ZnO薄膜的制备和结构特性及应变

在SiO₂/Si衬底上面,利用射频磁控溅射方法,在不同的工艺条件下生长ZnO薄膜,然后进行热处理(600～1000℃退火).研究了氩氧比和退火温度对薄膜结晶性能的影响.薄膜的表面结构和晶体特性通过扫描电子显微镜(SEM)、X射线衍射(XRD)来进行表征.结果表明:所制备的薄膜为多晶纤锌矿结构,具有垂直于衬底的c轴(002)方向的择优取向性.热处理可使ZnO(002)衍射峰相对强度增强,半峰全宽(FWHM)变小,即退火使c轴生长的薄膜取向性增强.未经退火的ZnO薄膜存在张应力,经过热处理后应力发生改变,最后变成压应力,并且随着退火温度的升高,压应力逐渐增大.     

Influence of thermal annealing on the composition and structural parameters of DC magnetron sputtered titanium dioxide thin films

Titanium dioxide films have been deposited using DC magnetron sputtering technique. Films were deposited onto RCA cleaned p‐silicon substrates at the ambient temperature at an oxygen partial pressure of 7 × 10^–5 mbar and sputtering pressure of 1 × 10 ^–3 mbar. The deposited films were annealed in the temperature range 673–873 K. The structure and composition of the films were confirmed using X‐ray diffraction and Auger electron spectroscopy. The structure of the films deposited at the ambient was found to be amorphous and the films annealed at 673 K and above were crystalline with anatase structure. The lattice constants, grain size, microstrain and the dislocation density of the film are calculated and correlated with annealing temperature.     

磁控溅射气体团簇源中团簇形成的DSMC研究

利用直接模拟蒙特卡洛方法(DSMC) ,模拟了磁控溅射气体团簇源中Cu+ (Cu-)的含量比例不同的条件下,Cu团簇的尺寸分布。模拟结果表明：随着含量比例的增加,团簇的尺寸分布变窄了,不带电的团簇的比例增加,不带电的铜团簇分布的最大值减小,相应的带正电荷和带负电荷团簇的比例减小;相同的含量比例下,带正电的团簇的尺寸分布与带负电荷的团簇的尺寸分布基本相同;初始Cu- 比Cu+ 的含量比例大时,输出的主要是带负电荷的团簇,带正电荷和不带电的团簇占很小的比例;Cu-含量比例的增加,负Cu团簇的尺寸分布减小。