| Bi系超导材料的微波焊接及其显微结构研究 |
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| 引用本文： | 蔡杰,谢晓明,李香庭,陈廷国,黄校先,郭景坤.Bi系超导材料的微波焊接及其显微结构研究[J].物理学报,1993,42(7):1167-1171. |
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| 作者姓名： | 蔡杰 谢晓明 李香庭 陈廷国 黄校先 郭景坤 |
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| 作者单位： | (1)中国科学院上海硅酸盐研究所,上海200050; (2)中国科学院上海冶金研究所,上海200050 |
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| 基金项目： | 中国科学院高性能陶瓷;超微结构开放研究实验室资助的课题 |
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| 摘 要： | 微波焊接技术近年来发展较快,它有下列优点:1)能耗低;2)升温速度快;3)接头质量高等。本文研究了Bi系超导材料微波焊接的可行性。结果表明,经855℃60h热处理后,焊接试样的Tc可达107K,与焊接前试样的Tc一致,焊区强度已经高于基体。利用电子探针对焊接前后的显微结构进行了比较,发现焊区组织致密,但在后处理过程中发生再结晶,导致焊区晶粒较大,焊缝变宽且焊区内存在较多杂相。
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| 关 键 词： | 超导体 铋系 焊接 显微结构 |
| 收稿时间： | 9/7/1992 12:00:00 AM |
MICROWAVE JOINING OF THE Bi-BASED 2223 SUPERCONDUCTOR AND ITS MICROSTRUCTURE FEATURES |
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| CAI JIE,XIE XIAO-MING,LI XIANG-TING,CHEN TING-GUO,HUANG XIAO-XIAN and GUO JING-KUN.MICROWAVE JOINING OF THE Bi-BASED 2223 SUPERCONDUCTOR AND ITS MICROSTRUCTURE FEATURES[J].Acta Physica Sinica,1993,42(7):1167-1171. |
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| Authors: | CAI JIE XIE XIAO-MING LI XIANG-TING CHEN TING-GUO HUANG XIAO-XIAN and GUO JING-KUN |
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| Abstract: | Microwave joining developed rapidly in recent years, because of its advantages such as 1)low energy consnmption; 2)rapid heating rate; 3)high quality joint. Microwave joining of the Bi-based 2223 superconductor was studied with the results showing, after joining at 900-1000℃ for 10 minutes and post treatment at 855℃ for 60 hours, Tc restored to 107 K, the same as that of the original sample. Electron probe technique was used to study the microstructure features before and after joining. |
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