydrophilic pattern with 500-μm2 hydrophilic areas was obtained in this process. It is particularly noteworthy that a UV irradiation time of only 1 s was sufficient for the nucleation step in the patterning process.
Keywords:81  65  Cf
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