排序方式: 共有1条查询结果,搜索用时 15 毫秒
1
1.
Packaging of Distributed feedback (DFB) laser array based on reconstruction=equivalent-chirp (REC) tech- nology is a bridge from chip to system, and influences the practical process of REC chip. In this letter, DFB laser arrays of 4 channel @1 310 nm and 8 channel @1 550 nm are packaged. Experimental results show that both 4 channel @1 310 nm and 8 channel @1 550 nm have uniform wavelength spacing and average side mode suppression ratio (SMSR)〉35 dB. When I=35 mA, we get the total output power 1 mW of 4 channel @1 310 nm, and 227 μW of 8 channel @1 550 nm, respectively. The high frequency characteristic of the packaged chips is also demonstrated, and the requirements of 4× 10 G or even 8× 10 G system can be reached, we demonstrate the practical and low cost performance of REC technology and indicates its potential application in the future fiber-to-the-home (FTTH). 相似文献
1