Laser induced copper electroless plating on polyimide with Q-switch Nd:YAG laser

The results of laser induced deposition of copper on polyimide substrate from copper electrolyte solution are reported. Unlike most work reported in the literatures where CW Ar⁺ lasers were used, a second harmonic (532 nm wavelength) Q-switch Nd:YAG laser was used for our experiments. The deposition process was conducted by laser-catalyzing of the polyimide surface and subsequent photothermal-accelerated reduction of copper-complex ions in an alkaline reducing environment. The characteristics of the deposited copper line were investigated in terms of laser beam scanning speed, and the number of scans. The surface morphology and chemical composition of the deposited copper were analyzed using field emission scanning electron microscope (FESEM) and energy dispersive spectrometer (EDX). The optimum processing conditions have been identified. The copper deposit was found to adhere well to the substrate.     

SURFACE METALLIZATION OF CENOSPHERES AND PRECIPITATORS BY ELECTROLESS PLATING

This paper reports the use of a colloidal Pd^0 catalysis system to metallize the surface of precipitators separated from coal fly-ash, and metals such as Cu, Ni etc. are deposited on the precipitators surface. Alternatively, according to the characteristic surface of cenospheres, an Ag coating catalysis system is adopted to first deposit Ag on the cenospheres surface, followed, if necessary, by the deposition of other metals such as Cu, Ni, etc. on the Ag coating to produce monolayer and multilayer metal-coated cenospheres. The surface characteristics and the morphologies of the metal coatings are examined in detail with scanning electron microscopy (SEM), energy dispersive spectroscopy (EDX) and X-ray photoelectron spectroscopy (XPS) techniques. It can be shown that the quality of metal coatings derived from the Aa coatina catalysis system, is better than that of the colloidal Pd^0 catalysis system.     

负载型纳米Ni催化剂用于对氯硝基苯选择加氢

以TiO2为载体,N iB为诱导剂,粉末化学镀法制备了负载型纳米N i催化剂.通过TEM、HRTEM、XRD和ICP技术对催化剂物性进行了表征.结果表明,碱性镀液可使载体表面均匀负载微晶结构纳米N i团簇,尺度为35nm左右.该负载型纳米N i在对氯硝基苯选择加氢反应中表现出很高催化加氢活性,并能有效抑制脱氯,达到了工业骨架镍水平.由酸性镀液得到的负载型非晶态纳米N i-P合金具有较弱的催化对氯硝基苯加氢活性.反应温度对反应时间和脱氯率有明显影响.     

化学复合镀Ni-P-PTFE镀层的组成分析

近年来化学复合镀技术在工业中应用日益广泛 ,本文运用ＳＥＭ、ＡＥＳ和ＸＰＳ等手段对用化学复合镀制得的Ｎｉ Ｐ ＰＴＦＥ镀层的结构和组分进行了分析 ,并就其耐腐蚀性能与前期得到的Ｎｉ Ｓｎ Ｐ[1 ] 、Ｃｕ Ｓｎ Ｐ[2 ] 、Ｎｉ Ｐ ＣｅＯ2 [3] 、Ｎｉ Ｐ ＳｉＯ2 [4] 镀层进行了比较 ,结果表明 :含量一定的ＰＴＦＥ(聚四氟乙烯 )的共存增强镀层的耐腐蚀性及镀层表面的润滑性。1　实验部分1 1　仪器日产Ｄ/ＭＡＸⅢＡ型Ｘ 射线衍射仪 ,铜靶 ,管压 2 5ｋＶ ,电流 1 0ｍＡ。国产ＪＪＣ 1型润滑湿角测量仪。美国ＰＥＲＫＩＮ ＥＬＭＥＲＰ…     

2,2''''-联吡啶和亚铁氰化钾对乙醛酸化学镀铜的影响

以乙醛酸作还原剂、Na2EDTA为络合剂、2,2'-联吡啶和亚铁氰化钾作为添加剂组成化学镀铜体系,研究了两种添加剂对化学镀铜速率、镀层表面形貌、组成和结构的影响.结果表明:添加适量的2,2'-联吡啶和亚铁氰化钾,不仅提高了镀液的稳定性,而且使沉积速率增加1倍.这两种添加剂的同时使用,使镀层颜色变亮,形貌发生变化.所得镀层是多晶铜,没有发现夹杂Cu20.     

低温低内应力化学镀镍工艺的研究

化学镀广泛应用于非金属的电镀、电铸前的施加导电层。化学镀沉积层质量与其在零件上的附着力有着密切的关系 ,重视对化学镀沉积层内应力的研究 ,开发一个低温、低内应力的化学镀镍工艺 ,对于化学镀沉积层的推广应用有着十分重要的意义。本文采用正交实验方法对低温、低内应力化学镀镍工艺进行了系统研究 ,开发出了一个低温、低内应力的化学镀镍工艺。在实验过程中发现沉积层内应力同其在零件上的结合力具有密切关系并对其进行了初步探讨。1　实验方法1 1　正交实验根据探索性实验结果分析 ,影响化学镀镍层内应力σ和沉积层速率ｒ的主要因…     

粉末化学镀法制备的NiB／TiO2非晶态合金催化剂对环丁烯砜加氢反应的催化性能

 采用诱导沉积法及粉末化学镀法分别制备了纯态NiB及负载型NiB／TiO2非晶态合金催化剂．用XRD，ICP，SEM，TEM和DSC等手段对催化剂的物性及TiO2载体与NiB非晶态合金之间的相互作用进行了表征，考察了非晶态合金的结构、组成、形貌和热稳定性，并将其用于环丁烯砜加氢反应中．结果表明，相对于NiB而言，NiB／TiO2催化剂具有优良的热稳定性和催化活性，这缘于NiB和TiO2载体之间的相互作用及载体的分散作用．     

Novel Electroless Deposition of Cu<Subscript>3</Subscript>Se<Subscript>2</Subscript> Film on Silicon Substrate by a Simple Galvanic Displacement Process

A novel electroless deposition method for depositing highly uniform adhesive thin films of copper selenide (Cu₃Se₂) on silicon substrates from aqueous solutions is described. The deposition is carried out by two coupled galvanic reactions in a single deposition bath containing copper cations, hydrogen fluoride, and selenous acid: the galvanic deposition of copper on silicon and the subsequent galvanic reaction between the deposited copper with selenous acid in the deposition bath. The powder X-ray diffraction and scanning electron microscopy are used to characterize and examine the deposited films.     

A New Activation Method for Electroless Metal Plating：Palladium Laden via Bonding with Self—Assembly Monolayers

A new activation method has been developed for electroless copper plating on silicon wafer based on palladium chemisorption on SAMs of APTS without SnCl2 sensitization and roughening condition.A closely packed electroless copper film with strong adhesion is successfully formed by AFM observation.XPS study indicates that palladium chemisorption occurred via palladium chloride bonding to the pendant amino group of the SAMs.     

Electroless plating of copper on fly ash cenospheres using polyaniline‐Pd activation

The polyaniline of different intrinsic oxidation states, viz., the emeraldine (EM) and the leucoemeraldine (LM) states, were coated on 3‐aminopropyltriethoxy silane modified fly ash cenospheres. Without prior sensitization by SnCl₂ solution, Pd activation by PdCl₂ solution was carried out on EM and LM laden cenospheres, followed by electroless plating of copper (Cu). The topography and composition of the composites were characterized by scanning electron microscopy, X‐ray diffraction, and X‐ray photoelectron spectroscopy, etc. The results indicate that the oxidation state of the LM layer showed a much bigger increase than that of the EM layer in the Pd activation process, while coupled Pd reduction underwent to a more extent on the LM layer. The metallic Pd atoms on the LM and EM layers surface initiated the subsequent electroless plating of Cu, and the coated Cu on LM laden cenospheres had a much more uniform and compact morphology than that on EM laden cenospheres. Copyright © 2012 John Wiley & Sons, Ltd.