Bergman－Weil积分公式的拓广

本文把Ｃｎ空间中著名的Ｂｅｒｇｍａｎ－Ｗｅｉｌ公式拓广到一类具有低维解析待征流形的微分多面体域上，从而获得在一类非解析的多面体域上建立具有全纯核的全纯函数的积分表示式．     

中心流形理论在广义Maxwell—Bloch激光方程中的应用

在好腔近似下，应用中心流形理论约化广义Ｍａｘｗｅｌｌ－Ｂｌｏｃｈ激光方程，与绝热消去法比较，它将引起小的修正，数值结果表明，该修正并不发迹系统的主要动力学性质。     

解三维抛物型微分方程的一族高精度显式差分格式

对求解三维抛物型微分方程利用待定参数法构造出截断误差为Ｏ（Δｔ２＋Δｘ４＋Δｙ４＋Δｚ４）的一族高精度的三层显式差分格式，并讨论了其稳定性．     

一类带拓广的Bochner-Martinelli核的高阶奇异积分的Hadamard主值

首先定义Cn中闭光滑可定向流形上一个带有拓广的Bochner-Martinelli核的高阶Cauchy型积分φ(z),然后利用分部积分和Stokes公式,给出这个奇性为2n阶的高阶奇异积分φ(t)的Hadamard主值,接着通过球面坐标变换等方法证明了一些引理,由此获得了φ(z)在Hadamard主值意义下的Plemelj公式.     

关于Finsler几何中的Hadmard定理

本文利用陈省身最近在Ｆｉｎｓｌｅｒ几何中引进的一特殊仿射联络，把Ｒｉｅｍａｎｎ几种中关于非正曲率流形的Ｈａｄａｍａｒｄ定理推广到Ｆｉｎｓｌｅｒ几何中。     

对合的分解

Using the notion of biconnected sum we define the biconnected sum (T₁, M₁)§(T₂,M₂) of two involutions (T1M1) and (T2,M2) which is an involution on the biconnected sum M₁,§M₂. A connected involution is said to be reducible if it can be expressed as a biconnected sum of two connected involutions.Theorem Each connected involution (T, M) can be decomposed into a bi-connected sum of connected irreducible involutions (T, M)=(T₁, M₁)§…§(T_q,M_q),and (?) where the coefficients of H_{n_1}(M) are in Z/2 Z if M is unoriented, in Z if is oriented .     

线性流形上矩阵方程BTXB=F的双对称最小二乘解

1引言令R~(n×m)、OR~(n×n)、SR~(n×n)(SR_0~(n×n))分别表示所有n×m阶实矩阵、n阶实正交阵、n阶实对称矩阵(实对称半正定阵)的全体,A~ 表示A的Moore-Penrose广义逆,I_k表示k阶单位矩阵,S_k表示k阶反序单位矩阵。R(A)表示A的列空间,N(A)表示A的零空间,rank(A)表示矩阵A的秩。对A=(a_(ij)),B=(b_(ij))∈R~(n×m),A*B表示A与     

Self-Assembly of Micro-Parts onto Si Substrates at Liquid-Liquid Interface

We report a new approach for the self-assembly of cuboid micro-parts onto Si substrates to construct three-dimensional microstructures. To perform assembly, the Si substrates are prepared with a deep cavity array as binding sites. An aggregate composed of hundreds of uniformly aligned micro-parts is formed at the C10F18-H2O interface. The micro-parts are arranged by passing the substrate through the aggregate of micro-parts, thus the micro-parts are left on the substrate, and then the substrate is vibrated ultrasonically in the solution, making it possible for the micro-parts to fall into the cavities on the substrate. Finally the substrate is pulled out of the solution after assembly. This technique could give a high yield of up to 70%, providing a new method for micro-assembly.