Effect of Hyperbranched Polyester on Modification of Epoxy Resins Cured with Anhydride

Epoxy resins are widely used in coatings, adhesives and polymer composites, but the applications of cured epoxy resins are often restricted by their poor toughness. HBP can be used as toughener to improve the toughness of epoxy resins due to its high-dens…     

Synthesis and properties of novel fluorinated epoxy resins based on 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane

A novel fluorinated epoxy resin, 1,1-bis(4-glycidylesterphenyl)-1-(3′-trifluoromethylphenyl)-2,2,2-trifluoroethane (BGTF), was synthesized through a four-step procedure, which was then cured with hexahydro-4-methylphthalic anhydride (HMPA) and 4,4′-diaminodiphenyl-methane (DDM). As comparison, a commercial available epoxy resin, bisphenol A diglycidyl ether (BADGE), cured with the same curing agents was also investigated. We found that the BGTF gave the exothermic starting temperature lower than BADGE no mater what kind of curing agents applied, implying the reactivity of the former is higher than the latter. The fully cured fluorinated BGTF epoxy resins have good thermal stability with glass transition temperature of 170-175 °C and thermal decomposition temperature at 5% weight loss of 370-382 °C in nitrogen. The fluorinated BGTF epoxy resins also showed the mechanical properties as good as the commercial BADGE epoxy resins. The cured BGTF epoxy resins exhibited improved dielectric properties as compared with the BADGE epoxy resins with the dielectric constants and the dissipation factors lower than 3.3 and dissipation 2.8 × 10⁻³, respectively, which is related to the low polarizability of the C-F bond and the large free volume of CF₃ groups in the polymer. The BGTF epoxy resins also gave low water absorption because of the existence of hydrophobic fluorine atom.     

STUDY ON THE EPOXY RESIN TOUGHENED BY HYDROXY-TERMINATED BUTADIENE-ACRYLONITRILE COPOLYMER

Toughened epoxy resin with excellent properties was obtained by adding organic acid anhydride curing agent and hydroxy-terminated butadiene-acrylonitrile copolymer (HTBN), which is cheaper than CTBN. The anhydride reacts with both epoxy groups on epoxy resin and hydroxyl groups on HTBN. As a result the soft long chains of HTBN and the rigid chain of epoxy resin form one network, giving the resin toughness. Two-phase structure of the toughened resin was observed by SEM and TEM.     

丁腈羟增韧环氧树脂形态与力学性能

研究了丁腈羟增韧环氧树脂的力学性能和形态结构，丁腈羟的用量、丁腈羟中丙烯腈的含量、固化条件对所形成的微区尺寸都有较大影响，并进一步影响固化物的力学性能。     

The mechanical properties and tribological behavior of epoxy resin composites modified by different shape nanofillers

Mechanical properties and tribological behavior of epoxy resin (EP) and EP nanocomposites containing different shape nanofillers, such as spherical silica (SiO₂), layered organo‐modified montmorillonite (oMMT) and oMMT‐SiO₂ composites, were investigated. The SiO₂‐oMMT composites were prepared by in situ deposition method and coupling agent modification, and transmission electron microscopy (TEM) analysis shows that spherical SiO₂ is self‐assembled on the surface of oMMT, which forms a novel layered‐spherical nanostructure. The mechanical properties test results show that oMMT obviously improves the strength of EP and SiO₂ enhances its toughness, but oMMT‐SiO₂ exhibits a synergistic effect on toughening and reinforcing EP simultaneously. A pin‐on‐disc rig was used to test friction and wear loss of pure EP and EP nanocomposites. The tribological test results prove that these nanofillers with different shapes play different roles for improving the wear resistance of EP nanocomposites. Morphologies of the worn surfaces were studied further by scanning electron microscopy (SEM) observations, and it was clarified that the EP and EP nanocomposites undergo similar wear mechanisms. Copyright © 2006 John Wiley & Sons, Ltd.     

A phosphate-based epoxy resin for flame retardance: synthesis, characterization, and cure properties

A phosphorus-containing oligomer, bis(3-hydroxyphenyl) phenyl phosphate (BHPP), was synthesized through the reaction of phenyl dichlorophosphate and 1,3-dihydroxybenzene, and characterized by elemental analysis, Fourier transform IR spectroscopy, and ¹H NMR and ³¹P NMR spectroscopy. Consequently, the phosphate-based epoxy resins with a phosphorus content of 1 and 2 wt % were prepared via the reaction of diglycidyl ether of bisphenol-A with BHPP and bisphenol-A, and were confirmed with Fourier transform IR spectroscopy and gel permeation chromatography. Phenolic melamine, Novolak, and dicyanodiamide were used as curing agents to prepare the thermoset resins with the control and the phosphate-based epoxy resins. Thermal properties and thermal degradation behavior of these thermoset resins were investigated by using differential scanning calorimetry and thermogravimetric analysis. The thermoset resins cured with phenolic melamine exhibited higher glass-transition temperatures than the other cured resins owing to the high rigidity of their molecular chain. Thermogravimetric analysis studies demonstrated that the decomposition temperatures of the thermoset resins cured with Novolak were higher than those of the others. A synergistic effect from the combination of the phosphate-based epoxy resin and the nitrogen-containing curing agent can result in a great improvement of the flame retardance for their thermoset resins.     

Thermokinetic analysis of two-step curing reactions in melt: Part I. Investigation of low molecular model systems

Kinetic investigations of thermo-controlled two-step reactions between an uretdione cross-linker and OH-groups are undertaken. Non-isothermal DSC measurements are chosen for the determination of the kinetic parameters (E, A, n) using of THERMOKINETICS software. The system can be described very accurately with a four-step kinetic model of consecutive reactions. On the basis of the kinetic model and parameters the realization of the first reaction step, which is the formation of the allophanate network is simulated. Finally, the result of the calculated progress of the reaction is evaluated by FT-IR and isothermal DSC measurements.     

腰果酚的紫外光固化机理和固化膜性能

研究了腰果酚在无光引发剂条件下的紫外光固化反应,并用IR、UV、元素分析、GPC等分析手段分析了腰果酚的紫外光固化机理及其固化膜性能。结果表明:在紫外光辐照下,腰果酚通过侧链发生氧化聚合反应,和酚羟基的邻对位失去质子形成的自由基引起的苯环缩合反应,最终形成体型高聚物。腰果酚的紫外光固化膜的常规物理机械性能、抗溶剂性、耐化学介质腐蚀性、热稳定性和抗紫外线性能均优于腰果酚醛缩聚物(PC)涂膜。     

Enhanced thermal properties and flame retardancy from a thermosetting blend of a phosphorus‐containing bismaleimide and epoxy resins

Epoxy resins modified by an organosoluble phosphorus‐containing bismaleimide (3,3′‐bis(maleimidophenyl) ­phenylphosphine oxide; BMPPPO) were prepared by simultaneously curing epoxy/diaminodiphenylmethane (DDM), and BMPPPO. The resulted epoxy resins were found to exhibit glass transition temperatures as high as 212 °C, thermal stability at temperatures over 350 °C, and excellent flame retardancy with Limited oxygen index (LOI) values around 40. Incorporation of BMPPPO into epoxy resins via the thermosetting blend was demonstrated to be an effective way to enhance the thermal properties and flame retardancy simultaneously. Copyright © 2003 John Wiley & Sons, Ltd.     

Low dielectric thermoset. II. Synthesis and properties of novel 2,6‐dimethyl phenol–dipentene epoxy

A 2,6‐dimethyl phenol–dipentene adduct was synthesized from dipentene (DP) and 2,6‐dimethyl phenol, and then a 2,6‐dimethyl phenol–DP epoxy was synthesized from the reaction of the resultant 2,6‐dimethyl phenol–DP adduct and epichlorohydrin. The proposed structures were confirmed by Fourier transform infrared, elemental analysis, mass spectra, NMR spectra, and epoxy equivalent weight titration. The synthesized 2,6‐dimethyl phenol–DP adduct was cured with 4,4‐diamino diphenyl methane, phenol novolac, 4,4‐diamino diphenyl sulfone, and 4,4‐diamino diphenyl ether. The thermal properties of the cured epoxy resins were studied with differential scanning calorimetry, dynamic mechanical analysis, dielectric analysis, and thermogravimetric analysis. These data were compared with those for the bisphenol A epoxy system. The cured 2,6‐dimethyl phenol–DP epoxy exhibited a lower dielectric constant (ca. 3.1), a lower dissipation factor (ca. 0.065), a lower modulus, lower thermal stability (5% degradation temperature = 366–424 °C), and lower moisture absorption (1.21–2.18%) than the bisphenol A system but a higher glass‐transition temperature (ca. 173–222 °C) than that of bisphenol A system. © 2002 Wiley Periodicals, Inc. J Polym Sci Part A: Polym Chem 40: 4084–4097, 2002