Studies on the blends of cardanol-based epoxidized novolac resin and CTPB

Cardanol-based novolac-type phenolic resins were synthesized with different mole ratios of cardanol-to-formaldehyde, viz., 1:0.6, 1:0.7, and 1:0.8. These novolac resins were epoxidized with molar excess of epichlorohydrin at 120 °C in basic medium. The epoxidized novolac resins were, separately, blended with different weight ratios of carboxyl-terminated polybutadiene liquid rubber ranging between 0-25 wt% with an interval of 5 wt%. All the blends were cured at 150 °C with 40 wt% polyamide. The formation of various products during the curing of blend samples has been studied by Fourier-transform infra-red spectroscopic analysis. The tensile strength and elongation-at-break of the cured samples increased up to 15 wt% in the blend and decreased thereafter. This blend sample was also found to be most thermally stable system. The blend morphology, studied by scanning electron microscopy analysis, was finally correlated with the structural and property changes in the blends.     

Lithographic design of photosensitive polyarylates based on reaction development patterning

The factors affecting pattern‐forming properties in reaction development patterning were examined with polyarylates with various bisphenol moieties. The developability of the photosensitive polyarylates was dependent on the properties of the subtituent (R) in the bisphenol moieties. The development time decreased in the following order: R?C(CH₃)₂ > fluorenyl unit ? phenolphthalein unit > C(CF₃)₂ > SO₂. This order agreed with that of the reactivity between the polyarylates and ethanolamine, and these orders can be explained by pK_a of the bisphenol used to prepare the polyarylates. The development with NH₂? R′? OH resulted in successful positive‐tone pattern formation. However, pattern formation with the developers containing NH₂? R′? OCH₃ was unsuccessful. © 2006 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 44: 2694–2706, 2006     

胺固化环氧酚醛树脂对Hg~(2+)的吸附性能

螯合树脂能与金属离子形成稳定的配合物,在无机、冶金、分析药物、催化、海洋化学、放射化学、环境保护各领域都有非常重要的应用[1-3]。我们曾以酚醛树脂为大分子骨架与多胺反应制备了一系列螯合树脂并对其结构及对多种金属离子的吸附性能进行了探讨[4,5]。本文则以线型环氧酚醛树脂为大分子骨架、多乙烯多胺为固化剂,制备了五种不同氮含量的氨基环氧酚醛螯合树脂,并考察其对金属离子Ｈｇ2+的吸附性能。1　实验部分1.1　仪器与试剂ＮｉｃｏｌｅｔＭＡＧＮＡ ＩＲ550(ＳｅｒｉｅｓＩＩ)红外分光光度计,ＳＨＡ-Ｃ水浴恒温振荡器,ＰＥ2000…     

A polymeric photobase generator containing oxime–urethane groups: Crosslinking reaction and application to negative photoresist

A polymeric photobase generator containing oxime–urethane groups was prepared by copolymerization of methyl methacrylate and methacryloxyethyl benzophenoneoxime urethane, and its photo and thermal crosslinking reaction after irradiation was examined from the measurement of UV and IR absorption spectral changes, insoluble fraction, and molecular weight changes. The photo‐crosslinking reaction of the copolymer film was more efficient when irradiations were carried out with 310 nm UV light in the presence of benzophenone than with 254 nm UV light without the addition of benzophenone. The crosslinking reaction increased after postexposure baking (PEB), and this thermal crosslinking reaction mechanism was studied from the identification of the photolysis products of a model compound, benzophenoneoxime phenylurethane, by a high‐performance liquid chromatography. The results indicate that the thermal crosslinking reaction of the copolymer after PEB is due to the formation of urea‐type chemical bonds. Resist properties of the copolymer were examined from the measurement of normalized thickness and micropattern development. A negative tone image with a resolution of 2 μm was obtained with this copolymer, having a sensitivity (D) of 1200 mJ/cm² and contrast (γ_n) of 1.31, when irradiation was carried out with 310 nm UV light in the presence of benzophenone following chloroform development. © 2004 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 42: 975–984, 2004     

The participation of the anion and alkyl substituent of diaryliodonium salts in photo‐initiated cationic polymerization reactions

The photo‐initiated cationic polymerization (PCP) of epoxides using diaryliodonium salt photoacid generators (PAGs) bearing alkyl groups and anions was investigated. The properties and reactivities of a series of iodonium salts containing various cations and anions were compared in the context of a PCP reaction. The products from the decomposition of the cations of these salts were analyzed using gas chromatography‐mass spectrometry (GC‐MS) spectra. The relationship between the molecular structure of the salts and their reaction mechanism in the PCP reaction was investigated. Based on the results of the investigation, it was concluded that the structures of the cations and anions of theiodonium salts affect the PCP reaction rate, which was controlled by the products from the diaryliodonium salts. As part of an additional investigation, the diaryliodonium salts‐epoxide materials were applied to 254 nm‐photo‐patterning. Copyright © 2006 John Wiley & Sons, Ltd.     

活性酯固化邻甲酚环氧树脂反应机理的研究

采用交叉反应研究在促进剂2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反 应机理，用傅立叶转换红外（FTIR）原位测量技术，NMR，气-质联用（GC-MS）等 手段研究了模型化合物的反应动力学，并提出了其反应机理。结果表明，在促进剂 2-甲基咪唑存在下活性酯固化邻甲酚环氧树脂的反应是通过分子内机理进行的。     

Thermal Stability of a Para-Cresol Novolac Resin

The thermal stability of p-cresol novolac resin was studied by means of DSC, X-ray diffraction, thermogravimetry and SEC investigations. After 30 thermal cycles in which the same sample was heated, cooled and heated again, without attainment of the temperature of degradation at any time in the experiment, important structural modifications are observed. At the end of the experiments, the resin, which is initially highly crystalline, exhibits all the characteristics of a semi-crystalline material. This revised version was published online in July 2006 with corrections to the Cover Date.     

Thermal decomposition characteristics of Alder-ene adduct of diallyl bisphenol A novolac with bismaleimide: effect of stoichiometry, novolac molar mass and bismaleimide structure

The addition-cured blends of diallyl bisphenol A formaldehyde resin (ABPF) with various bismaleimides (BMIs) were evaluated for thermal stability and degradation behavior by thermogravimetric analysis (TGA). TGA of the blend of ABPF and 2,2-bis 4-[(4-maleimido phenoxy) phenyl] propane (BMIP) with varying maleimide to allylphenol stoichiometry indicated that the thermal stability of the system was only marginally improved by the increase in BMI stoichiometry in the blend. The effect of BMI structure on thermal stability was studied using four different BMIs, viz. bis (4-maleimido phenyl) methane (BMIM), bis (4-maleimido phenyl) ether (BMIE), bis (4-maleimido phenyl) sulfone (BMIS) and BMIP. TGA showed a two stage decomposition pattern for BMIS system and a single stage for all the other three. The thermograms of BMIM and BMIE were identical and superior to that of BMIS; the latter showing a relatively poor performance at lower temperatures. Compared to the BMI-adduct of monomeric diallyl bisphenol A (DABA), the polymeric analog viz. ABPF system exhibited better thermal stability. Non-isothermal kinetic analyses of the different systems showed the decomposition occurring in at least two kinetic steps. The computed activation energy exhibited a direct correlation to the relative thermal stability of the systems.     

Direct patterning of poly(amic acid) and low‐temperature imidization using a crosslinker,a photoacid generator,and a thermobase generator

A positive‐type photosensitive polyimide (PSPI) based on poly(amic acid) (PAA), a crosslinker 1,1,1‐tris{4‐[2‐(vinyloxy)ethoxy]phenyl}ethane (TVPE), a photoacid generator (PAG) (5‐propylsulfonyloxyimino‐5H‐thiophen‐2‐ylidene)‐2‐(methylphenyl)acetonitrile (PTMA), and a thermobase generator (TBG) t‐butyl 2,6‐dimethylpiperidine‐1‐carboxylate (BDPC) has been developed as a promising material in microelectronics. The PAA was prepared from 3,3′,4,4′‐biphenyltetracarboxylic dianhydride (BPDA) and 4,4′‐oxydianiline (ODA) in dimethyl sulfoxide (DMSO). The PSPI, consisting of PAA (69 wt %), TPVE (21 wt %), PTMA (3 wt %), and BDPC (7 wt %), showed high sensitivity of 21 mJ/cm² and a high contrast of 6.8 when it was exposed to a 436‐nm line (g‐line), postbaked at 90 °C for 5 min, and developed with 1.69 wt % TMAHaq. A clear positive image of 8 μm line and space pattern was printed on film, which was exposed to 50 mJ/cm² of g‐line by a contact printing mode and fully converted to the corresponding polyimide (PI) pattern on heating at 200 °C, confirmed by FTIR spectroscopy. Thus, this system will be a good candidate for next generation PSPIs. © 2009 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 47: 3362–3369, 2009     

Negative‐type photosensitive poly(phenylene ether) based on poly(2,6‐dimethyl‐1,4‐phenylene ether), a crosslinker,and a photoacid generator

A negative‐type photosensitive poly(phenylene ether) (PSPPE) based on poly(2,6‐dimethyl‐1,4‐phenylene ether) (PPE), a novel crosslinker 4,4′‐methylene‐bis [2,6‐bis(methoxymethyl)phenol] (MBMP) having good compatibility with PPE, and diphenylidonium 9,10‐dimethoxy anthracene‐2‐sulfonate (DIAS) as a photoacid generator (PAG) has been developed. This resist consisting of PPE (73 wt %), MBMP (20 wt %) and DIAS (7 wt %) showed a high sensitivity (D_0.5) of 58 mJ/cm² and a contrast (γ_0.5) of 9.5 when it was exposed to i‐line (365 nm wavelength light), postexposure baked at 145 °C for 10 min, and developed with toluene at 25 °C. A fine negative image featuring 6 μm line‐and‐space pattern was obtained on the film exposed to 300 mJ/cm² of i‐line by a contact‐printed mode. The resulting polymer film cured at 300 °C for 1 h under nitrogen had a low dielectric constant (ε = 2.46) comparable to that of PPE and a higher T_g than that of PPE. In addition, the cured PSPPE film was pretty low water absorption (<0.05%) as same as PPE. © 2008 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 46: 4949–4958, 2008