Ultrathin Silicon-Compound Barrier Coatings for Polymeric Packaging Materials: An Industrial Perspective |
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Authors: | Czeremuszkin G Latrèche M Wertheimer M R da Silva Sobrinho A S |
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Institution: | (1) Nova-Plasma Inc., Montréal, QC, Canada;(2) Department of Engineering Physics and Materials Engineering, Ecole Polytechnique, Montreal, QC, H3C 3A7, Canada |
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Abstract: | Growing demands for increased shelf-life of food products and chemical inertia of the contact surfaces have stimulated development of polymers with improved high-barrier properties. Our objectives in this article are (1) to describe experimental results on Plasma-enhanced chemical vapor deposition (PECVD) and its importance to produce thin layers of inorganic glassy barrier materials for food, pharmaceutical, and organic display applications; (2) despite the thereby greatly enhanced quality of film or rigid packaging material, some residual coating defects result in less-than-perfect gas, moisture and aroma barriers: an innovative technique based on reactive ion etching (RIE) in oxygen plasma is also presented, along with a staining method, which render even sub-m coating defects visible. Data are shown for oxygen transmission rate on virgin and defective coatings, and the industrial context and applications are presented. |
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Keywords: | PECVD silicon dioxide gas barrier plastics packaging |
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