基于广义弹性理论的微梁固有频率及模态的尺寸效应

经典弹性理论在近代工程技术中得到广泛应用,但其本构关系中不包含任何与尺寸相关的参数,因此不适用于微观结构,不能预测和解释尺寸效应.广义弹性理论增加了偶应力及其对应的曲率张量,完善了对小变形的几何描述,适用于微结构的尺寸效应研究.该文采用广义弹性理论,并结合Hamilton变分原理推导了悬臂微梁的振动微分方程,对微梁的固有频率及其模态进行了分析.结果表明,随着微梁厚度的不断减小,固有频率的尺寸效应与其对应的模态密切相关.扭转和弯曲模态包含了旋转变形,其对应的固有频率显著提高,表现出了显著的尺寸效应;而拉压模态不涉及旋转变形,固有频率未产生明显变化,没有尺寸效应.     

Relationship between the spatial position of the seed and growth mode for single-crystal diamond grown with an enclosed-type holder

The relationship between the spatial position of the diamond seed and growth mode is investigated with an enclosed-type holder for single-crystal diamond growth using the microwave plasma chemical vapor deposition epitaxial method. The results demonstrate that there are three main regions by varying the spatial position of the seed. Due to the plasma concentration occurring at the seed edge, a larger depth is beneficial to transfer the plasma to the holder surface and suppress the polycrystalline diamond rim around the seed edge. However, the plasma density at the edge decreases drastically when the depth is too large, resulting in the growth of a vicinal grain plane and the reduction of surface area. By adopting an appropriate spatial location, the size of single-crystal diamond can be increased from 7 mm × 7 mm × 0.35 mm to 8.6 mm × 8.6 mm × 2.8 mm without the polycrystalline diamond rim.     

Plasma-assisted surface treatment for low-temperature annealed ohmic contact on AlGaN/GaN heterostructure field-effect transistors

In this study, a low-temperature annealed ohmic contact process was proposed on Al Ga N/Ga N heterostructure field effect transistors(HFETs) with the assistance of inductively coupled plasma(ICP) surface treatment. The effect of ICP treatment process on the 2DEG channel as well as the formation mechanism of the low annealing temperature ohmic contact was investigated. An appropriate residual Al Ga N thickness and a plasma-induced damage are considered to contribute to the low-temperature annealed ohmic contact. By using a single Al layer to replace the conventional Ti/Al stacks, ohmic contact with a contact resistance of 0.35 ?·mm was obtained when annealed at 575?C for 3 min. Good ohmic contact was also obtained by annealing at 500?C for 20 min.     

Design of vertical diamond Schottky barrier diode with junction terminal extension structure by using the n-Ga2O3/p-diamond heterojunction

A novel junction terminal extension structure is proposed for vertical diamond Schottky barrier diodes (SBDs) by using an n-Ga₂O₃/p-diamond heterojunction. The depletion region of the heterojunction suppresses part of the forward current conduction path, which slightly increases the on-resistance. On the other hand, the reverse breakdown voltage is enhanced obviously because of attenuated electric field crowding. By optimizing the doping concentration, length, and depth of n-Ga₂O₃, the trade-off between on-resistance and breakdown voltage with a high Baliga figure of merit (FOM) value is realized through Silvaco technology computer-aided design simulation. In addition, the effect of the work functions of the Schottky electrodes is evaluated. The results are beneficial to realizing a high-performance vertical diamond SBD.     

Hybrid-anode structure designed for a high-performance quasi-vertical GaN Schottky barrier diode

A quasi-vertical GaN Schottky barrier diode with a hybrid anode structure is proposed to trade off the on-resistance and the breakdown voltage. By inserting a SiN dielectric between the anode metal with a relatively small length, it suppresses the electric field crowding effect without presenting an obvious effect on the forward characteristics. The enhanced breakdown voltage is ascribed to the charge-coupling effect between the insulation dielectric layer and GaN. On the other hand, the current density is decreased beneath the dielectric layer with the increasing length of the SiN, resulting in a high on-resistance. Furthermore, the introduction of the field plate on the side wall forms an metal-oxide-semiconductor (MOS) channel and decreases the series resistance, but also shows an obvious electric field crowding effect at the bottom of the mesa due to the quasi-vertical structure.     

Evaluation of a gate-first process for AlGaN/GaN metal-oxide-semiconductor heterostructure field-effect transistors with low ohmic annealing temperature

In this paper, TiN/AlO_x gated Al Ga N/Ga N metal–oxide–semiconductor heterostructure field-effect transistors(MOSHFETs) were fabricated for gate-first process evaluation. By employing a low temperature ohmic process, ohmic contact can be obtained by annealing at 600℃ with the contact resistance approximately 1.6 ?·mm. The ohmic annealing process also acts as a post-deposition annealing on the oxide film, resulting in good device performance. Those results demonstrated that the TiN/AlO_x gated MOS-HFETs with low temperature ohmic process can be applied for self-aligned gate Al Ga N/Ga N MOS-HFETs.     

Self-aligned-gate AlGaN/GaN heterostructure field-effect transistor with titanium nitride gate

Self-aligned-gate heterostructure field-effect transistor(HFET) is fabricated using a wet-etching method.Titanium nitride(TiN) is one kind of thermal stable material which can be used as the gate electrode.A Ti/Au cap layer is fixed on the gate and acts as an etching mask.Then the T-shaped gate is automatically formed through over-etching the TiN layer in 30% H_2O_2 solution at 95 ℃.After treating the ohmic region with an inductively coupled plasma(ICP) method,an Al layer is sputtered as an ohmic electrode.The ohmic contact resistance is approximately 0.3 Ω·mm after annealing at a low-temperature of 575 ℃ in N_2 ambient for 1 min.The TiN gate leakage current is only 10~(-8) A after the low-temperature ohmic process.The access region length of the self-aligned-gate(SAG) HFET was reduced from 2 μm to 0.3 μm compared with that of the gate-first HFET.The output current density and transconductance of the device which has the same gate length and width are also increased.     

Wave nature of Rosensweig instability

The explicit analytical solution of Rosensweig instability spikes’ shapes obtained by Navier–Stokes(NS) equation in diverse magnetic field H vertical to the flat free surface of ferrofluids are systematically studied experimentally and theoretically. After carefully analyzing and solving the NS equation in elliptic form, the force balanced surface equations of spikes in Rosensweig instability are expressed as cosine wave in perturbated magnetic field and hyperbolic tangent in large magnetic fiel...     

Effect of overdrive voltage on PBTI trapping behavior in GaN MIS-HEMT with LPCVD SiNx gate dielectric

The effect of high overdrive voltage on the positive bias temperature instability(PBTI)trapping behavior is investigated for GaN metal–insulator–semiconductor high electron mobility transistor(MIS-HEMT)with LPCVD-SiNx gate dielectric.A higher overdrive voltage is more effective to accelerate the electrons trapping process,resulting in a unique trapping behavior,i.e.,a larger threshold voltage shift with a weaker time dependence and a weaker temperature dependence.Combining the degradation of electrical parameters with the frequency–conductance measurements,the unique trapping behavior is ascribed to the defect energy profile inside the gate dielectric changing with stress time,new interface/border traps with a broad distribution above the channel Fermi level are introduced by high overdrive voltage.     

Growth and Characteristics of Freestanding Hemispherical Diamond Films by Microwave Plasma Chemical Vapor Deposition

Freestanding hemispherical diamond films have been fabricated by microwave plasma chemical vapor deposition using graphite and molybdenum （Mo） as substrates. Characterized by Raman spectroscopy and scanning electron microscopy, the crystalline quality of the films deposited on Mo is higher than that on graphite, which is attributed to the difference in intrinsic properties of the two substrates. By decreasing the methane concentration, the diamond films grown on the Mo substrate vary from black to white, and the optical transparency is enhanced. After polishing the growth side, the diamond films show an infrared transmittance of 35-60% in the range 400-4000 cm^- 1.