透明质酸纳米材料在荧光/光声成像和光疗中的应用

荧光/光声成像和光疗技术的生物医学应用引起了人们越来越多的关注, 然而很多荧光/光声造影剂存在生物相容性较差, 缺乏肿瘤靶向性, 信噪比较低, 功能单一等共性问题, 严重限制其诊疗应用. 透明质酸具有优异的生物相容性和主动肿瘤靶向性, 可被透明质酸酶降解, 并且易于化学修饰和实现多种超分子弱相互作用力协同工作. 因此, 人们将透明质酸与荧光/光声造影剂结合制备纳米材料, 使其在细胞乃至活体的标记性能和治疗效果获得了很大的改善. 本文综述了将两类物质结合制备纳米材料的方法, 着重阐述了纳米材料的结构与性能关系, 为其未来设计和开发提供了指导, 最后对存在的主要问题以及未来的重要研究方向进行了分析和展望.     

Electric field modulation technique for high-voltage AIGaN/GaN Schottky barrier diodes

A novel structure of AIGaN/GaN Schottky barrier diode （SBD） featuring electric field optimization techniques of anode-connected-field-plate （AFP） and magnesium-doped p-type buried layer under the two-dimensional electron gas （2DEG） channel is proposed. In comparison with conventional A1GaN/GaN SBDs, the magnesium-doped p-type buried layer in the proposed structure can provide holes that can help to deplete the surface 2DEG. As a result, surface field strength around the electrode edges is significantly suppressed and the electric field along the channel is distributed more evenly. Through 2D numerical analysis, the AFP parameters （field plate length, LAFP, and field plate height, TAFP） and p-type buried layer parameters （p-type layer concentration, Np, and p-type layer thickness, Tp） are optimized to achieve a three-equal-peak surface channel field distribution under exact charge balance conditions. A novel structure with a total drift region length of 10.5 μm and a magnesium-doped p-type concentration of 1 × 10^17 cm 3 achieves a high breakdown voltage （VB） of 1.8 kV, showing 5 times improvement compared with the conventional SBD with the same device dimension.     

Electric field modulation technique for high-voltage AlGaN/GaN Schottky barrier diodes

A novel structure of AlGaN/GaN Schottky barrier diode(SBD) featuring electric field optimization techniques of anode-connected-field-plate(AFP) and magnesium-doped p-type buried layer under the two-dimensional electron gas(2DEG) channel is proposed.In comparison with conventional AlGaN/GaN SBDs,the magnesium-doped p-type buried layer in the proposed structure can provide holes that can help to deplete the surface 2DEG.As a result,surface field strength around the electrode edges is significantly suppressed and the electric field along the channel is distributed more evenly.Through 2D numerical analysis,the AFP parameters(field plate length,L AFP,and field plate height,T AFP) and p-type buried layer parameters(p-type layer concentration,N P,and p-type layer thickness,T P) are optimized to achieve a three-equal-peak surface channel field distribution under exact charge balance conditions.A novel structure with a total drift region length of 10.5 μm and a magnesium-doped p-type concentration of 1 × 1017cm-3achieves a high breakdown voltage(V B) of 1.8 kV,showing 5 times improvement compared with the conventional SBD with the same device dimension.     

高性能垂直型GaN-on-GaN二极管的研究

由于高质量自支撑氮化镓(GaN)衬底的出现,垂直型GaN-on-GaN器件获得了快速的发展并具有较高的功率等级和工作频率.本文讨论了垂直型GaN功率二极管的制作、机制和表征.通过制作高质量肖特基界面和高效氟离子注入终端,垂直型GaN肖特基二极管可以表现出较低的正向开启电压(0.55 V,定义于0.1 A/cm2)和较高的反向击穿电压(～800 V).通过极薄的铝镓氮(AlGaN)隧穿增强层,可进一步同时优化正向开启电压(0.43 V)和反向击穿电压(～1020 V).在快速动态测试电路中,垂直型GaN二极管也表现出了接近零的反向恢复特性和无电流坍塌的优异动态特性.     

A comparative investigation of an AB- and AA-stacked bilayer graphene sheet under an applied electric field: A density functional theory study

An AB- and AA-stacked bilayer graphene sheet(BLG) under an electric field is investigated by ab initio calculation.The interlayer distance between the two layers,band structures,and atomic charges of the system are investigated in the presence of different electric fields normal to the BLG.The AB- stacked BLG is able to tune the bandgap into 0.234 eV with the increase of the external electronic field to 1 V/nm,however,the AA-stacked BLG is not sensitive to the external electric field.In both the cases,the spacing between the BLG slightly change in terms of the electric field.The charges in the AB- stacked BLG are increased with the increase of the electric field,which is considered to be the reason that causes the bandgap opening in the AB- stacked BLG.     

Design consideration and fabrication of 1.2-kV 4H-SiC trenched-and-implanted vertical junction field-effect transistors

We present the design consideration and fabrication of 4H-SiC trenched-and-implanted vertical junction field-effect transistors （TI-VJFETs）. Different design factors, including channel width, channel doping, and mesa height, are con- sidered and evaluated by numerical simulations. Based on the simulation result, normally-on and normally-off devices are fabricated. The fabricated device has a 12 μm thick drift layer with 8 × 10^15 cm^-3 N-type doping and 2.6 μm channel length. The normally-on device shows a 1.2 kV blocking capability with a minimum on-state resistance of 2.33 mΩ.cm2, while the normally-off device shows an on-state resistance of 3.85 mΩ.cm2. Both the on-state and the blocking performances of the device are close to the state-of-the-art values in this voltage range.     

A novel 4H-SiC lateral bipolar junction transistor structure with high voltage and high current gain

In this paper, a novel structure of a 4H-SiC lateral bipolar junction transistor (LBJT) with a base field plate and double RESURF in the drift region is presented. Collector-base junction depletion extension in the base region is restricted by the base field plate. Thin base as well as low base doping of the LBJT therefore can be achieved under the condition of avalanche breakdown. Simulation results show that thin base of 0.32 μm and base doping of 3×1017 cm-3 are obtained, and corresponding current gain is as high as 247 with avalanche breakdown voltage of 3309 V when the drift region length is 30 μm. Besides, an investigation of a 4H-SiC vertical BJT (VBJT) with comparable breakdown voltage (3357 V) shows that the minimum base width of 0.25 μm and base doping as high as 8×1017 cm-3 contribute to a maximum current gain of only 128.     

An AlGaN/GaN HEMT with enhanced breakdown and a near-zero breakdown voltage temperature coefficient

An AlGaN/GaN high-electron mobility transistor(HEMT) with a novel source-connected air-bridge field plate(AFP) is experimentally verified.The device features a metal field plate that jumps from the source over the gate region and lands between the gate and drain.When compared to a similar size HEMT device with a conventional field plate(CFP) structure,the AFP not only minimizes the parasitic gate to source capacitance,but also exhibits higher OFF-state breakdown voltage and one order of magnitude lower drain leakage current.In a device with a gate to drain distance of 6 μm and a gate length of 0.8 μm,three times higher forward blocking voltage of 375 V was obtained at VGS =-5 V.In contrast,a similar sized HEMT with a CFP can only achieve a breakdown voltage no higher than 125 V using this process,regardless of device dimensions.Moreover,a temperature coefficient of 0 V/K for the breakdown voltage is observed.However,devices without a field plate(no FP) and with an optimized conventional field plate(CFP) exhibit breakdown voltage temperature coefficients of-0.113 V/K and-0.065 V/K,respectively.     

Investigations on mesa width design for 4H–SiC trench super junction Schottky diodes

Mesa width(WM) is a key design parameter for SiC super junction(SJ) Schottky diodes(SBD) fabricated by the trench-etching-and-sidewall-implant method. This paper carries out a comprehensive investigation on how the mesa width design determines the device electrical performances and how it affects the degree of performance degradation induced by process variations. It is found that structures designed with narrower mesa widths can tolerant substantially larger charge imbalance for a given BV target, but have poor specific on-resistances. On the contrary, structures with wider mesa widths have superior on-state performances but their breakdown voltages are more sensitive to p-type doping variation. Medium WMstructures(～ 2 μm) exhibit stronger robustness against the process variation resulting from SiC deep trench etching.Devices with 2-μm mesa width were fabricated and electrically characterized. The fabricated SiC SJ SBDs have achieved a breakdown voltage of 1350 V with a specific on-resistance as low as 0.98 m?·cm~2. The estimated specific drift onresistance by subtracting substrate resistance is well below the theoretical one-dimensional unipolar limit of SiC material.The robustness of the voltage blocking capability against trench dimension variations has also been experimentally verified for the proposed SiC SJ SBD devices.     

中低压碳化硅材料、器件及其在电动汽车充电设备中的应用示范

碳化硅（SiC）电力电子器件的高压、高温和高频率特性,使其成为理想的电动汽车充电设备器件,将显著提升电动汽车充电设备的效率和功率密度.开展中低压SiC材料、器件及其在电动汽车充电设备中的示范应用,不仅有利于加快建立我国自主的碳化硅全产业链,而且有助于提高我国电动汽车充电设备的核心竞争力.