SiC光学材料亚表面缺陷的光热辐射检测

SiC以优异的物理性能和良好的工艺性能,逐渐成为大型空间成像光学系统主镜的首选轻量化光学材料. SiC镜坯制备及加工过程中引入的亚表面缺陷会严重影响最终的镜面质量以及光学系统的成像品质.针对SiC材料亚表面缺陷的检测问题,本文采用光热辐射技术进行分析:分别建立均匀样品的单层理论模型和含空气层缺陷的三层理论模型,用于计算无缺陷和存在缺陷区域的光热辐射信号.通过对三层理论模型信号的相位仿真分析,提出利用相位差-频率曲线的特征频率估算缺陷深度的经验公式;利用光热辐射装置测量存在亚表面缺陷的SiC样品,分析缺陷区域的光热辐射信号分布,利用经验公式计算缺陷深度,并与缺陷实际深度分布进行对比分析.实验与计算结果显示,光热辐射技术能有效探测SiC镜坯的亚表面缺陷及其形貌,并且对于界面与样品相对平行且较为平缓的亚表面缺陷,其缺陷深度可通过经验公式准确确定.     

Thermal diffusivity of light-emitting diode packaging material determined by photoacoustic piezoelectric technique

Thermal property is one of the most important properties of light-emitting diode (LED).Thermal property of LED packaging material determines the heat dissipations of the phosphor and the chip surface,accordingly having an influence on the light-emitting efficiency and the life-span of the device.In this paper,photoacoustic piezoelectric (PAPE) technique has been employed to investigate the thermal properties of polyvinyl alcohol (PVA) and silicon dioxide,which are the new and the traditional packaging materials in white LED,respectively.Firstly,the theory of PAPE technique has been developed for two-layer model in order to investigate soft materials;secondly,the experimental system has been set up and adjusted by measuring the reference sample;thirdly,the thermal diffusivities of PVA and silicon dioxide are measured and analysed.The experimental results show that PVA has a higher thermal diffusivity than silicon dioxide and is a better packaging material in the sense of thermal diffusivity for white LED.