Enhanced Total Ionizing Dose Hardness of Deep Sub-Micron Partially Depleted Silicon-on-Insulator n-Type Metal-Oxide-Semiconductor Field Effect Transistors by Applying Larger Back-Gate Voltage Stress

Owing to the fifll isolation and minimization of the silicon active volume, silicon-on-insulator （SOI） tech- nology has better resistance against transient ionizing effects like single event effects （SEE） or latch up.However, the total ionizing dose （TID） irradiation responses of SOI transistors are more complex than bulk-silicon devices. In addition to the gate and par- asitic field leakage current, which are common to SOI and bulk-silicon devices, irradiation induced charges trapped in the SOI buried oxide （BOX） can also affect SOI device performance. Typically, there is a par- asitic edge transistor in the back-gate of SOI devices paralleled with the main transistor, which is formed by the corner region of the silicon island. Due to the high electric field induced by the back-gate voltage at the corner of the silicon island, the threshold of the parasitic edge transistor is lower than the main transistor, resulting in a sub-threshold hump in the transfer characteristic of the back-gate transistor. Even though the threshold of the parasitic edge tran- sistor is lower than the main transistor, it is still larger than zero, which has no effect on the front- gate of devices. However, the sub-threshold hump in the back-gate is the ＇Achilles heel＇ for total dose responses of deep sub-micron SOI n-type metal-oxide- semiconductor field-effect transistors （MOSFETs） iso- lated by shallow trench isolation （STI）. As reported in Refs., the threshold of the parasitic edge transis- tor is negative shifted by radiation-induced charges trapped in STI, leading to off-state leakage in the front-gate of devices.     

Physical design of FEL injector based on the performance-enhanced EC-ITC RF gun

To meet the requirements of high performance THz-FEL (Free Electron Laser), a compact scheme of FEL injector was proposed. A thermionic cathode was chosen to emit electrons instead of a photo-cathode with its complex structure and high cost. The effective bunch charge was improved to ～200 pC by adopting an enhanced EC-ITC (External Cathode Independently Tunable Cells) RF gun to extract micro-bunches; back bombardment effects were almost eliminated as well. Constant gradient accelerator structures were designed to improve energy to ～14 MeV, while the focusing system was applied for emittance suppressing and bunch state maintenance. The physical design and beam dynamics of the key components for the FEL injector were analyzed. Furthermore, start-to-end simulations with multi-pulses were performed using homemade MATLAB and Parmela. The results show that continual high brightness electron bunches with a low energy spread and emittance could be obtained stably.     

p型CuInS2花状微球的液相可控合成及其电学性能表征

以十六烷基三甲基溴化铵(CTAB)为表面活性剂,在乙二醇(EG)中进行溶剂热反应,成功合成了四方晶系CuInS2花状微球。利用扫描电子显微镜(SEM)、X射线衍射(XRD)、光电子能谱(XPS)以及紫外-可见吸收光谱等表征其形貌、结构及成分,并构建了基于其的底栅型场效应器件(Back-gate FET)。实验结果表明:p型CuInS2微球所需合成温度为200℃,禁带宽度为1.62eV,电导率约为2S·cm-1。CuInS2微球有望用于低耗、高效CuInS2基光伏器件的制备。     

基于酞菁钯和C60的异质结有机光敏场效应管

采用酞菁钯(PdPc)和C60两种有机半导体材料,通过真空热蒸镀法以不同的沉积顺序制备了两种不同结构的平面异质结有机光敏场效应管,并对这两种结构器件的光敏特性进行比较。在波长655 nm、光强100mW/cm2的光照条件下,结构为n+-Si/SiO2/PdPc/C60/Al(S&D)(PdPc/C60-OFET)器件的最大光暗比为2×103,光响应度为3 mA/W;而结构为n+-Si/SiO2/C60/PdPc/Al(S&D)(C60/PdPc-OFET)器件的最大光暗比为3×103,光响应度为11mA/W。实验结果表明C60/PdPc-OFET可以获得更好的光敏特性。     

Field-effect transistors based on two-dimensional materials for logic applications

Field-effect transistors （FETs） for logic applications, graphene and MoS2, are discussed. These materials have based on two representative two-dimensional （2D） materials, drastically different properties and require different consider- ations. The unique band structure of graphene necessitates engineering of the Dirac point, including the opening of the bandgap, the doping and the interface, before the graphene can be used in logic applications. On the other hand, MoS2 is a semiconductor, and its electron transport depends heavily on the surface properties, the number of layers, and the carrier density. Finally, we discuss the prospects for the future developments in 2D material transistors.     

A New Interlock Design for the TESLA RF System

The RF system for TESLA requires a comprehensive interlock system.Usually interlock systems are organized in a hierarchical way,In order to react to different fault conditions in a fast and flexible manner a nonhierarchical organization seems to be the better solution ,At the TESLA Test Facility (TTF) at DESY we will install a nonhierarchical interlock system that is based on user desgned reprogrammable gate-arrays (FPGA‘s) which incorporate an embedded microcontroller system.This system could beused later for the TESLA linear collider replacing a strictly hierarchical design.     

RF SET 超灵敏静电计

单电子晶体管(SET)作为灵敏静电计的灵敏度受到噪声的限制，其中散粒噪声(shot noise)是本征噪声，决定着单电子晶体管灵敏度的极限．利用射频(radio frequency，RF)单电子晶体管的极高的工作频率，可以消除SET的1／f噪声，从而达到极限灵敏度．利用一级低温低噪声放大器和一级室温放大器放大工作在反射模式的射频单电子晶体管的输出信号，使用LC共振电路，抬高了SET右边的整个微波系统的阻抗，使之与单电子的输出阻抗匹配，从而提高了RFSET静电计的灵敏度．     

RF磁控溅射条件对ZnO薄膜结构的影响

采用RF磁控溅射法在Si（001）衬底上制备ZnO薄膜。研究发现了工作中溅射频率、氧气和氩气流量比对样品结构的影响。样品的XRD图谱显示了强的（002）ZnO衍射峰，表明ZnO薄膜为c轴高取向生长。比较不同条件下制备的ZnO薄膜，研究发现当氧气和氩气的流量比相同时，随着溅射功率的增加，样品的（002）衍射峰增强，半高全宽变小。而当溅射功率相同时，随着氧气和氩气的流量比增加，样品的（002）衍射峰也增强，半高全宽同样变小。此外，本文还分析了溅射工艺和薄膜晶体质量之间关系，发现在相同的功率条件下，溅射率低时晶粒尺寸更大且薄膜的结晶性更好。     

免疫吸附剂吸附类风湿因子（RF）

以聚乙烯醇水凝胶为载体，氨基酸为选择性配基，制备亲合性免疫吸附剂，用于清除类风湿性关节炎患者体内的类风湿因子（ＲＦ），实验中对水凝胶载体交联度、选择性配基种类、手臂效应等与吸附及选择性能的关系进行了研究。实验数据表明：当水凝胶交联度为４０％时，联接Ｌ－丝氨酸对ＲＦ具有最好的吸附选择性能。对患者血浆中ＲＦ－ＩｇＭ、ＲＦ－ＩｇＧ、ＲＦ－ＩＧＡ的吸附率分别达到６２．８％、４７．２％、和６０．０％，而对血浆蛋白无吸附。