| 一种计算DIP芯片结温的热阻模型 |
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| 引用本文： | 毛章明,罗小兵,刘菊,刘胜.一种计算DIP芯片结温的热阻模型[J].工程热物理学报,2011(2):303-307. |
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| 作者姓名： | 毛章明 罗小兵 刘菊 刘胜 |
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| 作者单位： | 华中科技大学能源与动力工程学院;华中科技大学武汉光电国家实验室MOEMS研究部; |
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| 基金项目： | 国家973项目(No.2009CB320203) |
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| 摘 要： | 本文建立了一种计算塑料DIP(双列直插式封装)芯片结温的解析热阻模型,该模型根据DIP封装结构的散热途径建立.模型中的每一热阻均能通过较为简单的解析式进行计算,这与采用实验或数值模拟方法计算热阻的其他模型不同.利用该模型计算得到的一种塑料DIP芯片的结温与数值模拟得到的结温误差在±10%以内.
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| 关 键 词： | DIP 结温 解析解 热阻 |
A THERMAL RESISTANCES MODEL FOR DIP'S JUNCTION TEMPERATURE CALCULATION |
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| MAO Zhang-Ming LUO Xiao-Bing LIU JU LIU Sheng.A THERMAL RESISTANCES MODEL FOR DIP'S JUNCTION TEMPERATURE CALCULATION[J].Journal of Engineering Thermophysics,2011(2):303-307. |
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| Authors: | MAO Zhang-Ming LUO Xiao-Bing LIU JU LIU Sheng |
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| Institution: | MAO Zhang-Ming~1 LUO Xiao-Bing~(1,2) LIU JU~1 LIU Sheng~2 (1.School of Energy and Power Engineering,Huazhong University of Science & Technology,Wuhan 430074,China,2.Wuhan National Lab for Optoelectronics,China) |
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| Abstract: | A thermal resistance model for junction temperature calculation of a plastic dual in-line packaging(DIP) was presented.The model was established based on the heat transfer paths in the DIP.Every thermal resistance can be calculated by simple analytical expressions,which is different with other models by experiments or numerical simulations.Comparing the junction temperatures calculated by the model and the results obtained by simulations,it is found that the relative errors between the two methods are in th... |
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| Keywords: | DIP junction temperature analytical solution thermal resistance |
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