Reveal the large open-circuit voltage deficit of all-inorganicCsPbIBr2 perovskite solar cells

Due to excellent thermal stability and optoelectronic properties, all-inorganic perovskite is one of the promising candidates to solve the thermal decomposition problem of conventional organic—inorganic hybrid perovskite solar cells (PSCs), but the larger voltage loss (V_loss) cannot be ignored, especially CsPbIBr₂, which limits the improvement of efficiency. To reduce V_loss, one promising solution is the modification of the energy level alignment between the perovskite layer and adjacent charge transport layer (CTL), which can facilitate charge extraction and reduce carrier recombination rate at the perovskite/CTL interface. Therefore, the key issues of minimum V_loss and high efficiency of CsPbIBr₂-based PSCs were studied in terms of the perovskite layer thickness, the effects of band offset of the CTL/perovskite layer, the doping concentration of the CTL, and the electrode work function in this study based on device simulations. The open-circuit voltage (V_oc) is increased from 1.37 V to 1.52 V by replacing SnO₂ with ZnO as the electron transport layer (ETL) due to more matching conduction band with the CsPbIBr₂ layer.     

Effects of electrical stress on the characteristics and defect behaviors in GaN-based near-ultraviolet light emitting diodes

The degradation mechanism of GaN-based near-ultraviolet (NUV, 320-400 nm) light emitting diodes (LEDs) with low-indium content under electrical stress is studied from the aspect of defects. A decrease in the optical power and an increase in the leakage current are observed after electrical stress. The defect behaviors are characterized using deep level transient spectroscopy (DLTS) measurement under different filling pulse widths. After stress, the concentration of defects with the energy level of 0.47-0.56 eV increases, accompanied by decrease in the concentration of 0.72-0.84 eV defects. Combing the defect energy level with the increased yellow luminescence in photoluminescence spectra, the device degradation can be attributed to the activation of the gallium vacancy and oxygen related complex defect along dislocation, which was previously passivated with hydrogen. This study reveals the evolution process of defects under electrical stress and their spatial location, laying a foundation for manufacture of GaN-based NUV LEDs with high reliability.     

Al2O3绝缘层的AlGaN/GaN MOSHEMT器件研究

在研制AlGaN/GaN HEMT器件的基础上,采用ALD法制备了Al₂O₃ AlGaN/GaN MOSHEMT器件.通过X射线光电子能谱测试表明在AlGaN/GaN异质结材料上成功淀积了Al₂O₃薄膜.根据对HEMT和MOSHEMT器件肖特基电容、器件输出以及转移特性的测试进行分析发现：所制备的Al₂O₃薄膜与AlGaN外延层间界面态密度较小,因而MOSHEMT器件呈现出较 关键词： 2O₃')" href="#">Al₂O₃ ALD GaN MOSHEMT     

AlGaN/GaN高电子迁移率晶体管肖特基高温退火机理研究

在不同应力条件下,研究了AlGaN/GaN高电子迁移率晶体管高温退火前后的电流崩塌、栅泄漏电流以及击穿电压的变化.结果表明,AlGaN/GaN高电子迁移率晶体管通过肖特基高温退火以后,器件的特性得到很大的改善.利用电镜扫描(SEM)和X射线光电子能谱(XPS)对高温退火前、后的肖特基接触界面进行深入分析,发现器件经过高温退火后,Ni和AlGaN层之间介质的去除,并且AlGaN材料表面附近的陷阱减少,使得肖特基有效势垒提高,从而提高器件的电学特性. 关键词： AlGaN/GaN高电子迁移率晶体管 肖特基接触 界面陷阱     

Characteristics in AlN/AlGaN/GaN Multilayer-Structured High-Electron-Mobility Transistors

A new multilayer-structured AlN/AlCaN/CaN heterostructure high-electron-mobility transistor （HEMT） is demonstrated. The AIN/AlCaN/CaN HEMT exhibits the maximum drain current density of 800mA/mm and the maximum extrinsic transconductance of 170 mS/mm. Due to the increase of the distance between the gate and the two-dimensional electron-gas channel, the threshold voltage shifts slightly to the negative. The reduced drain current collapse and higher breakdown voltage are observed on this AIN/AlGaN/CaN HEMT. The current gain cut-off frequency and the maximum frequency of oscillation are 18.5 CHz and 29.0 GHz, respectively.     

Growth and Characterization of the Laterally Enlarged Single Crystal Diamond Grown by Microwave Plasma Chemical Vapor Deposition

Laterally enlarged single crystal diamond is grown on(001) diamond substrates by microwave plasma chemical vapor deposition. Based on the largest side-to-side width of the seed of 7.5 mm, we achieve the as-grown epilayer with the width of about 10 mm between the same two sides. The luminescence difference between the broadened part of the single crystal diamond and the vertically epitaxial part is investigated by characterizing the vertical cross section of the sample, and the possible growth mechanism is suggested. Vertical epitaxy on the top(001)surface and lateral growth on the side surfaces occur simultaneously, and thus the growth fronts along the two directions adjoin and form a coalescence zone extending from the edge of the substrate towards the edge of the expanded single crystal diamond top surface. The luminescence intensity of the nitrogen-vacancy center is relatively high in the coalescence zone and a laterally grown part right below, which are attributed mainly to the higher growth rate. However, stress change and crystal quality change are negligible near the coalescence zone.     

高跨导氢终端多晶金刚石长沟道场效应晶体管特性研究

基于多晶金刚石制作了栅长为4 pm的铝栅氢终端金刚石场效应晶体管.器件的饱和漏源电流为160 mA/mm,导通电阻低达37.85Ω·mm,最大跨导达到32 mS/mm,且跨导高于最大值的90%的栅压(V_(GS))范围达到3 V(-2 V≤V_(GS)≤-5 V).通过传输线电阻分析以及器件的导通电阻和电容-电压特性分析,发现氢终端多晶金刚石栅下沟道中的空穴面浓度达到了1.56×10~(13)cm~(-2),有效迁移率在前述高跨导栅压范围保持在约170 cm~2/(V·s).分析认为,较低的栅源和栅漏串联电阻、沟道中高密度的载流子和在大范围栅压内的高水平迁移率是引起高而宽阔的跨导峰和低导通电阻的原因.