| 三维单芯片多处理器温度特性 |
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| 引用本文： | 王凤娟,杨银堂,朱樟明,王宁,张岩.三维单芯片多处理器温度特性[J].计算物理,2012,29(6):938-942. |
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| 作者姓名： | 王凤娟 杨银堂 朱樟明 王宁 张岩 |
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| 作者单位： | 西安电子科技大学微电子学院, 西安 710071 |
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| 基金项目： | 国家自然科学基金，国家863计划，陕西省重大技术创新专项 |
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| 摘 要： | 给出热阻矩阵的表达式,研究三维单芯片多处理器(3D CMP,three-dimensional chip-multiprocessor)的温度特性,通过Matlab分析热容、热阻和功耗对温度的影响.结果表明:减小热阻和功耗可以有效约束3D-CMP的稳态温度;热容增大可以导致3D-CMP温度上升时间变长,但不影响其最终稳态温度.
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| 关 键 词： | 单芯片多处理器 热阻矩阵 三维集成 温度 |
| 收稿时间： | 2012-02-13 |
| 修稿时间： | 2012-05-24 |
Temperature Characteristics of Three-dimensional Chip-multiprocessors |
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| WANG Fengjuan
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YANG Yintang
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ZHU Zhangming
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WANG Ning
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ZHANG Yan.Temperature Characteristics of Three-dimensional Chip-multiprocessors[J].Chinese Journal of Computational Physics,2012,29(6):938-942. |
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| Authors: | WANG Fengjuan YANG Yintang ZHU Zhangming WANG Ning ZHANG Yan |
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| Institution: | School of Microelectronics, Xidian University, Xi'an 710071, China |
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| Abstract: | An expression of thermal resistance matrix is given.Transient temperature characteristics of three-dimensional chip-muhiprocessors(3D-CMP) are studied.Effect of heat capacity,thermal resistance and power consumption on temperature is analyzed. It shows that steady temperature of 3D-CMP is limited effectively by reducing thermal resistance and power consumption.Heat capacity influences rise time of temperature.It does not affect steady temperature. |
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| Keywords: | chip-muhiprocessor thermal resistance matrix three-dimensional integration temperature |
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