High-power vertical-cavity surface-emitting lasers bonded with efficient packaging |
| |
| Authors: | Changling Yan Guoguang Lu Li Qin National Key Lab on High-Power Semiconductor Lasers Changchun University of Science Technology Changchun China Changchun Institute of Optics Fine Mechanics Physics Chinese Academy of Sciences Changchun China |
| |
| Institution: | Changling Yan Guoguang Lu and Li Qin 1 National Key Lab on High-Power Semiconductor Lasers,Changchun University of Science and Technology,Changchun 130022,China 2 Changchun Institute of Optics,Fine Mechanics and Physics,Chinese Academy of Sciences,Changchun 130033,China |
| |
| Abstract: | High-power vertical-cavity surface-emitting lasers(VCSELs) are processed using a wet thermal-selective oxidation technique.The VCSEL chips are packaged by employing three different bonding methods of silver solder,In-Sn solder,and metalized diamond heat spreader.After packaging,optical output power, wavelength shift,and thermal resistance of the devices are measured and compared in an experiment.The device packaged with a metalized diamond heat spreader shows the best operation characteristics among the thr... |
| |
| Keywords: | |
| 本文献已被 CNKI 维普 等数据库收录！ |
|
