冲击加载下硅烷流体的导电特性研究

采用二级轻气炮加载技术,结合低温靶和光电监测技术,研究了在多次冲击压缩状态下液态硅烷的导电特性。本文在7—56GPa压力区间获得了一组新的电阻率数据点,并结合在高压区(65—108GPa)已发表的电阻率数据,在更宽压缩区间(7—108GPa)给出了硅烷流体电阻率随压力的变化规律。结果表明,硅烷流体在7—41GPa之间具有较好电绝缘性,但在41—52GPa之间电阻率从约150Ωcm迅速下降到约1Ωcm,其降幅达到两个数量级。当压力从52GPa进一步升高到108GPa,硅烷流体的电阻率再降低了近5倍,但与低压段相比电阻率随压力变化的速率明显减小。分析lnρ~P图中数据点分布特征发现在52GPa附近出现明显拐折点。据此推测硅烷流体在该压力附近可能发生了结构相变。     

Theoretics-directed effect of copper or aluminum content on the ductility characteristics of Al-based(Al_3Ti,AlTi,AlCu,AlTiCu_2)intermetallic compounds

First-principle simulations have been applied to investigate the effect of copper(Cu) or aluminum(Al) content on the ductility of Al_3Ti,AlTi,AlCu,and AlTiCu_2 alloys.The mechanical stable and elastic properties of Al-based intermetallic compounds are researched by density functional theory with the generalized gradient approximation(DFT-GGA).The calculated lattice constants are in conformity with the previous experimental and theoretical data.The deduced elastic constants show that the investigated Al_3Ti,AlTi,AlCu,and AlTiCu_2 structures are mechanically stable.Shear modulus,Young's modulus,Poisson's ratio,and the ratio B/G have also been figured out by using reckoned elastic constants.A further analysis of Young's modulus and Poisson's ratio reveals that the third added element copper content has significant effects on the Al-Ti-based ICs ductile character.