氢气泡模板法电沉积制备三维多孔铜薄膜

应用阴极析氢气泡模板法电沉积制备三维多孔铜薄膜,基础电解液组成为0.2 mol.dm-3CuSO4和1.5 mol.dm-3H2SO4.研究了电流密度(0.5~8.0 A.cm-2)、温度(20~70℃)、支持电解质(Na2SO4)以及添加剂HC l和聚乙二醇(PEG)等对薄膜的孔径大小和孔壁结构的影响.扫描电子显微镜(SEM)分析表明,降低镀液温度和添加Na2SO4、PEG都可降低孔径的大小,但对孔壁结构无影响.加入微量的氯离子可显著改变薄膜的孔壁结构,得到孔壁结构较为致密的三维多孔铜电极.循环伏安(CV)测试结果显示三维多孔铜薄膜电极在碱性条件下电氧化甲醇的电流密度比光滑铜电极提高了近20倍.     

氢气泡模板电沉积多孔金属镍薄膜

Porous nickel films have been successfully electrodeposited using cathodic hydrogen bubbles as a template. The influence of deposition parameters including concentration, temperature and current density on the films morphologies has been systematically studied. SEM results showed that increase in current density resulted in the deposits with higher pore density and smaller pore size. Both the pore size and thickness of the pore walls increased with the electrolyte temperature range from 20 to 60 ℃ when the other deposition parameters were fixed. Increasing the concentration of NiCl₂ or NH₄Cl in the electrolyte led to the thicker of the pore walls and declined pore size and density. The deposits displayed a dendritic morphology in cross-sectional SEM image. Electrochemical characterization of the porous nickel films after surface oxidation in 1.0 mol·L^-1 NaOH solution showed that specific capacitance as high as 7.2 F·g^-1 could be reached.