Micellization and morphological characterization of Ag-micelles prepared by poly(vinyl acetate)–silver nitrate in solvent/nonsolvent system

The inducing method for preparing Ag-micelle solution with the use of mixed solvent/nonsolvent, and the morphological characterization of the generated metal–micelles were investigated and reported in this paper. In this method, an Ag containing metal chelate polymer (MCP) raw solution was preprepared by dissolving poly(vinyl acetate) (PVAc)–silver nitrate (AgNO₃) MCP in conc. formic acid, and a mixed solvent of HCOOH/H₂O with specific water composition was then added to induce the micellization of the MCP chain. The critical water concentration (CWC) that was needed for inducing the formation of the Ag-micelles, and the water concentration at which the flocculation of the Ag-micelles occurred in micellar solution, were studied by measuring the transmittance of the dilute MCP solution; the results showed that a long-lasting MCP solution with stable micelles might be prepared by using a H₂O/HCOOH solvent of specific weight ratio 1:1.2. The effect of the AgNO₃ concentration on the morphology of the Ag-micelles was also investigated by transmission electron microscopy (TEM). At AgNO₃ concentration below 0.5 wt%, the Ag-micelles displayed a variety of core-shell structure; but as the AgNO₃ concentration was increased to 1.0–2.0 wt%, micelles that had Ag-solid embedded in the micellar core were observed.     

Diffusion barrier performance of TiVCr alloy film in Cu metallization

In this study, 15 nm-thick sputter-deposited TiVCr alloy thin films were developed as diffusion barrier layers for Cu interconnects. The TiVCr alloy film tends to form a solid solution and a simple crystal structure from the constituted elements. Under TEM, the 15 nm-thick as-deposited TiVCr alloy film was observed to have a dense semi-amorphous or nanocrystalline structure. In conjunction with X-ray diffraction, transmission electron microscopy, and energy-dispersive spectroscopy analyses, the Si/TiVCr/Cu film stack remained stable at a high temperature of 700 °C for 30 min. The electrical resistance of Si/TiVCr/Cu film stack remained as low as the as-deposited value. These indicated that the mixed TiVCr refractory elements’ alloy barrier layer is very beneficial to prevent Cu diffusion.     

Structural and mechanical properties of multi-element (TiVCrZrHf)N coatings by reactive magnetron sputtering

In this study, (TiVCrZrHf)N multi-component coatings with quinary metallic elements were deposited by reactive magnetron sputtering system. The composition, structure, and mechanical properties of the coatings deposited at different N₂ flow rates were investigated. The (TiVCrZrHf)N coatings deposited at N₂ flow rates of 0, 1, and 2 SCCM showed an amorphous structure, whereas those deposited at N₂ flow rates of 4 and 6 SCCM showed a simple face-centered cubic solid solution structure. A saturated nitride coating was obtained for N₂ flow of 4 SCCM and higher. By increasing N₂ flow to 4 SCCM, the hardness and modulus reached a maximum value of 23.8 ± 0.8 and 267.3 ± 4.0 GPa, respectively.     

Effects of substrate temperature on the structure and mechanical properties of (TiVCrZrHf)N coatings

The present paper reports the influence of growth conditions on the characteristics of (TiVCrZrHf)N films prepared by rf reactive magnetron sputtering at various substrate temperatures. The nitrogen content is observed to decrease with increasing substrate temperature. The X-ray diffraction results indicate that all (TiVCrZrHf)N films are simple face centered cubic (FCC) structures. Initially, there is an obvious decrease followed by an increase in grain size with the increase in substrate temperature. The lower part of the microstructure has an amorphous structure. A nano grain structure (size ∼1 nm) with a random orientation is also observed above the amorphous structure. The fully dense columnar structure with an fcc crystal phase then starts to develop. Extreme hardness of around 48 GPa is obtained in the present alloy design.     

Structure and optoelectronic properties of multi-element oxide thin film

This paper focuses on analyzing structural and optoelectronic properties of (ZnSnCuTiNb)_1 − xO_x films. The results of XRD and HRTEM indicate that the (ZnSnCuTiNb)_1 − xO_x films are all of amorphous without any multi-phase structure. XPS analysis confirms that the increase of the oxygen content makes the cations electron binding energy higher, suggesting the removal of valence electrons or the extent of oxidation can change the optoelectronic properties of the films. The (ZnSnCuTiNb)_1 − xO_x films possess the characteristics of optoelectronic semiconductor whose oxygen content are 51.6 and 56 atom%. These films have carrier concentrations of 2.62 × 10²⁰ and 1.37 × 10¹⁷ cm⁻³, and conductivities (σ) of 57.2 and 9.45 × 10⁻³ (Ω cm)⁻¹, and indirect band gaps of 1.69 and 2.26 eV, respectively. They are n-type oxide semiconductors.     

Effect of GePt buffer layer on magnetic properties and microstructure of FePt films

We have explored the interlayer diffusion effect of Ge/FePt, GePt/FePt bilayer on the formation of ordered L1₀ FePt phase. In Ge/FePt bilayer, the Ge₃Pt₂ compound was formed during post annealing at 400^oC for 1.0 h. Diffusion between Ge and FePt layer suppres the formation of ordered L1₀ FePt phase. With Ge₂Pt₃ underlayer, the FePt film was ordered at 400 °C and the in-plane coercivity was 9.3 kOe. The ordering temperature was reduced about 50 °C compared to the single layer FePt film.     

A linear-time algorithm for finding optimal vehicle refueling policies

We explore a fixed-route vehicle refueling problem as a special case of the inventory-capacitated lot-sizing problem, and present a linear-time greedy algorithm for finding optimal refueling policies.     

Isomerization of endo-tetrahydrodicyclopentadiene over clay-supported chloroaluminate ionic liquid catalysts

Various halide salts with different alkyl lengths were allowed to intercalate into the layer structure of sodium montmorillonite clay through an ion exchange reaction. Intercalation of 1-hexadecyl-3-methylimidazolium chloride, hexadecyltrimethylammonium bromide, dihexadecyldimethylammonium bromide, and tributylhexadecylphosphonium bromide could expand the spacing of the silicate layers from 12 to 37–41 Å (measured by X-ray diffraction). The modified clays were pretreated with the pyridine hydrochloride/AlCl₃ mixture and used for suitably supporting a chloroaluminate ionic liquid catalyst for the isomerization of endo-tetrahydrodicyclopentadiene into the corresponding exo-isomer. Nearly quantitative conversion to the desired product and nearly quantitative selectivity were observed for the newly developed clay-supported ionic liquid catalysts, which were proven to be recyclable.     

Structure and properties of (TiVCrZrY)N coatings prepared by energetic bombardment sputtering with different nitrogen flow ratios

(TiVCrZrY)N coatings were deposited onto Si substrate by the radio-frequency (RF) magnetron sputtering of a TiVCrZrY alloy target in an N₂/Ar atmosphere. The crystal, microstructural, mechanical, and electrical properties at different N₂-to-total (N₂+Ar) flow-rate ratio (R _N) values were investigated. The coating produced in pure Ar had an equiaxed structure with a hexagonal-close-packed phase. With increased R _N, the crystallinity and grain size markedly decreased. The microstructure of (TiVCrZrY)N coatings transformed from V-shaped columnar with a rough-domed surface into fine fibrous with a smooth surface. The amorphous transition layer above the substrate was also significantly thickened. The hardness of (TiVCrZrY)N decreased from 20.9 GPa to 18.9 GPa, and the electrical resistivity increased from 398.2 μΩ?cm to 21870 μΩ?cm.