用自洽的蒙特卡罗—流体结合模型模拟溅射过程

 采用自洽的蒙特卡罗－流体结合模型对溅射过程进行模拟，以了解等离子体粒子行为与溅射参数的关系。溅射过程包括气体放电和溅射原子传输。对于气体放电，蒙特卡罗部分模拟快电子和快气体原子，而流体部分则描述离子和慢电子。对于溅射原子传输，蒙特卡罗部分模拟溅射原子的碰撞过程，而流体部分则描述溅射原子的扩散和漂移。模拟的结果包括：等离子体粒子的密度和能量分布；不同电离机制对气体原子和溅射原子电离的贡献；不同等离子体粒子对阴极溅射碰撞的贡献；溅射原子的密度分布；溅射场和溅射粒子相对于入射离子能量和角度的分布；溅射原子经碰撞后在整个等离子体区的分布。

A HYBRID SIMULATION OF SPUTTERING-DEPOSITION PROCESS: COMBINED FLUID AND MONTE CARLO MODEL

In order to achieve a better understanding of sputtering deposition process, a hybrid simulation combining Fluid and Monte Carlo model has been developed. An overview of the model is given and some typical results are presented. These results include: the densities and energy distributions of the plasma species, the contributions of different ionization mechanisms to the ionization of argon and sputtered atoms, the relative contributions of different plasma species to the sputtering process, the density distributions of sputtered atoms, the sputtering field and sputtered atom distributions versus energy and angle of argon ions, and the density profile of the thermalized sputtered atoms.