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11.
吴海波  薛兴亚  李奎永  周永正 《色谱》2018,36(10):972-978
为制备孔径为100 nm的大孔硅胶,考察了热液法和焙烧法对球形硅胶(粒径5 μm,孔径10 nm)的扩孔效果。采用热液法扩孔时,在水溶液中加入22 g/L氟化钠,可以有效增强扩孔效果,在高压釜内160℃加热48 h便可扩孔至100 nm,但孔径不均匀。采用焙烧法扩孔时,通过调节焙烧温度、时间以及复盐LiCl-NaCl的加入量可以方便地控制扩孔速度与效果;在每10 g硅胶中加入1.125 g LiCl·H2O和0.75 g NaCl,于500℃焙烧3~5 h,可得到100 nm大孔硅胶;该方法简单、高效,扩孔后的硅胶孔径分布均匀,表面形态与商品化的Fuji-1000硅胶相似。将两种扩孔方式得到的硅胶经氨基修饰后,涂覆纤维素-三(3,5-二甲基苯基氨基甲酸酯)制得了相应的手性固定相。结果表明,采用焙烧法扩孔得到的硅胶制备的固定相明显具有较好的分离选择性及分离度。  相似文献   
12.
Starch gelatinization in wheat flour dough of various moisture contents was quantitatively evaluated by means of DSC. The experimental records were worked out in the form of excess heat capacity vs. T traces which were deconvoluted to single out the contribution of starch gelatinization from that of the decomposition of amylose-lipid complexes. The quantitative procedure used put into evidence that a third endothermic process would take place in the dough with a poor moisture content. DSC runs carried out with sealed pans (i.e., at constant moisture level) and open pans (from which some water was free to evaporate) allow simulation of two extreme conditions of a real baking process, namely that relevant to the central core and to superficial layer of a dough loaf, respectively. The extent of starch gelatinization occurred in these conditions was quantitatively assessed. These data were collected at various heating rates and used to define temperature-time-transformation(TTT) diagrams which are useful tools to predict the progress of baking for any given thermal history of the system. This revised version was published online in July 2006 with corrections to the Cover Date.  相似文献   
13.
This research aimed to study the effects of using a partial vacuum for bread baking on macromolecules and water distribution in gluten-free bread. Bread baking under partial vacuum results in greater oven rise and a larger gas fraction in the crumb. Because water's boiling point decreases under reduced pressure, it was expected that its distribution within the dough and its interactions with the others dough's constituents (mainly starch) would differ from those in bread baked under atmospheric pressure. Time-domain nuclear magnetic resonance was used, as it has the rare capacity to quantify both gelatinization and retrogradation of starch. Complementary rheological measurements made it possible to show that crumb Young's modulus was mostly influenced by the gas fraction whereas there was little change in starch gelatinization and retrogradation when dough was baked under partial vacuum. When insufficiently hydrated (48%), the volume of breads was practically the same whatever the baking process. Meanwhile, the nuclear magnetic resonance results suggested that amylose short-term crystallization (on cooling) is dependent on water content. In addition, crumb Young's modulus during storage at room temperature correlated with an increase in free induction decay signal intensity.  相似文献   
14.
Dried and crushed dandelion roots (Taraxacum officinale F. H. Wigg.) (TO) were used as a formulation additive (at the amount of 0, 1, 3, 4, 5, and 6 g 100 g−1 flour) to wheat bread. The farinographic properties of the dough and the physical and chemical properties of the bread were evaluated. It was found that the addition of dried flour caused a significant decrease in water absorption by the flour (1% and higher TO level), an increase in the development time (from 2% to 5% TO addition) and dough stability (3% and 4% TO level), and an increase in dough softening (4% and higher TO level). As the substitution of TO for wheat flour increased, there was a gradual decrease in loaf volume, an increase in specific weight and crumb hardness, and a darkening of the crumb color. The total polyphenol content increased linearly with the percentage increase of dried root additions TO from 0.290 to 0.394 mg GAE g−1 d.m., which translated into an increase in the antioxidant activity of the bread. It was found that dried crushed roots of Taraxacum officinale can be a recipe additive for wheat bread; however, due to their specific smell and bitter aftertaste, the level of this additive should not exceed 3 g 100 g−1 flour.  相似文献   
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