CdZnTe晶体热激电流谱分析

热激电流谱测试技术(TSC)是宽禁带半导体深能级缺陷非常有效的测试方法,能够精准获得缺陷类型,深度(E_a,i),浓度(N_ｉ)以及俘获截面(σ_ｉ)等重要物理信息。研究了基于变升温速率的Arrhenius公式作图法和同步多峰分析法(SIMPA)对热激电流谱数据处理的差异及影响规律。结果表明,Arrhenius公式作图法在陷阱能级深度确认方面较为准确,但需要通过多次变升温速率提高其准确性,实验操作周期较长,并且无法分解热激电流谱峰重叠的情况。相比之下,同步多峰分析法能够通过单次温度扫描的数据处理得到E_a,i,N_i及σ_i等陷阱参数,所需实验周期较短。但β,E_a,i,σ_i和载流子迁移率寿命积(μt)等参数的选择对谱峰的位置,幅值及峰宽影响较大。初值的设定对拟合结果和数据吻合程度影响显著。此外,红外透过成像结果表明,头部样品Te夹杂相的浓度较低且呈现明显的带状分布,而尾部样品夹杂相浓度呈均匀分布。通过对比不同样品的热激电流谱测试结果发现,尾部样品浅能级陷阱浓度远高于头部样品,且其低温光电导弛豫过程呈现明显的曲线变化规律。这一研究结果表明,Te夹杂相的分布及浓度可能会导致晶体内部浅能级缺陷的浓度变化,并且浅能级缺陷对光激发载流子的俘获时间更长,去俘获时间更短。     

Distinctive distribution of defects in CdZnTe:In ingots and their effects on the photoelectric properties

Photoelectric properties of CdZnTe:In samples with distinctive defect distributions are investigated using various techniques. Samples cut from the head(T04) and tail(W02) regions of a crystal ingot show distinct differences in Te inclusion distribution. Obvious difference is not observed in Fourier transform infrared(FTIR) spectra, UV–Vis–NIR transmittance spectra, and Ⅰ–Ⅴ measurements. However, carrier mobility of the tip sample is higher than that of the tail according to the laser beam induced current(LBIC) measurements. Low temperature photoluminescence(PL) measurement presents sharp emission peaks of D~0 X and A~0 X, and relatively large peak of D~0 X(or A~0 X)/D_(complexfor) T04, indicating a better crystalline quality. Thermally stimulated current(TSC) spectrum shows higher density of shallow point defects, i.e.,Cd vacancies, In_(Cd)~+, etc., in W02 sample, which could be responsible for the deterioration of electron mobility.